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Extract from the Register of European Patents

EP About this file: EP1237187

EP1237187 - Resin-encapsulated semiconductor device and method for manufacturing the same [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  08.02.2013
Database last updated on 22.01.2025
Most recent event   Tooltip08.02.2013Application deemed to be withdrawnpublished on 13.03.2013  [2013/11]
Applicant(s)For all designated states
Panasonic Corporation
1006, Oaza Kadoma
Kadoma-shi
Osaka 571-8501 / JP
[N/P]
Former [2008/47]For all designated states
Panasonic Corporation
1006, Oaza Kadoma Kadoma-shi
Osaka 571-8501 / JP
Former [2002/36]For all designated states
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, Oaza-Kadoma
Kadoma-shi, Osaka 571-8501 / JP
Inventor(s)01 / Minamio, Masanori
3-15-102-102, Kamihamuro
Takatsuki-shi, Osaka 569-1044 / JP
02 / Nomura, Toru
4-19-13-404, Minamimukonosho
Amagasaki-shi, Hyogo 661-0033 / JP
03 / Kawai, Fumihiko
19, Saga-shikimigahara-wakamiyashita-cho
Ukyo-ku, Kyoto-shi, Kyoto 569-1044 / JP
 [2002/36]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[N/P]
Former [2002/36]Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
Maximilianstrasse 58
80538 München / DE
Application number, filing date02004517.527.02.2002
[2002/36]
Priority number, dateJP2001005652101.03.2001         Original published format: JP 2001056521
[2002/36]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1237187
Date:04.09.2002
Language:EN
[2002/36]
Type: A3 Search report 
No.:EP1237187
Date:08.12.2004
[2004/50]
Search report(s)(Supplementary) European search report - dispatched on:EP27.10.2004
ClassificationIPC:H01L23/495, H01L23/31, H01L21/68
[2004/50]
CPC:
H01L21/568 (EP,US); H01L21/56 (EP,US); H01L21/561 (EP,US);
H01L23/3107 (EP,US); H01L23/49548 (EP,US); H01L24/97 (EP,US);
H01L2224/32014 (EP,US); H01L2224/451 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48247 (EP,US); H01L2224/49171 (EP,US); H01L2224/4943 (US);
H01L2224/49433 (EP); H01L2224/85001 (EP,US); H01L2224/97 (EP,US);
H01L24/45 (EP,US); H01L24/48 (EP,US); H01L24/49 (EP,US);
H01L2924/00014 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01023 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/01046 (EP,US); H01L2924/01047 (EP,US); H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US); H01L2924/01082 (EP,US); H01L2924/181 (EP,US);
H01L2924/3011 (EP,US); H01L2924/351 (EP,US) (-)
C-Set:
H01L2224/451, H01L2924/00014 (US,EP);
H01L2224/451, H01L2924/00015 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/49171, H01L2224/48247, H01L2924/00 (US,EP);
H01L2224/97, H01L2224/85 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/181, H01L2924/00012 (EP,US);
H01L2924/351, H01L2924/00 (EP,US)
(-)
Former IPC [2002/36]H01L23/495, H01L23/31
Designated contracting statesDE,   GB,   NL [2005/35]
Former [2002/36]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:Harzeingekapselte Halbleiteranordnung und Herstellungsverfahren[2002/36]
English:Resin-encapsulated semiconductor device and method for manufacturing the same[2002/36]
French:Dispositif semi-conducteur encapsulé par une résine et son procédé de fabrication[2002/36]
Examination procedure24.05.2005Examination requested  [2005/29]
25.11.2005Despatch of a communication from the examining division (Time limit: M06)
10.04.2006Reply to a communication from the examining division
14.02.2007Despatch of a communication from the examining division (Time limit: M03)
16.05.2007Reply to a communication from the examining division
04.08.2008Despatch of a communication from the examining division (Time limit: M04)
11.12.2008Reply to a communication from the examining division
07.04.2011Despatch of a communication from the examining division (Time limit: M04)
25.07.2011Reply to a communication from the examining division
04.09.2012Application deemed to be withdrawn, date of legal effect  [2013/11]
12.10.2012Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2013/11]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  25.11.2005
Fees paidRenewal fee
20.02.2004Renewal fee patent year 03
25.02.2005Renewal fee patent year 04
23.02.2006Renewal fee patent year 05
27.02.2007Renewal fee patent year 06
28.02.2008Renewal fee patent year 07
26.02.2009Renewal fee patent year 08
26.02.2010Renewal fee patent year 09
25.02.2011Renewal fee patent year 10
Penalty fee
Additional fee for renewal fee
29.02.201211   M06   Not yet paid
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XA]JP2000286377  ;
 [XA]JP2000077596  ;
 [A]JP2000307045  ;
 [A]JPH10335566  ;
 [A]JP2000150760  ;
 [A]JPH11307707
 [XA]  - PATENT ABSTRACTS OF JAPAN, (20010205), vol. 2000, no. 13, & JP2000286377 A 20001013 (SANYO ELECTRIC CO LTD) [X] 1,4 * the whole document * [A] 6
 [XA]  - PATENT ABSTRACTS OF JAPAN, (20000922), vol. 2000, no. 06, & JP2000077596 A 20000314 (MATSUSHITA ELECTRONICS INDUSTRY CORP) [X] 6 * the whole document * [A] 1
 [A]  - PATENT ABSTRACTS OF JAPAN, (20010305), vol. 2000, no. 14, & JP2000307045 A 20001102 (MATSUSHITA ELECTRONICS INDUSTRY CORP) [A] 1,2,6,7 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19990331), vol. 1999, no. 03, & JP10335566 A 19981218 (DAINIPPON PRINTING CO LTD) [A] 1-4,6-8 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (20001006), vol. 2000, no. 08, & JP2000150760 A 20000530 (MATSUSHITA ELECTRONICS INDUSTRY CORP) [A] 1,6,10 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (20000229), vol. 2000, no. 02, & JP11307707 A 19991105 (MATSUSHITA ELECTRON CORP) [A] * the whole document *
by applicantJP2000077596
 JP2000286377
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.