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Extract from the Register of European Patents

EP About this file: EP1049173

EP1049173 - Semiconductor devices with multiple power supplies and methods of manufacturing such devices [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  02.11.2001
Database last updated on 27.07.2024
Most recent event   Tooltip02.11.2001Withdrawal of applicationpublished on 19.12.2001 [2001/51]
Applicant(s)For all designated states
FUJITSU LIMITED
1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi
Kanagawa 211-8588 / JP
[N/P]
Former [2000/44]For all designated states
FUJITSU LIMITED
1-1, Kamikodanaka 4-chome, Nakahara-ku
Kawasaki-shi, Kanagawa 211-8588 / JP
Inventor(s)01 / Yamaguchi, Shigeto
Fujitsu Ltd, 1-1, Kamikodanaka 4-chome, Nakahara-k
Kawasaki-shi, Kanagawa 211-8588 / JP
02 / Gotoh, Kunihiko
Fujitsu Ltd, 1-1, Kamikodanaka 4-chome, Nakahara-k
Kawasaki-shi, Kanagawa 211-8588 / JP
03 / Hirochi, Katsuji
Fujitsu Ltd, 1-1, Kamikodanaka 4-chome, Nakahara-k
Kawasaki-shi, Kanagawa 211-8588 / JP
[2000/44]
Representative(s)Hitching, Peter Matthew
Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London
WC1V 7JH / GB
[N/P]
Former [2000/44]Hitching, Peter Matthew
Haseltine Lake & Co., Imperial House, 15-19 Kingsway
London WC2B 6UD / GB
Application number, filing date00302672.130.03.2000
[2000/44]
Priority number, dateJP1999012292828.04.1999         Original published format: JP 12292899
[2000/44]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1049173
Date:02.11.2000
Language:EN
[2000/44]
Search report(s)(Supplementary) European search report - dispatched on:EP29.05.2000
ClassificationIPC:H01L29/06, H01L21/8234, H01L29/423, H01L21/28, H01L21/32
[2000/44]
CPC:
H01L21/823462 (EP,KR); H01L27/0629 (EP,KR)
Designated contracting statesDE,   GB [2001/29]
Former [2000/44]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE 
TitleGerman:Halbleiterbauelemente mit mehrfacher Energieversorgung und deren Herstellungsverfahren[2000/44]
English:Semiconductor devices with multiple power supplies and methods of manufacturing such devices[2000/44]
French:Dispositifs semiconducteurs avec des sources d'alimentations multiples et ses procédés de fabrication[2000/44]
Examination procedure26.02.2001Examination requested  [2001/17]
22.10.2001Application withdrawn by applicant  [2001/51]
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Documents cited:Search[Y]EP0114491  (FUJITSU LTD [JP]) [Y] 1-12 * page 6, line 21 - page 7, line 28; figures 4A-4F *;
 [Y]US5748033  (KAVEH GOLNAZ [US], et al) [Y] 1-12 * column 2, line 14 - line 50 *;
 [A]DE3107543  (HITACHI LTD [JP]) [A] 1-12 * page 19, line 25 - page 21, line 4; figures 20-24 *;
 [A]EP0244367  (SGS MICROELETTRONICA SPA [IT]) [A] 1-12 * page 4, column 6, line 36 - page 5, column 7, line 27; figures 11-13 *;
 [A]EP0713249  (TEXAS INSTRUMENTS INC [US]) [A] 1-12 * claim 1 *;
 [A]JPH1074843  (TOSHIBA CORP) [A] 1-12 * figures 10,13 *;
 [A]US5607868  (CHIDA NOBUYOSHI [JP], et al) [A] 5 * figure 18 *;
 [A]US5043781  (NISHIURA MASAHARU [JP], et al) [A] 10 * figure 9 *;
 [A]US5264752  (SAVICKI JOSEPH P [US]) [A] 9,10 * column 2, line 25 - line 29 *;
 [A]JPH07161928
 [A]  - PATENT ABSTRACTS OF JAPAN, (19951031), vol. 1995, no. 09, & JP07161928 A 19950623 (FUJITSU LTD) [A] 9,10 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.