EP1037261 - Etching and cleaning method and etching and cleaning apparatus used therefor [Right-click to bookmark this link] | |||
Former [2000/38] | Etching and cleaning methods and etching and cleaning apparatuses used therefor | ||
[2005/49] | Status | No opposition filed within time limit Status updated on 23.03.2007 Database last updated on 15.02.2019 | Most recent event Tooltip | 27.07.2007 | Lapse of the patent in a contracting state | published on 29.08.2007 [2007/35] | Applicant(s) | For all designated states NEC Electronics Corporation 1753 Shimonumabe Nakahara-ku Kawasaki, Kanagawa 211-8668 / JP | [2006/20] |
Former [2003/18] | For all designated states NEC Electronics Corporation 1753 Shimonumabe, Nakahara-ku Kawasaki, Kanagawa 211-8668 / JP | ||
Former [2000/38] | For all designated states NEC CORPORATION 7-1, Shiba 5-chome, Minato-ku Tokyo / JP | Inventor(s) | 01 /
Yamasaki, Shinya NEC Corporation, 7-1, Shiba 5-chome Minato-ku, Tokyo / JP | 02 /
Aoki, Hidemitsu NEC Corporation, 7-1, Shiba 5-chome Minato-ku, Tokyo / JP | [2000/38] | Representative(s) | Baronetzky, Klaus Splanemann Patentanwälte Partnerschaft Rumfordstrasse 7 80469 München / DE | [N/P] |
Former [2000/38] | Baronetzky, Klaus, Dipl.-Ing. Splanemann Reitzner Baronetzky Westendorp Patentanwälte Rumfordstrasse 7 80469 München / DE | Application number, filing date | 00104585.5 | 14.03.2000 | [2000/38] | Priority number, date | JP19990068898 | 15.03.1999 Original published format: JP 6889899 | [2000/38] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1037261 | Date: | 20.09.2000 | Language: | EN | [2000/38] | Type: | A3 Search report | No.: | EP1037261 | Date: | 06.11.2002 | [2002/45] | Type: | B1 Patent specification | No.: | EP1037261 | Date: | 17.05.2006 | Language: | EN | [2006/20] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.09.2002 | Classification | International: | H01L21/00, H01L21/3213 | [2002/45] |
Former International [2000/38] | H01L21/00 | Designated contracting states | DE, FR, GB, IT [2003/30] |
Former [2000/38] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Verfahren zum Ätzen und Reinigen und Vorrichtung dafür | [2005/49] | English: | Etching and cleaning method and etching and cleaning apparatus used therefor | [2005/49] | French: | Procédé de gravure et de nettoyage et appareillage | [2005/49] |
Former [2000/38] | Verfahren Zur Ätzung und Reinigung und Vorrichtungen dafür | ||
Former [2000/38] | Etching and cleaning methods and etching and cleaning apparatuses used therefor | ||
Former [2000/38] | Procédés de gravure et de nettoyage et appareillages | Examination procedure | 26.09.2002 | Examination requested [2002/48] | 30.05.2003 | Despatch of a communication from the examining division (Time limit: M06) | 14.10.2003 | Reply to a communication from the examining division | 02.06.2004 | Despatch of a communication from the examining division (Time limit: M06) | 03.12.2004 | Reply to a communication from the examining division | 11.11.2005 | Communication of intention to grant the patent | 11.03.2006 | Fee for grant paid | 11.03.2006 | Fee for publishing/printing paid | Opposition(s) | 20.02.2007 | No opposition filed within time limit [2007/17] | Fees paid | Renewal fee | 15.02.2002 | Renewal fee patent year 03 | 14.02.2003 | Renewal fee patent year 04 | 14.02.2004 | Renewal fee patent year 05 | 16.02.2005 | Renewal fee patent year 06 | 20.02.2006 | Renewal fee patent year 07 | Lapses during opposition Tooltip | IT | 17.05.2006 | [2007/35] | Documents cited: | Search | [X]US5032217 (TANAKA MASATO [JP]) [X] 1,14,27,40 * abstract *; | [X]EP0368334 (TOSHIBA KK [JP]) [X] 1,14,27,40 * abstract * * column 3, line 51 - column 4, line 36 *; | [PX]EP0924754 (SHARP KK [JP], et al) [PX] 1-49 * the whole document *; | [PX]WO9946064 (SEMITOOL INC [US], et al) [PX] 1,14,27,40 * abstract *; | [A]DE4109955 (SIEMENS AG [DE]) [A] 1-49 * the whole document * |