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Extract from the Register of European Patents

EP About this file: EP2813132

EP2813132 - MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL CIRCUIT COMPONENTS WITHIN A THREE DIMENSIONAL MODULE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  15.02.2019
Database last updated on 25.09.2024
FormerThe patent has been granted
Status updated on  09.03.2018
FormerGrant of patent is intended
Status updated on  20.02.2018
FormerRequest for examination was made
Status updated on  23.01.2018
FormerGrant of patent is intended
Status updated on  22.10.2017
Most recent event   Tooltip01.07.2022Lapse of the patent in a contracting state
New state(s): MK
published on 03.08.2022  [2022/31]
Applicant(s)For all designated states
Crane Electronics, Inc.
10201 Willows Road
Redmond, Washington 98052 / US
[2014/51]
Inventor(s)01 / PARKER, Ernest, Clyde
2325 140th Place Southeast
Mill Creek, Washington 98012 / US
02 / LAURIELLO, Philip, Joseph
7 Brookview Court
Holmdel, New Jersey 07733 / US
 [2014/51]
Representative(s)Hanna Moore + Curley
Garryard House
25-26 Earlsfort Terrace
Dublin 2, D02 PX51 / IE
[N/P]
Former [2018/15]Hanna Moore + Curley
Garryard House
25/26 Earlsfort Terrace
Dublin 2, D02 PX51 / IE
Former [2014/51]Moore, Barry, et al
Hanna Moore & Curley
13 Lower Lad Lane
Dublin 2 / IE
Application number, filing date13746884.906.02.2013
[2018/15]
WO2013US24907
Priority number, dateUS201261596652P08.02.2012         Original published format: US 201261596652 P
US20131375854304.02.2013         Original published format: US201313758543
[2014/51]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2013119643
Date:15.08.2013
Language:EN
[2013/33]
Type: A1 Application with search report 
No.:EP2813132
Date:17.12.2014
Language:EN
The application published by WIPO in one of the EPO official languages on 15.08.2013 takes the place of the publication of the European patent application.
[2014/51]
Type: B1 Patent specification 
No.:EP2813132
Date:11.04.2018
Language:EN
[2018/15]
Search report(s)International search report - published on:KR15.08.2013
(Supplementary) European search report - dispatched on:EP04.12.2015
ClassificationIPC:H05K3/46, H05K1/18, H01L23/12
[2014/51]
CPC:
H05K1/186 (EP); H01L23/49827 (EP); H05K3/4688 (EP);
H01L2224/24 (EP); H01L2224/29239 (EP); H01L2224/32225 (EP);
H01L2224/33181 (EP); H01L2224/8384 (EP); H01L2924/13091 (EP);
H05K2201/015 (EP); H05K2201/10166 (EP); H05K2203/068 (EP);
H05K2203/1178 (EP); H05K2203/167 (EP); H05K3/4046 (EP);
H05K3/4632 (EP); H05K3/4638 (EP) (-)
C-Set:
H01L2924/13091, H01L2924/00 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2014/51]
Extension statesBANot yet paid
MENot yet paid
TitleGerman:MEHRSCHICHTIGE ELEKTRONISCHE ANORDNUNG UND VERFAHREN ZUM EINBETTEN VON ELEKTRISCHEN SCHALTELEMENTEN IN EINEM DREIDIMENSIONALEN MODUL[2014/51]
English:MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL CIRCUIT COMPONENTS WITHIN A THREE DIMENSIONAL MODULE[2014/51]
French:ENSEMBLE ÉLECTRONIQUE MULTICOUCHE ET PROCÉDÉ PERMETTANT D'INTÉGRER DES COMPOSANTS DE CIRCUIT ÉLECTRIQUE DANS UN MODULE TRIDIMENSIONNEL[2014/51]
Entry into regional phase08.09.2014National basic fee paid 
08.09.2014Search fee paid 
08.09.2014Designation fee(s) paid 
08.09.2014Examination fee paid 
Examination procedure08.09.2014Examination requested  [2014/51]
10.08.2016Despatch of communication that the application is deemed to be withdrawn, reason: reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report not received in time
17.10.2016Amendment by applicant (claims and/or description)
23.10.2017Communication of intention to grant the patent
18.01.2018Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
18.01.2018Fee for grant paid
18.01.2018Fee for publishing/printing paid
19.02.2018Information about intention to grant a patent
19.02.2018Receipt of the translation of the claim(s)
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  23.10.2017
Opposition(s)14.01.2019No opposition filed within time limit [2019/12]
Request for further processing for:The application is deemed to be withdrawn due to failure to reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report/Supplementary European search report
17.10.2016Request for further processing filed
17.10.2016Full payment received (date of receipt of payment)
Request granted
27.10.2016Decision despatched
Fees paidRenewal fee
26.02.2015Renewal fee patent year 03
26.02.2016Renewal fee patent year 04
27.02.2017Renewal fee patent year 05
27.02.2018Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU06.02.2013
AL11.04.2018
AT11.04.2018
CY11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
MC11.04.2018
MK11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
IS11.08.2018
PT13.08.2018
[2022/31]
Former [2021/32]HU06.02.2013
AL11.04.2018
AT11.04.2018
CY11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
MC11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
IS11.08.2018
PT13.08.2018
Former [2021/31]AL11.04.2018
AT11.04.2018
CY11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
MC11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
IS11.08.2018
PT13.08.2018
Former [2021/26]AL11.04.2018
AT11.04.2018
CY11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
MC11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2020/16]AL11.04.2018
AT11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
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MC11.04.2018
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PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
TR11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/45]AL11.04.2018
AT11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
MC11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/26]AL11.04.2018
AT11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SI11.04.2018
SK11.04.2018
SM11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/11]AL11.04.2018
AT11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
IT11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SK11.04.2018
SM11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/10]AL11.04.2018
AT11.04.2018
CZ11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RO11.04.2018
RS11.04.2018
SE11.04.2018
SK11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/09]AL11.04.2018
DK11.04.2018
EE11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/08]AL11.04.2018
DK11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2019/03]AL11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
PT13.08.2018
Former [2018/52]AL11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
GR12.07.2018
Former [2018/51]AL11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
LV11.04.2018
NL11.04.2018
PL11.04.2018
RS11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
Former [2018/50]AL11.04.2018
ES11.04.2018
FI11.04.2018
HR11.04.2018
LT11.04.2018
NL11.04.2018
PL11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
Former [2018/49]AL11.04.2018
ES11.04.2018
FI11.04.2018
LT11.04.2018
NL11.04.2018
PL11.04.2018
SE11.04.2018
BG11.07.2018
NO11.07.2018
Former [2018/47]AL11.04.2018
ES11.04.2018
FI11.04.2018
LT11.04.2018
NL11.04.2018
NO11.07.2018
Former [2018/46]AL11.04.2018
LT11.04.2018
NL11.04.2018
NO11.07.2018
Former [2018/43]NL11.04.2018
Documents cited:Search[A]EP0446656  (ROGERS CORP [US]) [A] 1-15 * the whole document *;
 [A]US5329695  (TRASKOS RICHARD T [US], et al) [A] 1-15 * column 7, line 60 - column 10, line 40; figures 1-14 *;
 [Y]WO9839105  (ORMET CORP [US]) [Y] 9,15 * page 7, line 14 - page 9, line 9 *;
 [A]US2006044735  (HAYASHI AKIMORI [JP], et al) [A] 1-15 * paragraph [0025] - paragraph [0032]; figures 7,10A-10C ** paragraph [0079] - paragraph [0088] *;
 [XYI]US2008017409  (TAKEUCHI SATOSHI [JP], et al) [X] 1-4,6,7,10,11,13 * the whole document * [Y] 8,9,14,15 [I] 5,12;
 [Y]WO2010110626  (LS CABLE LTD [KR], et al) [Y] 8,14 * paragraph [0012] - paragraph [0021]; figure 9; example 3 *;
 [XI]WO2011040502  (MURATA MANUFACTURING CO [JP], et al) [X] 1,10 * paragraph [0006] - paragraph [0030]; figures 1-5 * [I] 2-5,11,13
International search[A]US5087585  (HAYASHI YOSHIHIRO [JP]);
 [A]JPH05144973  (NEC CORP);
 [A]JP2001024333  (SONY CHEMICALS);
 [X]JP2007251076  (HITACHI LTD);
 [Y]JP2009141197  (SANYO SPECIAL STEEL CO LTD)
by applicantEP0446656
 US5329695
 WO9839105
 US6009677
 US6395374
 US2008017409
 WO2010110626
 WO2011040502
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.