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EP1050844
European procedure
Extract from the Register of European Patents
EP About this file: EP1050844
| EP1050844 - Method of manufacturing a chip card [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 16.05.2014 Database last updated on 22.01.2025 | Most recent event Tooltip | 16.05.2014 | No opposition filed within time limit | published on 18.06.2014 [2014/25] | Applicant(s) | For all designated states Oberthur Technologies 420, rue d'Estienne d'Orves 92700 Colombes / FR | [N/P] |
| Former [2013/27] | For all designated states Oberthur Technologies 420 rue d'Estienne d'Orves 92700 Colombes / FR | ||
| Former [2000/45] | For all designated states OBERTHUR CARD SYSTEMS SA 102, boulevard Malesherbes 75017 Paris / FR | Inventor(s) | 01 /
Bouchez, François 12, rue des Banniers 14790 Verson / FR | 02 /
Bouvard, Jérôme 1, rue Fontenelle Bât. F 14150 Ouistreham / FR | 03 /
Launay, François 13, rue des Glycines, 1 4610 Epron / FR | 04 /
Loubly, Pierre 107, rue de la Délivrande 14000 Caen / FR | [2013/08] |
| Former [2000/45] | 01 /
Bouchez, François 12, rue des Banniers 14790 Verson / FR | ||
| 02 /
Bouvard, Jérôme 1, rue Fontenelle, Bât. F 14150 Ouitreham / FR | |||
| 03 /
Launay, François 13, rue des Glycines, 1 46100 Epron / FR | |||
| 04 /
Loubly, Pierre 107, rue de la Délivrande 14000 Caen / FR | Representative(s) | Santarelli Tour Trinity 1 bis Esplanade de la Défense 92035 Paris La Défense Cedex / FR | [N/P] |
| Former [2013/28] | Santarelli 14 Avenue de la Grande Armée B.P. 237 75822 Paris Cedex 17 / FR | ||
| Former [2003/18] | Santarelli 14, avenue de la Grande Armée, B.P. 237 75822 Paris Cedex 17 / FR | ||
| Former [2000/45] | CABINET BONNET-THIRION 12, Avenue de la Grande-Armée 75017 Paris / FR | Application number, filing date | 00401127.6 | 21.04.2000 | [2000/45] | Priority number, date | FR19990005779 | 06.05.1999 Original published format: FR 9905779 | [2000/45] | Filing language | FR | Procedural language | FR | Publication | Type: | A1 Application with search report | No.: | EP1050844 | Date: | 08.11.2000 | Language: | FR | [2000/45] | Type: | B1 Patent specification | No.: | EP1050844 | Date: | 10.07.2013 | Language: | FR | [2013/28] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 09.08.2000 | Classification | IPC: | G06K19/077 | [2000/45] | CPC: |
G06K19/07745 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/48228 (EP,US);
H01L2224/484 (EP,US);
H01L2224/48599 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/92247 (EP,US);
H01L24/45 (EP,US);
H01L24/48 (EP,US);
H01L24/73 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01057 (EP,US);
H01L2924/01058 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/014 (EP,US);
H01L2924/12042 (EP,US);
| C-Set: |
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/484, H01L2924/00014 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2224/92247, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (EP,US);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/00014, H01L2224/85399 (EP,US);
H01L2924/12042, H01L2924/00 (EP,US); | Designated contracting states | DE, GB, IT [2001/30] |
| Former [2000/45] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Verfahren zum Herstellen einer Chipkarte | [2000/45] | English: | Method of manufacturing a chip card | [2000/45] | French: | Procédé de fabrication d'une carte à microcircuit | [2000/45] | Examination procedure | 13.12.2000 | Examination requested [2001/06] | 28.09.2010 | Despatch of a communication from the examining division (Time limit: M06) | 08.04.2011 | Reply to a communication from the examining division | 31.10.2011 | Despatch of a communication from the examining division (Time limit: M06) | 11.04.2012 | Reply to a communication from the examining division | 25.01.2013 | Communication of intention to grant the patent | 15.04.2013 | Fee for grant paid | 15.04.2013 | Fee for publishing/printing paid | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 28.09.2010 | Opposition(s) | 11.04.2014 | No opposition filed within time limit [2014/25] | Fees paid | Renewal fee | 12.04.2002 | Renewal fee patent year 03 | 14.04.2003 | Renewal fee patent year 04 | 15.04.2004 | Renewal fee patent year 05 | 13.04.2005 | Renewal fee patent year 06 | 17.03.2006 | Renewal fee patent year 07 | 12.04.2007 | Renewal fee patent year 08 | 28.03.2008 | Renewal fee patent year 09 | 28.04.2009 | Renewal fee patent year 10 | 28.04.2010 | Renewal fee patent year 11 | 29.04.2011 | Renewal fee patent year 12 | 28.06.2012 | Renewal fee patent year 13 | 24.04.2013 | Renewal fee patent year 14 | Penalty fee | Additional fee for renewal fee | 30.04.2012 | 13 M06 Fee paid on 28.06.2012 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0472766 (SIEMENS AG [DE]) [A] 1,3* column 3, line 5 - line 14; figure 1 *; | [X]FR2670930 (BULL CP8 [FR]) [X] 1,3-5,13 * figures 1-6; claims 1-10 *; | [A]US5304513 (HAGHIRI-TEHRANI YAHYA [DE], et al) [A] 1 * abstract * | by applicant | EP0472766 |