-
EP1154475
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP1154475
| EP1154475 - Semiconductor device and semiconductor device manufacturing method [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 17.11.2006 Database last updated on 22.08.2024 | Most recent event Tooltip | 06.06.2008 | Change - representative | published on 09.07.2008 [2008/28] | Applicant(s) | For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP | [N/P] |
| Former [2001/46] | For all designated states Oki Electric Industry Co., Ltd. 7-12, Toranomon 1-chome Minato-ku Tokyo / JP | Inventor(s) | 01 /
Nakamura, Akio Oki Electric Industry, 7-12, Toranomon 1-chome Minato-ku, Tokyo / JP | [2001/46] | Representative(s) | Kirschner, Klaus Dieter, et al Puschmann Borchert Bardehle Patentanwälte Partnerschaft Postfach 10 12 31 80086 München / DE | [N/P] |
| Former [2008/28] | Kirschner, Klaus Dieter, et al Puschmann & Borchert Patentanwälte Bajuwarenring 21 82041 Oberhaching / DE | ||
| Former [2006/40] | Kirschner, Klaus Dieter, et al Kirschner Patentanwaltskanzlei Südliche Münchnerstrasse 53 82031 Grünwald / DE | ||
| Former [2001/46] | Kirschner, Klaus Dieter, Dipl.-Phys. Schneiders & Behrendt Rechtsanwälte - Patentanwälte Sollner Strasse 38 81479 München / DE | Application number, filing date | 00109918.3 | 10.05.2000 | [2001/46] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1154475 | Date: | 14.11.2001 | Language: | EN | [2001/46] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.11.2000 | Classification | IPC: | H01L23/31 | [2001/46] | CPC: |
H01L23/3114 (EP);
H01L2224/023 (EP);
H01L2224/05569 (EP);
H01L2224/05573 (EP);
H01L2224/06135 (EP);
H01L2224/16 (EP);
H01L2224/274 (EP);
H01L29/0657 (EP);
H01L2924/01078 (EP);
H01L2924/10157 (EP)
(-)
| C-Set: |
H01L2224/023, H01L2924/0001 (EP)
| Designated contracting states | DE, FR, GB [2002/31] |
| Former [2001/46] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE | Title | German: | Halbleiterelement und Halbleiterelement-Herstellungsverfahren | [2001/46] | English: | Semiconductor device and semiconductor device manufacturing method | [2001/46] | French: | Elément semi-conducteur et méthode de fabrication d'un élément semi-conducteur | [2001/46] | Examination procedure | 14.05.2002 | Examination requested [2002/29] | 21.02.2005 | Despatch of a communication from the examining division (Time limit: M04) | 23.06.2005 | Reply to a communication from the examining division | 20.02.2006 | Communication of intention to grant the patent | 04.07.2006 | Application deemed to be withdrawn, date of legal effect [2006/51] | 04.08.2006 | Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time [2006/51] | Fees paid | Renewal fee | 31.05.2002 | Renewal fee patent year 03 | 02.06.2003 | Renewal fee patent year 04 | 01.06.2004 | Renewal fee patent year 05 | 31.05.2005 | Renewal fee patent year 06 | 27.04.2006 | Renewal fee patent year 07 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA]US5977641 (TAKAHASHI TAKUYA [JP], et al) [X] 1-3 * the whole document * [A] 4,7,10; | [X]JPH11224890 ; | [A]US5989982 (YOSHIKAZU TAKAHASHI [JP]) [A] 1,3,7,10 * the whole document * | [X] - PATENT ABSTRACTS OF JAPAN, (19991130), vol. 1999, no. 13, & JP11224890 A 19990817 (MITSUI HIGH TEC INC) [X] 1 * the whole document * |