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EP0684644
European procedure
Extract from the Register of European Patents
EP About this file: EP0684644
| EP0684644 - Method for manufacturing bump leaded film carrier type semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 13.12.2002 Database last updated on 26.03.2025 | Most recent event Tooltip | 17.02.2006 | Lapse of the patent in a contracting state New state(s): FR | published on 05.04.2006 [2006/14] | Applicant(s) | For all designated states NEC Corporation 7-1, Shiba 5-chome Minato-ku Tokyo 108-8001 / JP | [N/P] |
| Former [2002/06] | For all designated states NEC CORPORATION 7-1, Shiba 5-chome, Minato-ku Tokyo / JP | ||
| Former [1995/48] | For all designated states NEC CORPORATION 7-1, Shiba 5-chome Minato-ku Tokyo / JP | Inventor(s) | 01 /
Kata, Keiichiro c/o NEC Corp., 7-1, Shiba 5-chome, Minato-ku Tokyo / JP | 02 /
Matsuda, Shuichi c/o NEC Corp., 7-1, Shiba 5-chome, Minato-ku Tokyo / JP | 03 /
Hagimoto, Eiji c/o NEC Corp., 7-1, Shiba 5-chome, Minato-ku Tokyo / JP | [1995/48] | Representative(s) | Baronetzky, Klaus, et al Splanemann Patentanwälte Partnerschaft Rumfordstrasse 7 80469 München / DE | [N/P] |
| Former [1995/48] | Baronetzky, Klaus, Dipl.-Ing., et al Patentanwälte Dipl.-Ing. R. Splanemann, Dr. B. Reitzner, Dipl.-Ing. K. Baronetzky Tal 13 D-80331 München / DE | Application number, filing date | 95108029.0 | 24.05.1995 | [1995/48] | Priority number, date | JP19940110857 | 25.05.1994 Original published format: JP 11085794 | [1995/48] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0684644 | Date: | 29.11.1995 | Language: | EN | [1995/48] | Type: | B1 Patent specification | No.: | EP0684644 | Date: | 06.02.2002 | Language: | EN | [2002/06] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.09.1995 | Classification | IPC: | H01L23/31, H01L23/498 | [1995/48] | CPC: |
H01L23/4985 (EP,US);
H01L21/60 (KR);
H01L23/3107 (EP,US);
H01L2224/16 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/83191 (EP,US);
H01L2924/01046 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/15151 (EP,US);
H01L2924/15173 (EP,US);
H01L2924/15311 (EP,US);
H01L2924/3025 (EP,US);
Y10T29/49121 (EP,US)
(-)
| C-Set: |
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US);
H01L2924/15311, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP) | Designated contracting states | DE, FR, GB, NL [1995/48] | Title | German: | Herstellungsverfahren einer mit Anschlusshöckern versehenen Halbleiteranordnung vom Filmträgertyp | [1995/48] | English: | Method for manufacturing bump leaded film carrier type semiconductor device | [1995/48] | French: | Procédé de fabrication d'un dispositif semi-conducteur du type à bande de support avec plots de connexion | [1995/48] | Examination procedure | 29.12.1995 | Examination requested [1996/09] | 31.01.1997 | Despatch of a communication from the examining division (Time limit: M06) | 08.08.1997 | Reply to a communication from the examining division | 21.11.1997 | Despatch of a communication from the examining division (Time limit: M06) | 30.05.1998 | Reply to a communication from the examining division | 18.12.1998 | Despatch of a communication from the examining division (Time limit: M06) | 18.06.1999 | Reply to a communication from the examining division | 05.11.1999 | Despatch of a communication from the examining division (Time limit: M04) | 10.03.2000 | Reply to a communication from the examining division | 28.05.2001 | Despatch of communication of intention to grant (Approval: Yes) | 27.07.2001 | Communication of intention to grant the patent | 29.10.2001 | Fee for grant paid | 29.10.2001 | Fee for publishing/printing paid | Divisional application(s) | EP99115292.7 / EP0959499 | Opposition(s) | 07.11.2002 | No opposition filed within time limit [2003/05] | Fees paid | Renewal fee | 15.05.1997 | Renewal fee patent year 03 | 11.05.1998 | Renewal fee patent year 04 | 28.04.1999 | Renewal fee patent year 05 | 26.04.2000 | Renewal fee patent year 06 | 25.04.2001 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | FR | 06.02.2002 | NL | 06.02.2002 | GB | 24.05.2002 | [2006/14] |
| Former [2003/17] | NL | 06.02.2002 | |
| GB | 24.05.2002 | ||
| Former [2003/08] | NL | 06.02.2002 | Documents cited: | Search | [XY]JPH05235091 ; | [A]JPH06140462 ; | [Y]JPH04164344 ; | [Y]JPH0582586 ; | [XAY]EP0459493 (TOSHIBA KK [JP]) [X] 45 * the whole document * [A] 1,7,14,18 [Y] 46-48; | US5350947 [ ] (TAKEKAWA KOUICHI [JP], et al) [ ] * the whole document *; | [PXA]US5367435 (ANDROS FRANK E [US], et al) [PX] 14,18 * the whole document * [PA] 36,40,52,61 | [XY] - PATENT ABSTRACTS OF JAPAN, (19931216), vol. 017, no. 687, Database accession no. (E - 1478), & JP05235091 A 19930910 (NEC CORP) [X] 1,2,4,7-9,11,23,24,26,29-31,49,55-58,60 * the whole document * [Y] 5,6,12,13,27,28,46,50,51 | [A] - PATENT ABSTRACTS OF JAPAN, (19940817), vol. 018, no. 442, Database accession no. (E - 1593), & JP06140462 A 19940520 (NEC CORP) [A] 3,10 * abstract * | [Y] - PATENT ABSTRACTS OF JAPAN, (19920928), vol. 016, no. 465, Database accession no. (E - 1270), & JP04164344 A 19920610 (NEC CORP) [Y] 5,12,27,47,50 * abstract * | [Y] - PATENT ABSTRACTS OF JAPAN, (19930803), vol. 017, no. 415, Database accession no. (E - 1407), & JP05082586 A 19930402 (MITSUBISHI ELECTRIC CORP) [Y] 6,13,28,48,51 * abstract * | Examination | WO9211654 | - R. Tummala et al. "Microelectronics Packaging Handbook", 1989, 419-423. | by applicant | JPS5356969 | JPH02229445 | JPH04154136 | JPH0547847 | JPH0582586 |