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Extract from the Register of European Patents

EP About this file: EP1168430

EP1168430 - Semiconductor device and method of manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  10.03.2006
Database last updated on 11.09.2024
Most recent event   Tooltip25.07.2008Change - representativepublished on 27.08.2008  [2008/35]
Applicant(s)For all designated states
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100-8310 / JP
[N/P]
Former [2002/01]For all designated states
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, Marunouchi 2-chome, Chiyoda-ku
Tokyo 100-8310 / JP
Inventor(s)01 / Matsumoto, Takuji
c/o Mitsubishi Denki K.K., 2-3, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100-8310 / JP
02 / Iwamatsu, Toshiaki
c/o Mitsubishi Denki K.K., 2-3, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100-8310 / JP
03 / Hirano, Yuuichi
c/o Mitsubishi Denki K.K., 2-3, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100-8310 / JP
 [2002/01]
Representative(s)Hofer, Dorothea, et al
Prüfer & Partner GbR
Patentanwälte
Sohnckestrasse 12
81479 München / DE
[N/P]
Former [2008/35]Hofer, Dorothea, et al
Prüfer & Partner GbR Patentanwälte Sohnckestrasse 12
81479 München / DE
Former [2006/14]Hofer, Dorothea, et al
Prüfer & Partner GbR Patentanwälte Harthauser Strasse 25 d
81545 München / DE
Former [2002/01]Prüfer, Lutz H., Dipl.-Phys., et al
PRÜFER & PARTNER GbR, Patentanwälte, Harthauser Strasse 25d
81545 München / DE
Application number, filing date00128270.622.12.2000
[2002/01]
Priority number, dateJP2000017181808.06.2000         Original published format: JP 2000171818
[2002/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1168430
Date:02.01.2002
Language:EN
[2002/01]
Type: B1 Patent specification 
No.:EP1168430
Date:04.05.2005
Language:EN
[2005/18]
Search report(s)(Supplementary) European search report - dispatched on:EP19.06.2001
ClassificationIPC:H01L21/762, H01L21/84, H01L21/314
[2002/01]
CPC:
H01L21/76264 (EP,US); H01L21/76 (KR); H01L21/84 (EP,US);
H01L21/02126 (EP,KR,US); H01L21/02129 (EP,KR,US); H01L21/02164 (EP,KR,US);
H01L21/0217 (EP,KR,US); H01L21/022 (EP,KR,US); H01L21/02271 (EP,KR,US);
H01L21/02274 (EP,KR,US); H01L21/3143 (US); H01L21/3185 (US);
H01L21/76283 (EP,US) (-)
Designated contracting statesDE,   FR,   GB [2002/38]
Former [2002/01]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:Halbleiterbauelement und Herstellungsverfahren[2002/01]
English:Semiconductor device and method of manufacturing the same[2002/01]
French:Dispositif semi-conducteur et méthode de fabrication[2002/01]
Examination procedure22.12.2000Request for accelerated examination filed
28.03.2001Decision about request for accelerated examination - accepted: Yes
31.08.2001Examination requested  [2002/01]
20.11.2001Despatch of a communication from the examining division (Time limit: M04)
22.03.2002Reply to a communication from the examining division
22.07.2002Despatch of a communication from the examining division (Time limit: M04)
04.11.2002Reply to a communication from the examining division
03.11.2003Date of oral proceedings
14.11.2003Minutes of oral proceedings despatched
17.08.2004Communication of intention to grant the patent
21.12.2004Fee for grant paid
21.12.2004Fee for publishing/printing paid
Opposition(s)07.02.2006No opposition filed within time limit [2006/17]
Fees paidRenewal fee
28.11.2002Renewal fee patent year 03
26.11.2003Renewal fee patent year 04
26.11.2004Renewal fee patent year 05
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Lapses during opposition  TooltipGB22.12.2005
[2007/11]
Documents cited:Search[Y]JPH06244180  ;
 [A]WO9718585  (ADVANCED MICRO DEVICES INC [US]) [A] 1,7* abstract *;
 [A]US5767549  (CHEN WEI [US], et al) [A] 1-10 * abstract *;
 [A]US5899712  (CHOI KI SIK [KR], et al) [A] 1,2,7,8,10 * abstract *;
 [Y]WO9933115  (ADVANCED MICRO DEVICES INC [US]) [Y] 1-10 * abstract *
 [Y]  - PATENT ABSTRACTS OF JAPAN, (19941129), vol. 018, no. 626, Database accession no. (E - 1636), & JP06244180 A 19940902 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 1-10 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.