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EP0481736
European procedure
Extract from the Register of European Patents
About this file: EP0481736
| EP0481736 - Method of making an organic resin multi-layer wiring substrate [Right-click to bookmark this link] | |||
| Former [1992/17] | Organic resin multi-layer wiring substrate and method of making the same | ||
| [1998/32] | Status | No opposition filed within time limit Status updated on 01.12.2000 Database last updated on 20.02.2019 | Most recent event Tooltip | 01.12.2000 | No opposition filed within time limit | published on 17.01.2001 [2001/03] | Applicant(s) | For all designated states NEC Corporation 7-1, Shiba 5-chome Minato-ku Tokyo 108-8001 / JP | [N/P] |
| Former [2000/05] | For all designated states NEC CORPORATION 7-1, Shiba 5-chome, Minato-ku Tokyo / JP | ||
| Former [1992/17] | For all designated states NEC CORPORATION 7-1, Shiba 5-chome Minato-ku Tokyo / JP | Inventor(s) | 01 /
Kimbara, Kohji, c/o NEC Corporation 7-1, Shiba 5-chome Minato-ku, Tokyo / JP | [1992/17] | Representative(s) | Abnett, Richard Charles
, et al
Reddie & Grose 16 Theobalds Road London WC1X 8PL / GB | [N/P] |
| Former [1992/17] | Abnett, Richard Charles
, et al
REDDIE & GROSE 16 Theobalds Road London WC1X 8PL / GB | Application number, filing date | 91309498.3 | 16.10.1991 | [1992/17] | Priority number, date | JP19900278109 | 17.10.1990 Original published format: JP 27810990 | [1992/17] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0481736 | Date: | 22.04.1992 | Language: | EN | [1992/17] | Type: | A3 Search report | No.: | EP0481736 | Date: | 22.07.1992 | Language: | EN | [1992/30] | Type: | B1 Patent specification | No.: | EP0481736 | Date: | 02.02.2000 | Language: | EN | [2000/05] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 29.05.1992 | Classification | International: | H01L21/48, H01L23/538 | [1998/32] |
| Former International [1992/17] | H01L23/538, H01L21/48 | Designated contracting states | DE, FR, GB, NL [1992/17] | Title | German: | Verfahren zum Herstellen eines Mehrschicht-Leitersubstrats aus organischem Harz | [1998/32] | English: | Method of making an organic resin multi-layer wiring substrate | [1998/32] | French: | Procédé de la fabrication d'un substrat multi-couche de conducteurs à résine organique et procédé de sa fabrication | [1998/32] |
| Former [1992/17] | Mehrschicht-Leitersubstrat aus organischem Harz und Verfahren zum Herstellen desselben | ||
| Former [1992/17] | Organic resin multi-layer wiring substrate and method of making the same | ||
| Former [1992/17] | Substrat multi-couche de conducteurs à résine organique et procédé de sa fabrication | Examination procedure | 04.11.1991 | Examination requested [1992/17] | 21.09.1994 | Despatch of a communication from the examining division (Time limit: M06) | 25.03.1995 | Reply to a communication from the examining division | 13.03.1996 | Despatch of a communication from the examining division (Time limit: M02) | 15.05.1996 | Reply to a communication from the examining division | 08.04.1997 | Despatch of a communication from the examining division (Time limit: M06) | 07.10.1997 | Reply to a communication from the examining division | 15.01.1999 | Despatch of communication of intention to grant (Approval: No) | 16.07.1999 | Despatch of communication of intention to grant (Approval: later approval) | 27.07.1999 | Communication of intention to grant the patent | 27.10.1999 | Fee for grant paid | 27.10.1999 | Fee for publishing/printing paid | Opposition(s) | 03.11.2000 | No opposition filed within time limit [2001/03] | Fees paid | Renewal fee | 20.10.1993 | Renewal fee patent year 03 | 26.10.1994 | Renewal fee patent year 04 | 21.10.1995 | Renewal fee patent year 05 | 25.10.1996 | Renewal fee patent year 06 | 29.10.1997 | Renewal fee patent year 07 | 28.10.1998 | Renewal fee patent year 08 | 14.10.1999 | Renewal fee patent year 09 | Documents cited: | Search | [X]US4812191 (HO CHUNG W [US], et al); | [Y]EP0327398 (RAYCHEM LTD [GB]) |