Extract from the Register of European Patents

Citations: EP1245328

Cited inSearch
Type:Patent literature
Publication No.:EP0251611  [XY]
 (ENGELHARD CORP [US]) [X] 1-4,10-13 * page 3, line 10 - page 3, line 54; figures 1-3 * * page 3, line 10 - page 3, line 37 * [Y] 1,8-10,17-19;
Type:Patent literature
Publication No.:US6139979  [X]
 (TAKAOKA HIDEKIYO [JP], et al) [X] 1,3,5,10,12,14 * table 1 *;
Type:Patent literature
Publication No.:EP0499452  [X]
 (LANCASHIRE FITTINGS LTD [GB]) [X] 1,6,7,10,15,16 * page 2, line 29 - page 3, line 2; table 1 *;
Type:Patent literature
Publication No.:JPH09327790  [Y]
 (UCHIHASHI ESTEC CO LTD) [Y] 1,8-10,17,18 * abstract *;
Type:Patent literature
Publication No.:EP0710521  [X]
 (MITSUI MINING & SMELTING CO [JP]) [X] 1,6,7,10,15,16 * figure 1; claim 1; table 1 *;
Type:Patent literature
Publication No.:US4670217  [X]
 (HENSON ROBERT M [US], et al) [X] 1-4,6,7,10-13,15,16 * claims 1,2; table 1 *;
Type:Patent literature
Publication No.:WO0048784  [XY]
 (MULTICORE SOLDERS LTD [GB], et al) [X] 1-4 * claim 3 * * page 2, paragraph 2 - page 3, paragraph 2 * [Y] 19;
Type:Non-patent literature
Publication information:[XY]  LAINE-YLIJOKI T ET AL, "DEVELOPMENT AND VALIDATION OF A LEAD-FREE ALLOY FOR SOLDER PASTE APPLICATIONS", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY. PART C: MANUFACTURING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, (19970701), vol. 20, no. 3, PART C, ISSN 1083-4400, pages 194 - 198, XP000722468 [X] 1,3,4 * column 2, paragraph 1 - paragraph 2; table 1 * [Y] 19
DOI: http://dx.doi.org/10.1109/3476.649440