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Extract from the Register of European Patents

EP About this file: EP1936684

EP1936684 - Electronic device with a base plate [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.05.2012
Database last updated on 25.03.2025
Most recent event   Tooltip04.10.2013Lapse of the patent in a contracting state
New state(s): HU		published on 06.11.2013  [2013/45]
Applicant(s)For all designated states
ABB Technology AG
Affolternstrasse 44
8050 Zürich / CH
[N/P]
Former [2011/28]For all designated states
ABB Technology AG
Affoltern Strasse 44
8050 Zürich / CH
Former [2008/26]For all designated states
ABB Technology Ltd
Affolternstrasse 44
8050 Zürich / CH
Inventor(s)01 / Chen, Makan
Langackerstrasse 29c
CH-5102, Rupperswil / CH
02 / Schneider, Daniel
Bodenackerstrasse 30
CH-8112, Otelfingen / CH
03 / Zehringer, Raymond
Neubrunnweg 56
CH-4132, Muttenz / CH
 [2008/26]
Representative(s)ABB Patent Attorneys
C/o ABB Schweiz AG
Intellectual Property CH-IP
Brown Boveri Strasse 6
5400 Baden / CH
[N/P]
Former [2008/26]ABB Patent Attorneys
c/o ABB Schweiz AG, Intellectual Property (CH-LC/IP), Brown Boveri Strasse 6
5400 Baden / CH
Application number, filing date07121276.522.11.2007
[2008/26]
Priority number, dateEP2006002665822.12.2006         Original published format: EP 06026658
[2008/26]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1936684
Date:25.06.2008
Language:EN
[2008/26]
Type: B1 Patent specification 
No.:EP1936684
Date:20.07.2011
Language:EN
[2011/29]
Search report(s)(Supplementary) European search report - dispatched on:EP08.04.2008
ClassificationIPC:H01L23/367, H05K1/02
[2008/26]
CPC:
H05K3/0061 (EP); H01L21/4871 (EP); H01L23/367 (EP);
H01L23/4006 (EP); H01L2924/0002 (EP); H05K1/0306 (EP);
H05K2201/2036 (EP); H05K3/341 (EP) (-)
C-Set:
H01L2924/0002, H01L2924/00 (EP)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MT,   NL,   PL,   PT,   RO,   SE,   SI,   SK,   TR [2008/26]
TitleGerman:Elektronische Vorrichtung mit einer Bodenplatte[2011/07]
English:Electronic device with a base plate[2008/26]
French:Dispositif électronique avec plaque de base[2011/07]
Former [2008/26]Bodenplatte für eine Wärmesenke und elektronische Vorrichtung mit einer Bodenplatte
Former [2008/26]Plaque de base pour dissipateur thermique et dispositif électronique avec plaque de base
Examination procedure17.12.2008Examination requested  [2009/05]
11.02.2009Despatch of a communication from the examining division (Time limit: M04)
05.06.2009Reply to a communication from the examining division
21.06.2010Despatch of a communication from the examining division (Time limit: M02)
06.08.2010Reply to a communication from the examining division
24.01.2011Communication of intention to grant the patent
12.05.2011Fee for grant paid
12.05.2011Fee for publishing/printing paid
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  11.02.2009
Opposition(s)23.04.2012No opposition filed within time limit [2012/26]
Fees paidRenewal fee
24.11.2009Renewal fee patent year 03
23.11.2010Renewal fee patent year 04
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
HU20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
MT20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
TR20.07.2011
BG20.10.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
IE22.11.2011
LU22.11.2011
MC30.11.2011
[2013/45]
Former [2013/44]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
MT20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
TR20.07.2011
BG20.10.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
IE22.11.2011
LU22.11.2011
MC30.11.2011
Former [2013/29]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
MT20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
BG20.10.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
IE22.11.2011
LU22.11.2011
MC30.11.2011
Former [2013/25]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
MT20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
IE22.11.2011
LU22.11.2011
MC30.11.2011
Former [2013/14]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
MT20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
IE22.11.2011
MC30.11.2011
Former [2012/47]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
IE22.11.2011
MC30.11.2011
Former [2012/31]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
DK20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
MC30.11.2011
Former [2012/29]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
MC30.11.2011
Former [2012/23]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
EE20.07.2011
FI20.07.2011
IT20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
RO20.07.2011
SE20.07.2011
SI20.07.2011
SK20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
Former [2012/21]AT20.07.2011
BE20.07.2011
CY20.07.2011
CZ20.07.2011
FI20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
SE20.07.2011
SI20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
Former [2012/12]AT20.07.2011
BE20.07.2011
CY20.07.2011
FI20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
SE20.07.2011
SI20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
Former [2012/11]AT20.07.2011
BE20.07.2011
FI20.07.2011
LT20.07.2011
LV20.07.2011
NL20.07.2011
PL20.07.2011
SE20.07.2011
SI20.07.2011
GR21.10.2011
IS20.11.2011
PT21.11.2011
Former [2012/09]BE20.07.2011
FI20.07.2011
LT20.07.2011
NL20.07.2011
IS20.11.2011
PT21.11.2011
Former [2012/08]LT20.07.2011
NL20.07.2011
IS20.11.2011
Documents cited:Search[X]US5784256  (NAKAMURA HIROSHI [JP], et al) [X] 1-15 * column 16, line 64 - column 20, line 22; figures 17-19 *;
 [Y]  - KEVIN A MOORES ET AL, "Thermal Characterization of a Liquid Cooled AlSiC Base Plate with Integral Pin Fins", IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, (200106), vol. 24, no. 2, ISSN 1521-3331, XP011011233 [Y] 1-15 * pages 213-214; figures 1,2 *
 [Y]  - HAYASHI K ET AL, "Improvement of fatigue life of solder joints by thickness control of solder with wire bump technique", 2002 PROCEEDINGS 52ND. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ECTC 2002. SAN DIEGO, CA, MAY 28 - 31, 2002, PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, NEW YORK, NY : IEEE, US, (20020528), vol. CONF. 52, ISBN 0-7803-7430-4, pages 1469 - 1474, XP010747830 [Y] 1-15 * the whole document *

DOI:   http://dx.doi.org/10.1109/ECTC.2002.1008300
 [Y]  - M. MUENZER, M. THOBEN, A. VOLKE, "The Next Chapter in Automotive Electronics", POWER SYSTEMS DESIGN EUROPE, (200610), pages 40 - 43, URL: http://www.powersystemsdesign.com/automotive06_2.pdf, (20080307), XP002471958 [Y] 1-15 * the whole document *
by applicantUS5784256
 WO2004065050
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.