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Extract from the Register of European Patents

EP About this file: EP1077475

EP1077475 - Method of micromachining a multi-part cavity [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  16.10.2009
Database last updated on 14.09.2024
Most recent event   Tooltip16.10.2009Application deemed to be withdrawnpublished on 18.11.2009  [2009/47]
Applicant(s)For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, CA 95054 / US
[N/P]
Former [2001/08]For all designated states
Applied Materials, Inc.
3050 Bowers Avenue
Santa Clara, California 95054 / US
Inventor(s)01 / Podlesnik, Dragan V.
1736 San Creek Drive, Apt. 209
Palo Alto, CA 94304 / US
02 / Chinn, Jeffrey D.
605 St. Croix Lane
Foster City, CA 94404 / US
03 / Lill, Thorsten B.
880 East Fremont, Apt. 634
Sunnyvale, CA 94087 / US
04 / Pan, Shaoher X.
1133 Kelez Drive
San Jose, CA 95120 / US
05 / Khan, Anisul
125 Connemare Way, Apt. 81
Sunnyvale, CA 94087 / US
06 / Wang, Joan Yiqiong
2678 Calico Ct.
Morgan Hill, CA 95037 / US
07 / Li, Maocheng
725 Honda Way
Fremont, CA 94539 / US
 [2001/08]
Representative(s)Kirschner, Klaus Dieter, et al
Puschmann Borchert Bardehle
Patentanwälte Partnerschaft
Postfach 10 12 31
80086 München / DE
[N/P]
Former [2008/28]Kirschner, Klaus Dieter, et al
Puschmann & Borchert Patentanwälte Bajuwarenring 21
82041 Oberhaching / DE
Former [2006/40]Kirschner, Klaus Dieter, et al
Kirschner Patentanwaltskanzlei Südliche Münchnerstrasse 53
82031 Grünwald / DE
Former [2001/08]Kirschner, Klaus Dieter, Dipl.-Phys.
Schneiders & Behrendt Rechtsanwälte - Patentanwälte Sollner Strasse 38
81479 München / DE
Application number, filing date00117155.210.08.2000
[2001/08]
Priority number, dateUS1999037247711.08.1999         Original published format: US 372477
[2001/08]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1077475
Date:21.02.2001
Language:EN
[2001/08]
Type: A3 Search report 
No.:EP1077475
Date:02.04.2003
[2003/14]
Search report(s)(Supplementary) European search report - dispatched on:EP19.02.2003
ClassificationIPC:H01L21/3065, B81C1/00, H01L21/308, H01L21/768
[2003/01]
CPC:
H01L21/3065 (EP,US); H10B12/0387 (EP,US); B81C1/00119 (EP,US);
H01L21/3086 (EP,US); B81B2201/052 (EP,US); B81B2203/0315 (EP,US);
B81B2203/033 (EP,US); B81C2201/016 (EP,US) (-)
Former IPC [2001/08]H01L21/3065, B81C1/00
Designated contracting statesDE,   FR,   GB,   IT [2004/01]
Former [2001/08]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Verfahren zur Mikrobearbeitung einer Körperhölung mit mehrfachem Profil[2001/08]
English:Method of micromachining a multi-part cavity[2001/08]
French:Méthode pour la microfabrication d'une cavité à profil complexe[2001/08]
Examination procedure01.10.2003Examination requested  [2003/49]
06.06.2006Despatch of a communication from the examining division (Time limit: M06)
24.11.2006Reply to a communication from the examining division
09.01.2009Despatch of a communication from the examining division (Time limit: M04)
20.05.2009Application deemed to be withdrawn, date of legal effect  [2009/47]
25.06.2009Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2009/47]
Fees paidRenewal fee
30.08.2002Renewal fee patent year 03
06.08.2003Renewal fee patent year 04
06.08.2004Renewal fee patent year 05
08.08.2005Renewal fee patent year 06
07.08.2006Renewal fee patent year 07
03.08.2007Renewal fee patent year 08
08.08.2008Renewal fee patent year 09
Penalty fee
Additional fee for renewal fee
31.08.200910   M06   Not yet paid
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]JPH06177264  ;
 [X]US4472240  (KAMEYAMA SHUICHI [JP]);
 [X]EP0540262  (SGS THOMSON MICROELECTRONICS [US]);
 [XY]WO9418697  (CORNELL RES FOUNDATION INC [US]);
 [A]EP0680085  (TEXAS INSTRUMENTS INC [US]);
 [X]EP0729175  (IBM [US]);
 [Y]US5635423  (HUANG RICHARD J [US], et al);
 [X]US5686354  (AVANZINO STEVEN [US], et al);
 [X]EP0822582  (SURFACE TECH SYS LTD [GB]);
 [A]EP0862222  (NGK INSULATORS LTD [JP]);
 [A]US5916823  (LOU CHINE-GIE [TW], et al);
 [E]EP1049157  (ST MICROELECTRONICS SRL [IT])
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.