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EP0489429
European procedure
Extract from the Register of European Patents
EP About this file: EP0489429
| EP0489429 - Method of producing flexible printed-circuit board covered with cover layer [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.04.1997 Database last updated on 09.12.2024 | Most recent event Tooltip | 25.04.1997 | No opposition filed within time limit | published on 11.06.1997 [1997/24] | Applicant(s) | For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku Tokyo 160 / JP | [N/P] |
| Former [1992/24] | For all designated states Hitachi Chemical Co., Ltd. 1-1, Nishishinjuku 2-chome Shinjuku-ku, Tokyo 160 / JP | Inventor(s) | 01 /
Suzuki, Masakatsu Shisui-Ryo, Ozakata 240 Shimodate-shi, Ibaraki-ken / JP | 02 /
Imaizumi, Junichi 244-2-201, Ozakata Shimodate-shi, Ibaraki-ken / JP | 03 /
Nomura, Hiroshi 227 Oaza Ajito Oyama-shi, Tochigi-ken / JP | 04 /
Nagao, Kouichi 244-1-303, Ozakata Shimodate-shi, Ibaraki-ken / JP | 05 /
Katoh, Yasushi Shisui-Ryo, Ozakata 240 Shimodate-shi, Ibaraki-ken / JP | 06 /
Oti, Takato Shisui-Ryo, Ozakata 240 Shimodate-shi, Ibaraki-ken / JP | 07 /
Satou, Eikichi 3-30 Amagaya Oyama-shi, Tochigi-ken / JP | [1992/24] | Representative(s) | Strehl Schübel-Hopf & Partner Maximilianstrasse 54 80538 München / DE | [N/P] |
| Former [1992/24] | Strehl Schübel-Hopf Groening & Partner Maximilianstrasse 54 D-80538 München / DE | Application number, filing date | 91120854.4 | 04.12.1991 | [1992/24] | Priority number, date | JP19900400480 | 05.12.1990 Original published format: JP 40048090 | [1992/24] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0489429 | Date: | 10.06.1992 | Language: | EN | [1992/24] | Type: | B1 Patent specification | No.: | EP0489429 | Date: | 19.06.1996 | Language: | EN | [1996/25] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.03.1992 | Classification | IPC: | H05K3/28 | [1992/24] | CPC: |
B32B15/08 (EP,US);
C08G73/1046 (EP,US);
C08G73/1071 (EP,US);
C08J7/0427 (EP,US);
C08J7/043 (EP,US);
C09J179/08 (EP,US);
H01B3/306 (EP,US);
H05K3/281 (EP,US);
C08J2379/08 (EP,US);
C08J2479/00 (EP,US);
H05K1/0393 (EP,US);
H05K2201/0154 (EP,US);
H05K2203/066 (EP,US);
H05K2203/095 (EP,US);
H05K3/386 (EP,US);
| Designated contracting states | DE, FR, GB [1992/24] | Title | German: | Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte | [1992/24] | English: | Method of producing flexible printed-circuit board covered with cover layer | [1992/24] | French: | Procédé de fabrication d'un plaquette à circuit flexible recouverte d'une couche de recouvrement | [1992/24] | Examination procedure | 21.08.1992 | Examination requested [1992/43] | 01.09.1994 | Despatch of a communication from the examining division (Time limit: M04) | 10.01.1995 | Reply to a communication from the examining division | 24.07.1995 | Despatch of communication of intention to grant (Approval: Yes) | 15.12.1995 | Communication of intention to grant the patent | 12.03.1996 | Fee for grant paid | 12.03.1996 | Fee for publishing/printing paid | Opposition(s) | 20.03.1997 | No opposition filed within time limit [1997/24] | Fees paid | Renewal fee | 23.12.1993 | Renewal fee patent year 03 | 20.12.1994 | Renewal fee patent year 04 | 21.12.1995 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]FR1434935 (SANDERS ASSOCIATES INC); | [AD]EP0389951 (HITACHI CHEMICAL CO LTD [JP]) |