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Extract from the Register of European Patents

EP About this file: EP1075027

EP1075027 - Contacting of metal interconnections of integrated semiconductor chips [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  23.07.2010
Database last updated on 27.07.2024
Most recent event   Tooltip23.07.2010Application deemed to be withdrawnpublished on 25.08.2010  [2010/34]
Applicant(s)For all designated states
Infineon Technologies AG
Am Campeon 1-12
85579 Neubiberg / DE
[2010/22]
Former [2001/06]For all designated states
Infineon Technologies AG
St.-Martin-Strasse 53
81541 München / DE
Inventor(s)01 / Baenisch, Andreas
Annette-Kolb-Anger 13
81737 München / DE
02 / Kling, Sabine
Säbener Platz 6
81545 München / DE
 [2001/06]
Representative(s)Epping - Hermann - Fischer
Patentanwaltsgesellschaft mbH
Postfach 20 07 34
80007 München / DE
[N/P]
Former [2001/50]Epping Hermann & Fischer
Postfach 12 10 26
80034 München / DE
Former [2001/06]Zedlitz, Peter, Dipl.-Inf.
Patentanwalt, Postfach 22 13 17
80503 München / DE
Application number, filing date00116723.802.08.2000
[2001/06]
Priority number, dateDE199913686205.08.1999         Original published format: DE 19936862
[2001/06]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report 
No.:EP1075027
Date:07.02.2001
Language:DE
[2001/06]
Type: A3 Search report 
No.:EP1075027
Date:29.06.2005
[2005/26]
Search report(s)(Supplementary) European search report - dispatched on:EP19.05.2005
ClassificationIPC:H01L23/528
[2001/06]
CPC:
H01L23/528 (EP,US); H01L21/3213 (KR); H01L23/5226 (EP,US);
H01L2924/0002 (EP,US); Y10S257/908 (EP,US); Y10S257/909 (EP,US)
C-Set:
H01L2924/0002, H01L2924/00 (EP,US)
Designated contracting statesDE,   FR,   GB,   IE,   IT [2006/12]
Former [2001/06]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Kontaktierung von Metalleiterbahnen eines integrierten Halbleiterchips[2001/06]
English:Contacting of metal interconnections of integrated semiconductor chips[2001/06]
French:Contact d'interconnections métalliques d'une puce semiconductrice intégrée[2001/06]
Examination procedure28.12.2005Examination requested  [2006/09]
31.03.2009Despatch of a communication from the examining division (Time limit: M06)
09.10.2009Reply to a communication from the examining division
02.03.2010Application deemed to be withdrawn, date of legal effect  [2010/34]
08.04.2010Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2010/34]
Fees paidRenewal fee
21.08.2002Renewal fee patent year 03
25.08.2003Renewal fee patent year 04
23.08.2004Renewal fee patent year 05
19.08.2005Renewal fee patent year 06
29.08.2006Renewal fee patent year 07
16.08.2007Renewal fee patent year 08
12.08.2008Renewal fee patent year 09
Penalty fee
Additional fee for renewal fee
31.08.200910   M06   Not yet paid
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]JPH0377324  ;
 [A]JPH0541455  (KAWASAKI STEEL CO) [A] 1,3-6 * the whole document *;
 [A]US5332923  (TAKEUCHI KIYOSHI [JP]) [A] * the whole document *;
 [A]JPH08306786  (RICOH KK) [A] 1,3-6 * the whole document *;
 [Y]DE19531651  (BOSCH GMBH ROBERT [DE]) [Y] 1-6 * column 1, line 18 - column 3, line 33 * * figures 1,2,4,5 *;
 [Y]JPH10214893  (HITACHI LTD) [Y] 1-6 * paragraphs [0012] - [0018] * * paragraphs [0024] - [0029] * * paragraphs [0051] - [0111] * * paragraphs [0139] - [0155] * * paragraphs [0160] , [0170] * * paragraphs [0192] - [0200] * * figures 1-3,11-19,26-33 * * figures 37-44,46-51 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19910624), vol. 015, no. 246, Database accession no. (E - 1081), & JP03077324 A 19910402 (MITSUBISHI ELECTRIC CORP) [A] 1,3,5,6 * abstract * * figures 1-4 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.