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EP0714127
European procedure
Extract from the Register of European Patents
EP About this file: EP0714127
| EP0714127 - Semiconductor package [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.12.2003 Database last updated on 26.03.2025 | Most recent event Tooltip | 05.12.2003 | No opposition filed within time limit | published on 21.01.2004 [2004/04] | Applicant(s) | For all designated states Kabushiki Kaisha Toshiba 72, Horikawa-cho, Saiwai-ku Kawasaki-shi Kanagawa-ken 210-8572 / JP | [N/P] |
| Former [2003/05] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210-8572 / JP | ||
| Former [1996/22] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210 / JP | Inventor(s) | 01 /
Endo, Mitsuyoshi c/o K.K. Toshiba, 1-1, Shibaura 1-chome, Minato-ku Tokyo / JP | 02 /
Asai, Hironori c/o K.K. Toshiba, 1-1, Shibaura 1-chome, Minato-ku Tokyo / JP | 03 /
Yano, Keiichi c/o K.K. Toshiba, 1-1, Shibaura 1-chome, Minato-ku Tokyo / JP | 04 /
Sato, Yoshitoshi c/o K.K. Toshiba, 1-1, Shibaura 1-chome, Minato-ku Tokyo / JP | [1996/22] | Representative(s) | Henkel & Partner mbB Patentanwaltskanzlei, Rechtsanwaltskanzlei Maximiliansplatz 21 80333 München / DE | [N/P] |
| Former [1996/22] | Henkel, Feiler, Hänzel & Partner Möhlstrasse 37 81675 München / DE | Application number, filing date | 96102179.7 | 27.11.1992 | [1996/22] | Priority number, date | JP19910314601 | 28.11.1991 Original published format: JP 31460191 | JP19910316999 | 29.11.1991 Original published format: JP 31699991 | JP19920127280 | 20.05.1992 Original published format: JP 12728092 | [1996/22] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0714127 | Date: | 29.05.1996 | Language: | EN | [1996/22] | Type: | A3 Search report | No.: | EP0714127 | Date: | 31.07.1996 | [1996/31] | Type: | B1 Patent specification | No.: | EP0714127 | Date: | 29.01.2003 | Language: | EN | [2003/05] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 12.06.1996 | Classification | IPC: | H01L23/498, H01L23/15 | [1996/22] | CPC: |
H01L23/13 (EP,US);
H01L23/02 (KR);
H01L23/10 (EP,US);
H01L23/15 (EP,US);
H01L23/3675 (EP,US);
H01L23/3731 (EP,US);
H01L23/49822 (EP,US);
H01L23/49838 (EP,US);
H01L2224/48227 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/15153 (EP,US);
H01L2924/1517 (EP,US);
H01L2924/15174 (EP,US);
H01L2924/15312 (EP,US);
H01L2924/16152 (EP,US);
H01L2924/16195 (EP,US);
H01L2924/30107 (EP,US);
H01L2924/3011 (EP,US);
H01L2924/3025 (EP,US)
(-)
| C-Set: |
H01L2924/00014, H01L2224/05599 (US,EP);
H01L2924/00014, H01L2224/45099 (EP,US) | Designated contracting states | DE, FR, GB [1996/22] | Title | German: | Halbleitergehäuse | [1996/22] | English: | Semiconductor package | [1996/22] | French: | Boîtier pour semi-conducteur | [1996/22] | Examination procedure | 14.02.1996 | Examination requested [1996/22] | 21.12.1998 | Despatch of a communication from the examining division (Time limit: M04) | 27.04.1999 | Reply to a communication from the examining division | 02.10.2000 | Despatch of a communication from the examining division (Time limit: M04) | 24.01.2001 | Reply to a communication from the examining division | 14.03.2002 | Despatch of communication of intention to grant (Approval: Yes) | 11.06.2002 | Communication of intention to grant the patent | 20.09.2002 | Fee for grant paid | 20.09.2002 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP92120332.9 / EP0544329 | Opposition(s) | 30.10.2003 | No opposition filed within time limit [2004/04] | Fees paid | Renewal fee | 14.02.1996 | Renewal fee patent year 03 | 14.02.1996 | Renewal fee patent year 04 | 27.11.1996 | Renewal fee patent year 05 | 28.11.1997 | Renewal fee patent year 06 | 26.11.1998 | Renewal fee patent year 07 | 30.11.1999 | Renewal fee patent year 08 | 13.11.2000 | Renewal fee patent year 09 | 14.11.2001 | Renewal fee patent year 10 | 13.11.2002 | Renewal fee patent year 11 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4827327 (MIYAUCHI AKIRA [JP], et al) [A] 1-3 * figures 1,2 *; | [A]JPS60183746 ; | [A]EP0265367 (UNITED TECHNOLOGIES CORP [US]) [A] 1-3 * figures 1,2 * | [A] - PATENT ABSTRACTS OF JAPAN, (19860130), vol. 010, no. 024, Database accession no. (E - 377), & JP60183746 A 19850919 (HITACHI SEISAKUSHO KK) [A] 1-3 * abstract * | Examination | US5018004 | EP0474176 |