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EP1104017
European procedure
Extract from the Register of European Patents
EP About this file: EP1104017
| EP1104017 - Method of flip-chip mounting a semiconductor chip to a circuit board [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 14.03.2008 Database last updated on 14.09.2024 | Most recent event Tooltip | 14.03.2008 | No opposition filed within time limit | published on 16.04.2008 [2008/16] | Applicant(s) | For all designated states OMRON CORPORATION 801, Minamifudoudou-cho, Horikawahigashiiru, Shiokouji-dori, Shimogyo-ku Kyoto-shi, Kyoto 600-8530 / JP | [2006/41] |
| Former [2001/22] | For all designated states Omron Corporation 801, Minamifudoudou-cho, Horikawahigashiiru, Shiokouji-doori, Shimogyo-ku Kyoto-shi, Kyoto-fu, 600-8530 / JP | Inventor(s) | 01 /
Kawai, Wakahiro, 801, Minamifudoudou-cho Horikawahigashiiru, Shiokouji-dori Shimagyo-ku, Kyoto-shi, Kyoti 600-8530 / JP | [2001/22] | Representative(s) | Calderbank, Thomas Roger, et al Mewburn Ellis LLP City Tower 40 Basinghall Street London EC2V 5DE / GB | [N/P] |
| Former [2001/22] | Calderbank, Thomas Roger, et al MEWBURN ELLIS York House 23 Kingsway London WC2B 6HP / GB | Application number, filing date | 00310393.4 | 23.11.2000 | [2001/22] | Priority number, date | JP19990333409 | 24.11.1999 Original published format: JP 33340999 | [2001/22] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1104017 | Date: | 30.05.2001 | Language: | EN | [2001/22] | Type: | A3 Search report | No.: | EP1104017 | Date: | 12.11.2003 | [2003/46] | Type: | B1 Patent specification | No.: | EP1104017 | Date: | 09.05.2007 | Language: | EN | [2007/19] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 01.10.2003 | Classification | IPC: | H01L21/60, H01L21/58 | [2001/22] | CPC: |
H01L24/81 (EP,US);
H01L23/28 (KR);
H01L21/563 (EP,US);
H01L24/29 (EP,US);
H01L24/32 (EP,US);
H01L24/83 (EP,US);
H05K3/061 (EP,US);
H01L2224/13144 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/16227 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/73203 (EP,US);
H01L2224/73204 (EP,US);
H01L2224/81191 (EP,US);
H01L2224/81801 (EP,US);
H01L2224/83192 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01023 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01075 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01327 (EP,US);
H01L2924/014 (EP,US);
H05K1/09 (EP,US);
H05K2201/0129 (EP,US);
H05K2201/10674 (EP,US);
H05K2201/10977 (EP,US);
H05K2203/0285 (EP,US);
| C-Set: |
H01L2224/16225, H01L2224/13144, H01L2924/00 (US,EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP,US);
H01L2224/83192, H01L2224/32225, H01L2924/00 (US,EP);
H01L2224/83192, H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (US,EP) | Designated contracting states | DE, FR, GB, IT [2004/32] |
| Former [2001/22] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Flip-Chip-Montage eines IC auf eine Leiterplatte | [2001/22] | English: | Method of flip-chip mounting a semiconductor chip to a circuit board | [2001/22] | French: | Montage à puce inversée d'une puce semi-conducteur sur un panneau à circuit | [2001/22] | Examination procedure | 12.12.2000 | Examination requested [2001/22] | 12.05.2004 | Despatch of a communication from the examining division (Time limit: M04) | 17.09.2004 | Reply to a communication from the examining division | 13.11.2006 | Communication of intention to grant the patent | 23.03.2007 | Fee for grant paid | 23.03.2007 | Fee for publishing/printing paid | Divisional application(s) | EP07006007.4 / EP1801867 | Opposition(s) | 12.02.2008 | No opposition filed within time limit [2008/16] | Fees paid | Renewal fee | 13.11.2002 | Renewal fee patent year 03 | 12.11.2003 | Renewal fee patent year 04 | 12.11.2004 | Renewal fee patent year 05 | 14.11.2005 | Renewal fee patent year 06 | 14.11.2006 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JPH10200231 ; | [A]JPS6325939 ; | [X]GB795822 (MASSON SEELEY AND COMPANY LTD) [X] 4,5,8-11,13-18 * page 2, column 84 - column 113; example 1 *; | [X]US3320657 (STROBEL JOHN S) [X] 4,5,8-11,13-18 * column 1, line 58 - column 2, line 48; figure 1 * * column 3, lines 65-68 *; | [A]US5363277 (TANAKA OSAMU [JP]) [A] 1-3* figures 1-4 *; | [X]EP0821408 (SHARP KK [JP]) [X] 1-3,12 * column 4, line 48 - column 5, line 58; figures 4A-4D *; | [A]US5874780 (MURAKAMI TOMOO [JP]) [A] 1-3 * figures 3A-3D *; | [X]EP0954208 (MATSUSHITA ELECTRIC IND CO LTD [JP]) [X] 1-3,12 * figures 1E-1G * | [X] - PATENT ABSTRACTS OF JAPAN, (19981031), vol. 1998, no. 12, & JP10200231 A 19980731 (OMRON CORP) [X] 6,7,19 * page 46, column 49; figure 4 * * page 52 - page 55; figure 5 * * figures 1,2,9A * | [A] - PATENT ABSTRACTS OF JAPAN, (19880630), vol. 012, no. 232, Database accession no. (E - 628), & JP63025939 A 19880203 (RICOH CO LTD) [A] 1-3 * abstract * |