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EP About this file: EP2194570

EP2194570 - Materials for polishing liquid for metal, polishing liquid for metal, mehtod for preparation thereof and polishing method using the same [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 17.11.2017 Database last updated on 21.03.2025
Former	Examination is in progress Status updated on 09.08.2017
Most recent event Tooltip	17.11.2017	Application deemed to be withdrawn	published on 20.12.2017 [2017/51]
Applicant(s)	For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP
	[N/P]
Former [2010/23]	For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 163-0449 / JP
Inventor(s)	01 / Uchida, Takeshi Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	02 / Hoshino, Tetsuya Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	03 / Terazaki, Hiroki Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	04 / Kamigata, Yasuo Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	05 / Koyama, Naoyuki Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	06 / Honma, Yoshio Hitachi, Ltd. Central Reseach Laboratory 280 Higashi Koigakubo 1-chome Kokubunji-shi Tokyo 185-0014 / JP
	07 / Kondoh, Seiichi Hitachi Ltd. Central Reseach Laboratory 280 Higashi Koigakubo 1-chome Kokubunji-shi Tokyo 185-0014 / JP
	[2011/03]
Former [2010/33]	01 / Uchida, Takeshi Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	02 / Hoshino, Tetsuya Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	03 / Terazaki, Hiroki Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	04 / Kamigata, Yasuo Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	05 / Koyama, Naoyuki Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	06 / Honma, Yoshio Central Reseach Laboratory Hitachi 280 Higashi Koigakubo 1-chome Kokubunji-shi Tokyo 185-0014 / JP
	07 / Kondoh, Seiichi Central Reseach Laboratory Hitachi 280 HIgashi Koigakubo 1-chome Kokubunji-shi Tokyo 185-0014 / JP
Former [2010/23]	01 / Uchida, Takeshi Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	02 / Hoshino, Tetsuya Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	03 / Terazaki, Hiroki Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	04 / Kamigata, Yasuo Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	05 / Koyama, Naoyuki Research & Development Center 48 c/o Hitachi Chemi Tsukuba 305-4247 / JP
	06 / Honma, Yoshio Central Reseach Laboratory Hitachi 280 c/o Hitachi Tokyo 185-0014 / JP
	07 / Kondoh, Seiichi Central Reseach Laboratory Hitachi 280 c/o Hitachi Tokyo 185-0014 / JP
Representative(s)	Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE
	[N/P]
Former [2010/23]	von Kreisler Selting Werner Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE
Application number, filing date	10157271.7	28.12.1999
	[2010/23]
Priority number, date	JP19980372605	28.12.1998 Original published format: JP 37260598
	JP19980372608	28.12.1998 Original published format: JP 37260898
	[2010/23]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP2194570
	Date:	09.06.2010
	Language:	EN
	[2010/23]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	04.05.2010
Classification	IPC:	H01L21/321, C09G1/02	[2010/23]
	CPC:	C09G1/04 (EP,US); C09K3/14 (KR); C09G1/02 (EP,US); C09K13/00 (EP,US); C23F3/00 (EP,US); C23F3/04 (EP,US); (+) C23F3/06 (EP,US); H01L21/3212 (EP,US) (-)
Designated contracting states	DE, FR, GB, IT, NL [2010/23]
Title	German:	Materialien für eine Reinigungsflüssigkeit für Metall, Reinigungsflüssigkeit für Metall, Herstellungsverfahren dafür und Reinigungsverfahren damit	[2010/23]
	English:	Materials for polishing liquid for metal, polishing liquid for metal, mehtod for preparation thereof and polishing method using the same	[2010/23]
	French:	Matériaux pour liquide de polissage de métaux, liquide de polissage de métaux, son procédé de préparation et procédé de polissage les utilisant	[2010/23]
Examination procedure	23.03.2010	Examination requested [2010/23]
	09.12.2010	Amendment by applicant (claims and/or description)
	20.11.2012	Despatch of a communication from the examining division (Time limit: M04)
	25.03.2013	Reply to a communication from the examining division
	01.07.2017	Application deemed to be withdrawn, date of legal effect [2017/51]
	10.08.2017	Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2017/51]
Parent application(s) Tooltip	EP07108615.1 / EP1833085
	EP99961474.6 / EP1150341
Divisional application(s)	The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP19990961474) is 16.11.2006
Fees paid	Renewal fee
	23.03.2010	Renewal fee patent year 03
	23.03.2010	Renewal fee patent year 04
	23.03.2010	Renewal fee patent year 05
	23.03.2010	Renewal fee patent year 06
	23.03.2010	Renewal fee patent year 07
	23.03.2010	Renewal fee patent year 08
	23.03.2010	Renewal fee patent year 09
	23.03.2010	Renewal fee patent year 10
	23.03.2010	Renewal fee patent year 11
	28.12.2010	Renewal fee patent year 12
	28.12.2011	Renewal fee patent year 13
	19.12.2012	Renewal fee patent year 14
	27.12.2013	Renewal fee patent year 15
	19.12.2014	Renewal fee patent year 16
	21.12.2015	Renewal fee patent year 17
	Penalty fee
	Additional fee for renewal fee
	31.12.2016	18 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[I]EP0846742 (CABOT CORP [US]) [I] 1,2,7,8 * abstract *;
		[I] - LUO Q ET AL, "Chemical-mechanical polishing of copper in acidic media", CMP-MIC CONFERENCE, XX, XX, (19960222), pages 145 - 151, XP002965484 [I] 1,2,4,7,8 * the whole document *
		[A] - GOETZ R ET AL, "An aes and sims study of the influence of chloride on the passive oxide film on iron", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB LNKD- DOI:10.1016/0013-4686(86)80151-7, vol. 31, no. 10, ISSN 0013-4686, (19861001), pages 1299 - 1303, (19861001), XP026527384 [A] 1 * the whole document * DOI: http://dx.doi.org/10.1016/0013-4686(86)80151-7
	by applicant	US4944836
		JPH02278822
		JPH0883780
		- JOURNAL OF ELECTROCHEMICAL SOCIETY, (1991), vol. 138, no. 11, pages 3460 - 3464

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