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EP4152361
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EP About this file: EP4152361
| EP4152361 - SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 24.03.2023 Database last updated on 25.03.2025 | |
| Former | The application has been published Status updated on 17.02.2023 | Most recent event Tooltip | 30.08.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do 16677 / KR | [N/P] |
| Former [2023/12] | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu, Suwon-si Gyeonggi-do, 16677 / KR | Inventor(s) | 01 /
NAM, Seunggeol Suwon-si / KR | 02 /
LEE, Hyunjae Suwon-si / KR | 03 /
CHOE, Dukhyun Suwon-si / KR | 04 /
HEO, Jinseong Suwon-si / KR | [2023/12] | Representative(s) | Elkington and Fife LLP Prospect House 8 Pembroke Road Sevenoaks, Kent TN13 1XR / GB | [2023/12] | Application number, filing date | 22196109.7 | 16.09.2022 | [2023/12] | Priority number, date | KR20210125212 | 17.09.2021 Original published format: KR 20210125212 | [2023/12] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4152361 | Date: | 22.03.2023 | Language: | EN | [2023/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.02.2023 | Classification | IPC: | H01L21/28, H01L29/51, H01L29/78 | [2023/12] | CPC: |
H10D64/033 (EP);
H10D64/689 (EP,KR,US);
H10B51/30 (EP);
H10D30/62 (KR);
H10D30/6735 (KR);
H10D30/701 (EP,KR,US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/17] |
| Former [2023/12] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | HALBLEITERBAUELEMENT UND ELEKTRONISCHE VORRICHTUNG MIT DEM HALBLEITERBAUELEMENT | [2023/12] | English: | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR DEVICE | [2023/12] | French: | DISPOSITIF À SEMI-CONDUCTEUR ET APPAREIL ÉLECTRONIQUE COMPRENANT LE DISPOSITIF À SEMI-CONDUCTEUR | [2023/12] | Examination procedure | 17.03.2023 | Examination requested [2023/17] | 17.03.2023 | Date on which the examining division has become responsible | 22.09.2023 | Amendment by applicant (claims and/or description) | Fees paid | Renewal fee | 29.08.2024 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US2019288116 (YOO HYANGKEUN [KR]); | [XYI]CN113054023 (TAIWAN SEMICONDUCTOR MFG CO LTD); | [A]EP3846232 (SAMSUNG ELECTRONICS CO LTD [KR], et al); | [P]US2021305397 (VELLIANITIS GEORGIOS [BE], et al) |