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Extract from the Register of European Patents

EP About this file: EP0126292

EP0126292 - Semiconductor device having an element isolation layer and method of manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  29.09.1988
Database last updated on 26.03.2025
Most recent event   Tooltip29.09.1988No opposition filed within time limitpublished on 17.11.1988 [1988/46]
Applicant(s)For all designated states
Kabushiki Kaisha Toshiba
72, Horikawa-cho, Saiwai-ku Kawasaki-shi
Kanagawa-ken 210-8572 / JP
[N/P]
Former [1984/48]For all designated states
KABUSHIKI KAISHA TOSHIBA
72, Horikawa-cho, Saiwai-ku
Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP
Inventor(s)01 / Maeda, Satoshi c/o Patent Division
Kabushiki Kaisha Toshiba 1-1 Shibaura 1-chome
Minato-ku Tokyo 105 / JP
02 / Iwai, Hiroshi c/o Patent Division
Kabushiki Kaisha Toshiba 1-1 Shibaura 1-chome
Minato-ku Tokyo 105 / JP
[1984/48]
Representative(s)Lehn, Werner, et al
Hoffmann Eitle, Patent- und Rechtsanwälte, Postfach 81 04 20
81904 München / DE
[N/P]
Former [1984/48]Lehn, Werner, Dipl.-Ing., et al
Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20
D-81904 München / DE
Application number, filing date84104279.916.04.1984
[1984/48]
Priority number, dateJP1983007042621.04.1983         Original published format: JP 7042683
JP1983007042721.04.1983         Original published format: JP 7042783
JP1983007042821.04.1983         Original published format: JP 7042883
JP1983007645330.04.1983         Original published format: JP 7645383
[1984/48]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP0126292
Date:28.11.1984
Language:EN
[1984/48]
Type: B1 Patent specification 
No.:EP0126292
Date:02.12.1987
Language:EN
[1987/49]
Search report(s)(Supplementary) European search report - dispatched on:EP13.08.1984
ClassificationIPC:H01L21/20, H01L21/76
[1984/48]
CPC:
H01L21/76294 (EP,US); H01L21/02381 (EP,US); H01L21/0242 (EP,US);
H01L21/02532 (EP,US); H01L21/02639 (EP,US); H01L21/268 (EP,US)
Designated contracting statesDE,   FR,   GB,   IT [1984/48]
TitleGerman:Halbleitervorrichtung mit einer Schicht zur Isolation der Elemente und Verfahren zu ihrer Herstellung[1984/48]
English:Semiconductor device having an element isolation layer and method of manufacturing the same[1984/48]
French:Dispositif semi-conducteur avec une couche d'isolement entre les éléments et procédé de fabrication[1984/48]
Examination procedure16.04.1984Examination requested  [1984/48]
13.11.1985Despatch of a communication from the examining division (Time limit: M06)
13.05.1986Reply to a communication from the examining division
18.02.1987Despatch of communication of intention to grant (Approval: )
26.05.1987Communication of intention to grant the patent
12.08.1987Fee for grant paid
12.08.1987Fee for publishing/printing paid
Opposition(s)03.09.1988No opposition filed within time limit [1988/46]
Fees paidRenewal fee
18.04.1986Renewal fee patent year 03
15.04.1987Renewal fee patent year 04
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Documents cited:Search[X]US4101350  (POSSLEY GLEN G, et al);
 [A]DE3225398  (NIPPON ELECTRIC CO [JP]);
 [A]US3966501  (NOMURA KOUSI, et al);
 [A]US3728161  (MOLINE R)
 [X]  - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 25, no. 7A, December 1982, New York, USA; V.J. SILVESTRI et al. "Practical selective epitaxial process for oxide isolation", pages 3329-3330
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 24, no. 9, February 1982, New York, USA; W.K. CHU et al. "Process for producing dielectrically isolated single crystal silicon", pages 4734-4735
 [A]  - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 21, no. 5, October 1978, New York, USA; H.B. POGGE "Reestablishing parallelism after RIE etching", pages 1849-1850
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.