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EP4199072
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EP About this file: EP4199072
| EP4199072 - FAN-OUT WAFER-LEVEL PACKAGE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 16.02.2024 Database last updated on 22.01.2025 | |
| Former | The application has been published Status updated on 19.05.2023 | Most recent event Tooltip | 03.01.2025 | New entry: Renewal fee paid | Applicant(s) | For all designated states IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) / DE | [2023/25] | Inventor(s) | 01 /
WIETSTRUCK, Matthias 15236 Frankfurt (Oder) / DE | 02 /
KAHMEN, Gerhard 15236 Frankfurt (Oder) / DE | 03 /
KRÜGER, Patrick 15236 Frankfurt (Oder) / DE | 04 /
VOSS, Thomas 15236 Frankfurt (Oder) / DE | 05 /
STOCCHI, Matteo 15236 Frankfurt (Oder) / DE | [2023/25] | Representative(s) | Eisenführ Speiser Patentanwälte Rechtsanwälte PartGmbB Stralauer Platz 34 10243 Berlin / DE | [2023/25] | Application number, filing date | 22213772.1 | 15.12.2022 | [2023/25] | Priority number, date | EP20210214621 | 15.12.2021 Original published format: EP 21214621 | US202218080317 | 13.12.2022 Original published format: US202218080317 | [2023/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP4199072 | Date: | 21.06.2023 | Language: | EN | [2023/25] | Type: | A3 Search report | No.: | EP4199072 | Date: | 09.08.2023 | Language: | EN | [2023/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.07.2023 | Classification | IPC: | H01L23/36, H01L21/60, H01L23/66, H01L21/683, // H01L25/10, H01L21/56 | [2023/25] | CPC: |
H01L24/19 (EP);
H01L21/568 (EP);
H01L21/6835 (EP);
H01L21/6836 (EP);
H01L23/36 (EP);
H01L23/473 (EP);
H01L23/66 (EP);
H01L24/20 (EP);
H01L25/50 (EP);
H01L2221/68327 (EP);
H01L2221/68345 (EP);
H01L2221/6835 (EP);
H01L2221/68354 (EP);
H01L2221/68359 (EP);
H01L2223/6677 (EP);
H01L2224/04105 (EP);
H01L2224/08145 (EP);
H01L2224/08225 (EP);
H01L2224/08245 (EP);
H01L2224/12105 (EP);
H01L2224/27002 (EP);
H01L2224/29124 (EP);
H01L2224/29147 (EP);
H01L2224/32145 (EP);
H01L2224/32225 (EP);
H01L2224/32245 (EP);
H01L2224/73251 (EP);
H01L2224/73267 (EP);
H01L2224/80132 (EP);
H01L2224/83132 (EP);
H01L2224/83191 (EP);
H01L2224/83192 (EP);
H01L2224/83193 (EP);
H01L2224/9222 (EP);
H01L2224/92244 (EP);
H01L2224/97 (EP);
H01L2225/1035 (EP);
H01L2225/1041 (EP);
H01L2225/1058 (EP);
H01L2225/1094 (EP);
H01L24/08 (EP);
H01L24/27 (EP);
H01L24/29 (EP);
H01L24/32 (EP);
H01L24/73 (EP);
H01L24/80 (EP);
H01L24/83 (EP);
H01L24/92 (EP);
H01L25/105 (EP);
H01L2924/10253 (EP);
H01L2924/10271 (EP);
| C-Set: |
H01L2224/73251, H01L2224/08, H01L2224/19 (EP);
H01L2224/73251, H01L2224/08, H01L2224/20 (EP);
H01L2224/9222, H01L2224/80, H01L2224/19 (EP);
H01L2224/97, H01L2224/80 (EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/12] |
| Former [2023/25] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | FAN-OUT-GEHÄUSE AUF WAFEREBENE | [2023/25] | English: | FAN-OUT WAFER-LEVEL PACKAGE | [2023/25] | French: | BOÎTIER SUR TRANCHE À SORTANCE | [2023/25] | Examination procedure | 09.02.2024 | Amendment by applicant (claims and/or description) | 09.02.2024 | Examination requested [2024/12] | 09.02.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 02.01.2025 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2002070443 (MU XIAO-CHUN [US], et al) [X] 1-4,11-15* paragraphs [0024] - [0026] - [0028] - [0030] - [0039]; figures 8-19,22-24 *; | [X]US2005212129 (HUANG CHIEN-PING [TW], et al) [X] 1-3,11-15 * paragraphs [0028] - [0039] - [0050]; figures 2a-2f *; | [X]US2012306067 (TSAO PEI-HAW [TW], et al) [X] 1-3 * paragraphs [0012] - [0028]; figures 1-10 *; | [X]US2014264800 (GOWDA ARUN VIRUPAKSHA [US], et al) [X] 1-4 * paragraphs [0035] , [0061] - [0062] - [0064] - [0068]; figures 19,21 *; | [X]US2019237382 (KIM JAE CHOON [KR], et al) [X] 1-4 * paragraphs [0043] , [0051] - [0053]; figures 4,5,8 *; | [X]EP3869554 (HUAWEI TECH CO LTD [CN]) [X] 1-4 * paragraphs [0011] , [0017] - [0021] - [0030] , [0032]; figure 4; claim 7 * |