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EP1336991
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EP About this file: EP1336991
| EP1336991 - Method of manufacturing an integrated circuit having oversized components [Right-click to bookmark this link] | |||
| Former [2003/34] | Integrated Circuit Having Oversized Components and Method of Manufacture thereof | ||
| [2013/18] | Status | The application is deemed to be withdrawn Status updated on 16.01.2015 Database last updated on 09.12.2024 | Most recent event Tooltip | 16.01.2015 | Application deemed to be withdrawn | published on 18.02.2015 [2015/08] | Applicant(s) | For all designated states Broadcom Corporation 5300 California Avenue Irvine, CA 92617 / US | [2007/21] |
| Former [2003/34] | For all designated states Broadcom Corporation 16215 Alton Parkway Irvine, California 92618-7013 / US | Inventor(s) | 01 /
Komninakis, Christos 540 Kelton Avenue No. 405 Los Angeles, CA 90024 / US | [2003/34] | Representative(s) | Jehle, Volker Armin, et al Bosch Jehle Patentanwaltsgesellschaft mbH Flüggenstrasse 13 80639 München / DE | [N/P] |
| Former [2008/52] | Jehle, Volker Armin, et al Bosch Jehle Patentanwaltsgesellschaft mbH Flüggenstrasse 13 80639 München / DE | ||
| Former [2003/34] | Jehle, Volker Armin, Dipl.-Ing. Patentanwälte Bosch, Graf von Stosch, Jehle, Flüggenstrasse 13 80639 München / DE | Application number, filing date | 03002971.4 | 11.02.2003 | [2003/34] | Priority number, date | US20020074515 | 12.02.2002 Original published format: US 74515 | [2003/34] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1336991 | Date: | 20.08.2003 | Language: | EN | [2003/34] | Type: | A3 Search report | No.: | EP1336991 | Date: | 14.06.2006 | [2006/24] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.05.2006 | Classification | IPC: | H01L23/13, H01L23/522 | [2013/18] | CPC: |
H01L23/522 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
|
| Former IPC [2003/34] | H01L23/13 | Designated contracting states | DE, FR, GB, NL [2007/08] |
| Former [2003/34] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, SE, SI, SK, TR | Title | German: | Herstellungsverfahren von einer integrierten Schaltung mit überdimensionierten Bauelementen | [2013/18] | English: | Method of manufacturing an integrated circuit having oversized components | [2013/20] | French: | Procédé de fabrication d'un circuit integré avec composants surdimensionnés | [2013/18] |
| Former [2003/34] | Integrierte Schaltung mit überdimensionierten Bauelementen und Verfahren zu deren Herstellung | ||
| Former [2003/34] | Integrated Circuit Having Oversized Components and Method of Manufacture thereof | ||
| Former [2003/34] | Circuit integré avec composants surdimensionnés et son procédé de fabrication | Examination procedure | 14.12.2006 | Examination requested [2007/04] | 13.11.2007 | Despatch of a communication from the examining division (Time limit: M06) | 28.04.2008 | Reply to a communication from the examining division | 28.04.2010 | Despatch of a communication from the examining division (Time limit: M04) | 08.09.2010 | Reply to a communication from the examining division | 21.03.2013 | Cancellation of oral proceeding that was planned for 21.03.2013 | 21.03.2013 | Date of oral proceedings (cancelled) | 19.04.2013 | Communication of intention to grant the patent | 25.06.2013 | Despatch of communication that the application is refused, reason: substantive examination {1} | 02.09.2014 | Application deemed to be withdrawn, date of legal effect [2015/08] | 26.09.2014 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2015/08] | Appeal following examination | 27.08.2013 | Appeal received No. T0114/14 | 05.11.2013 | Statement of grounds filed | 08.12.2014 | Result of appeal procedure: the application was deemed to be withdrawn | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 13.11.2007 | Fees paid | Renewal fee | 28.02.2005 | Renewal fee patent year 03 | 28.02.2006 | Renewal fee patent year 04 | 28.02.2007 | Renewal fee patent year 05 | 29.02.2008 | Renewal fee patent year 06 | 02.03.2009 | Renewal fee patent year 07 | 01.03.2010 | Renewal fee patent year 08 | 28.02.2011 | Renewal fee patent year 09 | 29.02.2012 | Renewal fee patent year 10 | 28.02.2013 | Renewal fee patent year 11 | Penalty fee | Additional fee for renewal fee | 28.02.2014 | 12 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US4625227 (HARA YUJI [JP], et al) [X] 1,2,8,9 * abstract * * column 1, line 5 - column 2, line 44 *; | [X]US5444186 (EGUCHI KOJI [JP]) [X] 1,2,8,9 * abstract ** column 4, line 3 - column 5, line 25 *; | [X]US5686356 (JAIN MANOJ KUMAR [US], et al) [X] 1,2,8,9 * abstract * * column 2, line 8 - column 3, line 43 *; | [XA]EP0924762 (SIEMENS AG [DE]) [X] 1,2,8,9 * abstract * * paragraph [0002] - paragraph [0014] * [A] 3-7,10-14 |