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EP1300887
European procedure
Extract from the Register of European Patents
EP About this file: EP1300887
| EP1300887 - METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | |||
| Former [2003/15] | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURE THEREOF | ||
| [2006/48] | Status | No opposition filed within time limit Status updated on 28.03.2008 Database last updated on 15.01.2025 | Most recent event Tooltip | 17.10.2008 | Change - applicant | published on 19.11.2008 [2008/47] | Applicant(s) | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza Kadoma Kadoma-shi Osaka 571-8501 / JP | [2008/47] |
| Former [2007/21] | For all designated states MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 / JP | ||
| Former [2003/15] | For all designated states Matsushita Electric Industrial Co., Ltd. 1006, Oaza-Kadoma Kadoma-shi, Osaka 571-8501 / JP | Inventor(s) | 01 /
MORIWAKI, Masaru 8-2-505, Kori-hondori-cho Neyagawa-shi, Osaka 572-0082 / JP | 02 /
NIWA, Masaaki 9-32, Korien-cho Hirakata-shi, Osaka 573-0086 / JP | 03 /
KUBOTA, Masafumi 1-35-3, Banda Takatsuki-shi, Osaka 569-0044 / JP | [2003/15] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [N/P] |
| Former [2003/15] | Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät Maximilianstrasse 58 80538 München / DE | Application number, filing date | 02712286.0 | 06.02.2002 | [2003/15] | WO2002JP00997 | Priority number, date | JP20010102908 | 02.04.2001 Original published format: JP 2001102908 | [2003/15] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO02082554 | Date: | 17.10.2002 | Language: | EN | [2002/42] | Type: | A1 Application with search report | No.: | EP1300887 | Date: | 09.04.2003 | Language: | EN | The application published by WIPO in one of the EPO official languages on 17.10.2002 takes the place of the publication of the European patent application. | [2003/15] | Type: | B1 Patent specification | No.: | EP1300887 | Date: | 23.05.2007 | Language: | EN | [2007/21] | Search report(s) | International search report - published on: | JP | 17.10.2002 | (Supplementary) European search report - dispatched on: | EP | 12.05.2004 | Classification | IPC: | H01L21/28, H01L29/78, H01L21/336, H01L21/8234, H01L27/088, H01L27/108, H01L21/8242, H01L21/316 | [2006/48] | CPC: |
H01L21/28185 (EP,US);
H10D30/60 (KR);
H01L21/02189 (EP,KR,US);
H01L21/02159 (EP,KR,US);
H01L21/02164 (EP,KR,US);
H01L21/02181 (EP,KR,US);
H01L21/022 (EP,KR,US);
H01L21/02266 (EP,KR,US);
H01L21/02271 (EP,KR,US);
H01L21/28194 (EP,US);
H01L21/31641 (US);
H10D64/685 (EP,US);
H10D64/691 (EP,US);
H10D84/0144 (EP,US);
H10D84/038 (EP,US);
H01L21/02178 (EP,US);
H01L21/0228 (EP,KR,US);
H01L21/31645 (US);
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| Former IPC [2003/15] | H01L29/78, H01L21/336, H01L21/8234, H01L27/088, H01L27/108, H01L21/8242, H01L21/316 | Designated contracting states | DE, FR, GB, NL [2007/21] |
| Former [2003/15] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | HERSTELLUNGSVERFAHREN EINES HALBLEITERBAUELEMENTS | [2006/48] | English: | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | [2006/48] | French: | PROCEDE DE FABRICATION D'UN DISPOSITIF SEMI-CONDUCTEUR | [2006/48] |
| Former [2003/15] | HALBLEITERBAUELEMENT UND VERFAHREN ZU SEINER HERSTELLUNG | ||
| Former [2003/15] | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURE THEREOF | ||
| Former [2003/15] | DISPOSITIF A SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION | Entry into regional phase | 05.12.2002 | Translation filed | 05.12.2002 | National basic fee paid | 05.12.2002 | Search fee paid | 05.12.2002 | Designation fee(s) paid | 05.12.2002 | Examination fee paid | Examination procedure | 05.12.2002 | Amendment by applicant (claims and/or description) | 05.12.2002 | Examination requested [2003/15] | 16.06.2004 | Despatch of a communication from the examining division (Time limit: M04) | 21.10.2004 | Reply to a communication from the examining division | 20.07.2005 | Despatch of a communication from the examining division (Time limit: M04) | 30.11.2005 | Reply to a communication from the examining division | 17.10.2006 | Cancellation of oral proceeding that was planned for 20.10.2006 | 17.10.2006 | Minutes of oral proceedings despatched | 20.10.2006 | Date of oral proceedings (cancelled) | 30.11.2006 | Communication of intention to grant the patent | 29.03.2007 | Fee for grant paid | 29.03.2007 | Fee for publishing/printing paid | Divisional application(s) | EP06003449.3 / EP1677361 | Opposition(s) | 26.02.2008 | No opposition filed within time limit [2008/18] | Fees paid | Renewal fee | 20.02.2004 | Renewal fee patent year 03 | 25.02.2005 | Renewal fee patent year 04 | 23.02.2006 | Renewal fee patent year 05 | 27.02.2007 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2000315789 ; | [A]US6020243 (WALLACE ROBERT M [US], et al); | [Y]US6027961 (MAITI BIKAS [US], et al); | [A]US6203613 (GATES STEPHEN MCCONNELL [US], et al); | International search | [Y]JPH11135774 (TEXAS INSTRUMENTS INC); | [A]GB2340508 (SAMSUNG ELECTRONICS CO LTD [KR]); | [Y]JP2000188338 (HITACHI LTD); | [A]JP2000188400 (TEXAS INSTRUMENTS INC); | [A]EP1028458 (TEXAS INSTRUMENTS INC [US]); | [Y]JP2000307010 (NEC CORP); | [Y]JP2000340670 (SONY CORP); |