Cited in | Search | Type: | Patent literature | Publication No.: | DE4115321
[T] (HITACHI MAXELL [JP], et al) [T] 1-7* list of bulk thermal conductivities of metal, and some oxides, nitrides, sulfides and carbides; page 9 *; | Type: | Patent literature | Publication No.: | US2003137921
[A] (HIGUCHI TAKANOBU [JP]) [A] 1-7 * AlNx as thermal conduction material; too thick (approx. 50 nm); paragraphs [0025] , [0032]; figure 1C *; | Type: | Patent literature | Publication No.: | JP2003308633
[A] (HITACHI MAXELL) [A] 1-7 * only thickness of Al-Ti heat sink layer is too thick (50 nm); paragraph [0014] - paragraph [0015]; figure 1; example 1 * |