-
EP1868245
European procedure
Extract from the Register of European Patents
EP About this file: EP1868245
| EP1868245 - Semiconductor device and method of manufacturing semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 17.07.2020 Database last updated on 19.04.2025 | |
| Former | The patent has been granted Status updated on 09.08.2019 | ||
| Former | Grant of patent is intended Status updated on 02.08.2019 | ||
| Former | Examination is in progress Status updated on 31.07.2019 | ||
| Former | Grant of patent is intended Status updated on 29.07.2019 | ||
| Former | Examination is in progress Status updated on 05.07.2019 | ||
| Former | Grant of patent is intended Status updated on 18.03.2019 | ||
| Former | Examination is in progress Status updated on 20.01.2017 | Most recent event Tooltip | 17.07.2020 | No opposition filed within time limit | published on 19.08.2020 [2020/34] | Applicant(s) | For all designated states SHINKO ELECTRIC INDUSTRIES CO., LTD. 80 Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | [2007/51] | Inventor(s) | 01 /
Murayama, Kei Shinko Electric Industries, Co.,Ltd. 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | 02 /
Higashi, Mitsutoshi Shinko Electric Industries, Co.,Ltd. 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | 03 /
Koizumi, Naoyuki Shinko Electric Industries, Co.,Ltd. 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | 04 /
Taguchi, Yuichi Shinko Electric Industries, Co.,Ltd. 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | 05 /
Shiraishi, Akinori Shinko Electric Industries, Co.,Ltd. 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | 06 /
Sunohara, Masahiro Shinko Electric Industries, Co.,Ltd. 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | [2019/37] |
| Former [2007/51] | 01 /
Murayama, Kei Shinko Electric Industries, Co.,Ltd., 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | ||
| 02 /
Higashi, Mitsutoshi Shinko Electric Industries, Co.,Ltd., 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | |||
| 03 /
Koizumi, Naoyuki Shinko Electric Industries, Co.,Ltd., 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | |||
| 04 /
Taguchi, Yuichi Shinko Electric Industries, Co.,Ltd., 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | |||
| 05 /
Shiraishi, Akinori Shinko Electric Industries, Co.,Ltd., 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | |||
| 06 /
Sunohara, Masahiro Shinko Electric Industries, Co.,Ltd., 80,Oshimada-machi Nagano-shi, Nagano 381-2287 / JP | Representative(s) | Zimmermann & Partner Patentanwälte mbB Postfach 330 920 80069 München / DE | [2019/37] |
| Former [2007/51] | Zimmermann, Gerd Heinrich, et al Zimmermann & Partner, P.O. Box 330 920 80069 München / DE | Application number, filing date | 07011906.0 | 18.06.2007 | [2007/51] | Priority number, date | JP20060168166 | 16.06.2006 Original published format: JP 2006168166 | [2007/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1868245 | Date: | 19.12.2007 | Language: | EN | [2007/51] | Type: | A3 Search report | No.: | EP1868245 | Date: | 10.04.2013 | Language: | EN | [2013/15] | Type: | B1 Patent specification | No.: | EP1868245 | Date: | 11.09.2019 | Language: | EN | [2019/37] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.03.2013 | Classification | IPC: | H01L25/16, H01L23/14, H01L23/492, H01L23/62, H01L29/866 | [2019/14] | CPC: |
H01L25/167 (EP,US);
H01L23/147 (EP,US);
H01L23/4926 (EP,US);
H01L23/62 (EP,US);
H01L2224/16145 (EP,US);
H01L2224/32145 (EP,US);
H01L2224/48137 (EP,US);
H01L2224/48145 (EP,US);
H01L2224/4823 (EP,US);
H01L2224/73265 (EP,US);
H01L24/48 (EP,US);
H01L25/16 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/12035 (EP,US);
H01L2924/12041 (EP,US);
H01L2924/14 (EP,US);
| C-Set: |
H01L2224/73265, H01L2224/32145, H01L2224/48145, H01L2924/00 (EP);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/12035, H01L2924/00 (US,EP);
H01L2924/12041, H01L2924/00 (US,EP);
H01L2924/1461, H01L2924/00 (US,EP); |
| Former IPC [2013/15] | H01L25/16, H01L23/14, H01L23/492, H01L23/62 | ||
| Former IPC [2007/51] | H01L25/16, H01L23/14, H01L23/492 | Designated contracting states | DE [2013/33] |
| Former [2007/51] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | Title | German: | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements | [2007/51] | English: | Semiconductor device and method of manufacturing semiconductor device | [2007/51] | French: | Dispositif à semi-conducteurs et procédé de fabrication de dispositif à semi-conducteurs | [2007/51] | Examination procedure | 02.07.2013 | Amendment by applicant (claims and/or description) | 02.07.2013 | Examination requested [2013/33] | 11.10.2013 | Loss of particular rights, legal effect: designated state(s) | 14.11.2013 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, MT, NL, PL, PT, RO, SE, SI, SK, TR | 24.01.2017 | Despatch of a communication from the examining division (Time limit: M04) | 22.05.2017 | Reply to a communication from the examining division | 12.09.2017 | Despatch of a communication from the examining division (Time limit: M04) | 08.01.2018 | Reply to a communication from the examining division | 23.03.2018 | Despatch of a communication from the examining division (Time limit: M02) | 01.06.2018 | Reply to a communication from the examining division | 31.08.2018 | Despatch of a communication from the examining division (Time limit: M04) | 28.12.2018 | Reply to a communication from the examining division | 19.03.2019 | Communication of intention to grant the patent | 01.07.2019 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 01.07.2019 | Fee for grant paid | 01.07.2019 | Fee for publishing/printing paid | 01.08.2019 | Information about intention to grant a patent | 01.08.2019 | Receipt of the translation of the claim(s) | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 24.01.2017 | Opposition(s) | 15.06.2020 | No opposition filed within time limit [2020/34] | Fees paid | Renewal fee | 29.06.2009 | Renewal fee patent year 03 | 31.03.2010 | Renewal fee patent year 04 | 30.06.2011 | Renewal fee patent year 05 | 31.03.2012 | Renewal fee patent year 06 | 28.06.2013 | Renewal fee patent year 07 | 31.03.2014 | Renewal fee patent year 08 | 30.06.2015 | Renewal fee patent year 09 | 30.06.2016 | Renewal fee patent year 10 | 30.06.2017 | Renewal fee patent year 11 | 29.06.2018 | Renewal fee patent year 12 | 27.06.2019 | Renewal fee patent year 13 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAI]EP1030377 (TOYODA GOSEI KK [JP], et al) [X] 1-3,6-9,11-13 * paragraph [0049] - paragraph [0054]; figures 4,5 * [A] 4,5,10,14 [I] 15; | [XI]EP1603170 (TOYODA GOSEI KK [JP], et al) [X] 1-3,6-8,13 * paragraph [0099] - paragraph [0108]; figures 22-24 * [I] 4,5,9-12,14,15; | [XAI]WO2006011766 (EPIVALLEY CO LTD [KR], et al) [X] 1-3,6,8,9,12,13 * page 8, line 22 - page 20, line 20; figures 5-12 * [A] 4,5,10,14[I] 7,11,15; | [X]WO2006054616 (MATSUSHITA ELECTRIC IND CO LTD [JP], et al) [X] 1-15 * page 15, line 25 - page 18, line 4; figures 7-9 * | Examination | US6841931 | US2006027826 |