EP3276596 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 26.07.2024 Database last updated on 25.03.2025 | |
Former | The patent has been granted Status updated on 18.08.2023 | ||
Former | Grant of patent is intended Status updated on 17.04.2023 | ||
Former | Examination is in progress Status updated on 03.04.2019 | ||
Former | Request for examination was made Status updated on 29.12.2017 | Most recent event Tooltip | 07.02.2025 | Lapse of the patent in a contracting state New state(s): MC | published on 12.03.2025 [2025/11] | Applicant(s) | For all designated states Rohm Co., Ltd. 21, Saiin Mizosaki-cho Ukyo-ku Kyoto-shi, Kyoto 615-8585 / JP | [2018/05] | Inventor(s) | 01 /
NAGAO, Kei c/o ROHM CO., LTD., Intellectual Div. 21, Saiin Mizosaki-cho Ukyo-ku, Kyoto-shi Kyoto 615-8585 / JP | 02 /
TAKAHASHI, Toru c/o ROHM CO., LTD., Intellectual Div. 21, Saiin Mizosaki-cho Ukyo-ku, Kyoto-shi Kyoto 615-8585 / JP | [2018/05] | Representative(s) | Isarpatent Patent- und Rechtsanwälte Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31 80801 München / DE | [2023/38] |
Former [2018/05] | Isarpatent Patent- und Rechtsanwälte Behnisch Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31 80801 München / DE | Application number, filing date | 17183341.1 | 26.07.2017 | [2018/05] | Priority number, date | JP20160147395 | 27.07.2016 Original published format: JP 2016147395 | [2018/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP3276596 | Date: | 31.01.2018 | Language: | EN | [2018/05] | Type: | A3 Search report | No.: | EP3276596 | Date: | 06.06.2018 | Language: | EN | [2018/23] | Type: | B1 Patent specification | No.: | EP3276596 | Date: | 20.09.2023 | Language: | EN | [2023/38] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.05.2018 | Classification | IPC: | G09G3/00, G01R27/26, G01R31/28 | [2023/15] | CPC: |
G09G3/006 (EP,US);
B60K35/22 (EP);
B60K35/60 (EP,US);
G01R31/44 (US);
H05B45/10 (EP,US);
H05B45/3725 (EP,US);
H05B45/50 (EP,US);
H05B47/25 (EP);
G09G2330/02 (EP,US);
|
Former IPC [2018/05] | G09G3/00, H05B33/08, G01R27/26, G01R31/28 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/02] |
Former [2018/05] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | HALBLEITERBAUELEMENT | [2018/05] | English: | SEMICONDUCTOR DEVICE | [2018/05] | French: | DISPOSITIF À SEMI-CONDUCTEUR | [2018/05] | Examination procedure | 26.07.2017 | Examination requested [2018/05] | 26.07.2017 | Date on which the examining division has become responsible | 04.12.2018 | Amendment by applicant (claims and/or description) | 05.04.2019 | Despatch of a communication from the examining division (Time limit: M06) | 15.10.2019 | Reply to a communication from the examining division | 06.12.2019 | Despatch of a communication from the examining division (Time limit: M02) | 14.02.2020 | Reply to a communication from the examining division | 25.11.2020 | Despatch of a communication from the examining division (Time limit: M03) | 23.02.2021 | Reply to a communication from the examining division | 29.06.2021 | Despatch of a communication from the examining division (Time limit: M04) | 20.10.2021 | Reply to a communication from the examining division | 18.04.2023 | Communication of intention to grant the patent | 09.08.2023 | Fee for grant paid | 09.08.2023 | Fee for publishing/printing paid | 09.08.2023 | Receipt of the translation of the claim(s) | Opposition(s) | 21.06.2024 | No opposition filed within time limit [2024/35] | Fees paid | Renewal fee | 31.07.2019 | Renewal fee patent year 03 | 31.07.2020 | Renewal fee patent year 04 | 30.07.2021 | Renewal fee patent year 05 | 29.07.2022 | Renewal fee patent year 06 | 31.07.2023 | Renewal fee patent year 07 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 20.09.2023 | BG | 20.09.2023 | CZ | 20.09.2023 | DK | 20.09.2023 | EE | 20.09.2023 | ES | 20.09.2023 | FI | 20.09.2023 | HR | 20.09.2023 | IT | 20.09.2023 | LT | 20.09.2023 | LV | 20.09.2023 | MC | 20.09.2023 | NL | 20.09.2023 | PL | 20.09.2023 | RO | 20.09.2023 | RS | 20.09.2023 | SE | 20.09.2023 | SI | 20.09.2023 | SK | 20.09.2023 | SM | 20.09.2023 | NO | 20.12.2023 | GR | 21.12.2023 | IS | 20.01.2024 | PT | 22.01.2024 | [2025/11] |
Former [2024/51] | AT | 20.09.2023 | |
BG | 20.09.2023 | ||
CZ | 20.09.2023 | ||
DK | 20.09.2023 | ||
EE | 20.09.2023 | ||
ES | 20.09.2023 | ||
FI | 20.09.2023 | ||
HR | 20.09.2023 | ||
IT | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
PL | 20.09.2023 | ||
RO | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SI | 20.09.2023 | ||
SK | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
PT | 22.01.2024 | ||
Former [2024/49] | AT | 20.09.2023 | |
CZ | 20.09.2023 | ||
DK | 20.09.2023 | ||
EE | 20.09.2023 | ||
ES | 20.09.2023 | ||
FI | 20.09.2023 | ||
HR | 20.09.2023 | ||
IT | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
PL | 20.09.2023 | ||
RO | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SI | 20.09.2023 | ||
SK | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
PT | 22.01.2024 | ||
Former [2024/33] | AT | 20.09.2023 | |
CZ | 20.09.2023 | ||
DK | 20.09.2023 | ||
EE | 20.09.2023 | ||
ES | 20.09.2023 | ||
FI | 20.09.2023 | ||
HR | 20.09.2023 | ||
IT | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
PL | 20.09.2023 | ||
RO | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SK | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
PT | 22.01.2024 | ||
Former [2024/26] | AT | 20.09.2023 | |
CZ | 20.09.2023 | ||
EE | 20.09.2023 | ||
ES | 20.09.2023 | ||
FI | 20.09.2023 | ||
HR | 20.09.2023 | ||
IT | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
PL | 20.09.2023 | ||
RO | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SK | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
PT | 22.01.2024 | ||
Former [2024/25] | AT | 20.09.2023 | |
CZ | 20.09.2023 | ||
EE | 20.09.2023 | ||
ES | 20.09.2023 | ||
FI | 20.09.2023 | ||
HR | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
PL | 20.09.2023 | ||
RO | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SK | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
PT | 22.01.2024 | ||
Former [2024/23] | AT | 20.09.2023 | |
CZ | 20.09.2023 | ||
EE | 20.09.2023 | ||
ES | 20.09.2023 | ||
FI | 20.09.2023 | ||
HR | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
RO | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SK | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
PT | 22.01.2024 | ||
Former [2024/20] | FI | 20.09.2023 | |
HR | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
SM | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
IS | 20.01.2024 | ||
Former [2024/14] | FI | 20.09.2023 | |
HR | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
NL | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
Former [2024/10] | FI | 20.09.2023 | |
HR | 20.09.2023 | ||
LT | 20.09.2023 | ||
LV | 20.09.2023 | ||
RS | 20.09.2023 | ||
SE | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
Former [2024/09] | FI | 20.09.2023 | |
LT | 20.09.2023 | ||
SE | 20.09.2023 | ||
NO | 20.12.2023 | ||
GR | 21.12.2023 | ||
Former [2024/08] | LT | 20.09.2023 | |
NO | 20.12.2023 | ||
GR | 21.12.2023 | Documents cited: | Search | [X]US2016081148 (LIANG ENZHU [US], et al) | by applicant | JP2014211436 |