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EP Citations: EP1873771

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Type:Patent literature
Publication No.:DE4115321  [T]
 (HITACHI MAXELL [JP], et al) [T] 1-7* list of bulk thermal conductivities of metal, and some oxides, nitrides, sulfides and carbides; page 9 *;
Type:Patent literature
Publication No.:US2003137921  [A]
 (HIGUCHI TAKANOBU [JP]) [A] 1-7 * AlNx as thermal conduction material; too thick (approx. 50 nm); paragraphs [0025] , [0032]; figure 1C *;
Type:Patent literature
Publication No.:JP2003308633  [A]
 (HITACHI MAXELL) [A] 1-7 * only thickness of Al-Ti heat sink layer is too thick (50 nm); paragraph [0014] - paragraph [0015]; figure 1; example 1 *