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EP0083089
European procedure
Extract from the Register of European Patents
EP About this file: EP0083089
| EP0083089 - Process for forming self-aligned metallization patterns for semiconductor devices [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 30.03.1989 Database last updated on 22.04.2025 | Most recent event Tooltip | 30.03.1989 | No opposition filed within time limit | published on 17.05.1989 [1989/20] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
| Former [1983/27] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Abbas, Shakir Ahmed Brothers Road Wappingers Falls New York 12590 / US | 02 /
Magdo, Ingrid Emese Frances Drive Hopewell Junction New York 12533 / US | [1983/27] | Representative(s) | Möhlen, Wolfgang IBM Corporation Säumerstrasse 4 8803 Rüschlikon / CH | [N/P] |
| Former [1983/27] | Möhlen, Wolfgang C., Dipl.-Ing. IBM Corporation Säumerstrasse 4 CH-8803 Rüschlikon / CH | Application number, filing date | 82111971.6 | 27.12.1982 | [1983/27] | Priority number, date | US19810335894 | 30.12.1981 Original published format: US 335894 | [1983/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0083089 | Date: | 06.07.1983 | Language: | EN | [1983/27] | Type: | A3 Search report | No.: | EP0083089 | Date: | 23.01.1985 | Language: | EN | [1985/04] | Type: | B1 Patent specification | No.: | EP0083089 | Date: | 01.06.1988 | Language: | EN | [1988/22] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.11.1984 | Classification | IPC: | H01L21/60, H01L23/48 | [1983/27] | CPC: |
H10D10/051 (EP,US);
H01L21/033 (EP,US);
H01L21/76801 (EP,US);
H01L21/76832 (EP,US);
H01L23/485 (EP,US);
H10D30/0223 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB [1983/27] | Title | German: | Verfahren zum Herstellen eines selbstausrichtenden metallischen Musters für Halbleiteranordnungen | [1983/27] | English: | Process for forming self-aligned metallization patterns for semiconductor devices | [1983/27] | French: | Procédé pour la fabrication d'une configuration métallique par auto-alignement pour dispositifs semi-conducteurs | [1983/27] | File destroyed: | 15.01.2000 | Examination procedure | 21.10.1983 | Examination requested [1983/52] | 28.08.1986 | Despatch of a communication from the examining division (Time limit: M04) | 08.12.1986 | Reply to a communication from the examining division | 11.08.1987 | Despatch of communication of intention to grant (Approval: ) | 24.11.1987 | Communication of intention to grant the patent | 12.01.1988 | Fee for grant paid | 12.01.1988 | Fee for publishing/printing paid | Opposition(s) | 02.03.1989 | No opposition filed within time limit [1989/20] | Fees paid | Renewal fee | 11.12.1984 | Renewal fee patent year 03 | 13.12.1985 | Renewal fee patent year 04 | 12.12.1986 | Renewal fee patent year 05 | 11.12.1987 | Renewal fee patent year 06 |
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