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EP1089328

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Extract from the Register of European Patents

EP About this file: EP1089328

EP1089328 - Method for manufacturing of a semiconductor device [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 24.05.2002 Database last updated on 23.04.2024
Most recent event Tooltip	20.06.2008	Change - applicant	published on 23.07.2008 [2008/30]
Applicant(s)	For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE
	For all designated states Semiconductor 300 GmbH & Co. KG Postfach 10 04 46 01074 Dresden / DE
	For all designated states MOTOROLA, INC. 1303 East Algonquin Road Schaumburg, IL 60196 / US
	[2008/30]
Former [2001/14]	For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81541 München / DE
	For all designated states Semiconductor 300 GmbH & Co. KG Postfach 10 04 46 01074 Dresden / DE
	For all designated states MOTOROLA, INC. 1303 East Algonquin Road Schaumburg, IL 60196 / US
Inventor(s)	01 / Kraxenberger, Manfred An den Eichen 4 01458 Ottendorf / DE
	02 / Kneupel, Ines Zeunerstrasse 73 01069 Dresden / DE
	03 / Spuler, Bruno Ewald Kluge Strasse 82 01478 Weixdorf / DE
	04 / Schedel, Thorsten Kunitzteichweg 2 01109 Dresden / DE
	05 / Mautz, Karl Josef Hermann Strasse 10A 01326 Dresden / DE
	[2001/14]
Representative(s)	Epping, Wilhelm, et al Epping Hermann Fischer Patentanwaltsgesellschaft mbH Schlossschmidstrasse 5 80639 München / DE
	[N/P]
Former [2001/14]	Epping, Wilhelm, Dipl.-Ing., et al Epping Hermann & Fischer Postfach 12 10 26 80034 München / DE
Application number, filing date	99119038.0	29.09.1999
	[2001/14]
Filing language	EN
Procedural language	EN
Publication	Type:	A1 Application with search report
	No.:	EP1089328
	Date:	04.04.2001
	Language:	EN
	[2001/14]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	10.03.2000
Classification	IPC:	H01L21/302	[2001/14]
	CPC:	H01L21/302 (EP,US); Y10S438/928 (EP,US)
Designated contracting states	(deleted) [2002/01]
Former [2001/14]	AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE
Title	German:	Verfahren zur Herstellung eines Halbleiterbauelementes	[2001/14]
	English:	Method for manufacturing of a semiconductor device	[2001/14]
	French:	Méthode de formation d'un dispositif semiconducteur	[2001/14]
Examination procedure	08.10.2001	Application deemed to be withdrawn, date of legal effect [2002/28]
	04.02.2002	Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2002/28]
Fees paid	Renewal fee
	24.09.2001	Renewal fee patent year 03
	Penalty fee
	Penalty fee Rule 85a EPC 1973
	13.11.2001	AT M01 Not yet paid
	13.11.2001	BE M01 Not yet paid
	13.11.2001	CH M01 Not yet paid
	13.11.2001	CY M01 Not yet paid
	13.11.2001	DE M01 Not yet paid
	13.11.2001	DK M01 Not yet paid
	13.11.2001	ES M01 Not yet paid
	13.11.2001	FI M01 Not yet paid
	13.11.2001	FR M01 Not yet paid
	13.11.2001	GB M01 Not yet paid
	13.11.2001	GR M01 Not yet paid
	13.11.2001	IE M01 Not yet paid
	13.11.2001	IT M01 Not yet paid
	13.11.2001	LU M01 Not yet paid
	13.11.2001	MC M01 Not yet paid
	13.11.2001	NL M01 Not yet paid
	13.11.2001	PT M01 Not yet paid
	13.11.2001	SE M01 Not yet paid
	Penalty fee Rule 85b EPC 1973
	13.11.2001	M01 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[Y]EP0701276 (SIEMENS AG [DE]) [Y] 5-9 * the whole document *;
		[Y]US5599722 (SUGISAKA TAKAYUKI [JP], et al) [Y] 1-3,5-9 * column 1, line 15 - column 2, line 48 * * column 3, lines 50-64 * * column 5, line 59 - column 6, line 65; figures 1-4 *;
		[DY]US5856230 (JANG SE AUG [KR]) [DY] 1-3,5-9 * column 1, line 6 - column 2, line 61; figure 1 *;
		[A]US5893760 (MIKATA YUICHI [JP], et al) [A] 1-3* column 7, line 34 - column 8, line 61; figure 8 *

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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