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EP4199073
European procedure
Extract from the Register of European Patents
EP About this file: EP4199073
| EP4199073 - ELECTRONIC DEVICE ADOPTING HEAT DISSIPATION STRUCTURE [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 05.07.2024 Database last updated on 15.01.2025 | |
| Former | Grant of patent is intended Status updated on 28.02.2024 | ||
| Former | Request for examination was made Status updated on 19.05.2023 | Most recent event Tooltip | 05.07.2024 | (Expected) grant | published on 07.08.2024 [2024/32] | Applicant(s) | For all designated states Winchain Material Technology Co., Ltd. 1 F., No. 62, Songzhu Street Niaosong District Kaohsiung City 833169 / TW | [2023/45] |
| Former [2023/25] | For all designated states Morningrich Technology Co., Ltd No. 108-2, Sec. 1 Guangfu Rd. Fongshan Dist. Kaohsiung City Kao hsiung 83067 / TW | Inventor(s) | 01 /
LIN, Chiu-Lang Kaohsiung City / TW | [2023/25] | Representative(s) | V.O. P.O. Box 87930 2508 DH Den Haag / NL | [2023/25] | Application number, filing date | 23154949.4 | 19.01.2022 | [2023/25] | Priority number, date | TW20210202467U | 09.03.2021 Original published format: TW 110202467 U | [2023/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4199073 | Date: | 21.06.2023 | Language: | EN | [2023/25] | Type: | B1 Patent specification | No.: | EP4199073 | Date: | 07.08.2024 | Language: | EN | [2024/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.05.2023 | Classification | IPC: | H01L23/36, H01L23/24, H01L23/42 | [2023/25] | CPC: |
H01L23/36 (EP);
H01L23/24 (EP);
H01L23/3135 (EP);
H01L23/42 (EP);
H01L23/04 (EP)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/25] | Title | German: | ELEKTRONISCHE VORRICHTUNG MIT WÄRMEABLEITUNGSSTRUKTUR | [2023/25] | English: | ELECTRONIC DEVICE ADOPTING HEAT DISSIPATION STRUCTURE | [2023/25] | French: | DISPOSITIF ÉLECTRONIQUE ADOPTANT UNE STRUCTURE DE DISSIPATION DE CHALEUR | [2023/25] | Examination procedure | 03.02.2023 | Examination requested [2023/25] | 17.10.2023 | Amendment by applicant (claims and/or description) | 17.10.2023 | Date on which the examining division has become responsible | 29.02.2024 | Communication of intention to grant the patent | 24.06.2024 | Fee for grant paid | 24.06.2024 | Fee for publishing/printing paid | 24.06.2024 | Receipt of the translation of the claim(s) | Parent application(s) Tooltip | EP22152268.3 / EP4057337 | Fees paid | Renewal fee | 12.12.2023 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US5931222 (TOY HILTON T [US], et al); | [A]WO2020162417 (SONY INTERACTIVE ENTERTAINMENT INC [JP]); | [A]CN211982421U (MORNINGRICH TECH CO LTD); | [P]EP3923317 (SONY INTERACTIVE ENTERTAINMENT INC [JP]) |