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Extract from the Register of European Patents

EP About this file: EP1067570

EP1067570 - An assembling apparatus and an assembling method [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  05.01.2007
Database last updated on 19.10.2024
Most recent event   Tooltip05.01.2007Application deemed to be withdrawnpublished on 07.02.2007  [2007/06]
Applicant(s)For all designated states
Sumitomo Wiring Systems, Ltd.
1-14, Nishisuehiro-cho Yokkaichi-city
Mie 510-8503 / JP
[N/P]
Former [2001/02]For all designated states
Sumitomo Wiring Systems, Ltd.
1-14, Nishisuehiro-cho
Yokkaichi-City, Mie, 510-8503 / JP
Inventor(s)01 / Kagei, Hiroshi, c/o Sumitomo Wiring Systems, Ltd.
1-14, Nishisuehiro-cho
Yokkaichi-city, Mie 510-8503 / JP
 [2001/02]
Representative(s)Müller-Boré & Partner Patentanwälte PartG mbB
Friedenheimer Brücke 21
80639 München / DE
[N/P]
Former [2001/02]Müller-Boré & Partner Patentanwälte
Grafinger Strasse 2
81671 München / DE
Application number, filing date00114093.807.07.2000
[2001/02]
Priority number, dateJP1999019646409.07.1999         Original published format: JP 19646499
JP1999022367706.08.1999         Original published format: JP 22367799
[2001/02]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1067570
Date:10.01.2001
Language:EN
[2001/02]
Type: A3 Search report 
No.:EP1067570
Date:17.12.2003
[2003/51]
Search report(s)(Supplementary) European search report - dispatched on:EP03.11.2003
ClassificationIPC:H01H11/00, H01H85/02, H05K13/04
[2003/51]
CPC:
H01H85/0208 (EP,US); Y10T29/4913 (EP,US); Y10T29/53174 (EP,US);
Y10T29/53178 (EP,US); Y10T29/53187 (EP,US); Y10T29/53313 (EP,US);
Y10T29/53365 (EP,US); Y10T29/5337 (EP,US); Y10T29/534 (EP,US);
Y10T29/53435 (EP,US) (-)
Former IPC [2001/02]H01H11/00
Designated contracting statesGB [2004/37]
Former [2001/02]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Montagevorrichtung und Montageverfahren[2001/02]
English:An assembling apparatus and an assembling method[2001/02]
French:Appareil et méthode d'assemblage[2001/02]
Examination procedure03.08.2000Examination requested  [2001/02]
18.06.2004Loss of particular rights, legal effect: designated state(s)
08.10.2004Despatch of communication of loss of particular rights: designated state(s) DE, FR
07.04.2006Despatch of a communication from the examining division (Time limit: M04)
18.08.2006Application deemed to be withdrawn, date of legal effect  [2007/06]
21.09.2006Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2007/06]
Fees paidRenewal fee
25.07.2002Renewal fee patent year 03
23.07.2003Renewal fee patent year 04
27.07.2004Renewal fee patent year 05
13.07.2005Renewal fee patent year 06
Penalty fee
Penalty fee Rule 85a EPC 1973
22.07.2004DE   M01   Not yet paid
22.07.2004FR   M01   Not yet paid
Additional fee for renewal fee
31.07.200607   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]EP0730288  (GLUTH SYSTEMTECHNIK GMBH [DE], et al) [A] 1,5,7,11 * the whole document *;
 [A]WO9836629  (MATSUSHITA ELECTRIC IND CO LTD [JP], et al) [A] 1,5,7,11 * the whole document *;
 [A]GB2125017  (BURROUGHS CORP) [A] 1,5,7,11 * abstract *;
 [A]US4197637  (HONDA YASUHIRO [JP]) [A] 1,5,7,11 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.