blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP1183684

EP1183684 - REACTIVE ION BEAM ETCHING METHOD AND A THIN FILM HEAD FABRICATED USING THE METHOD [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  01.05.2009
Database last updated on 24.04.2024
Most recent event   Tooltip30.09.2011Lapse of the patent in a contracting state
New state(s): CY		published on 02.11.2011  [2011/44]
Applicant(s)For all designated states
VEECO INSTRUMENTS INC.
1 Terminal Drive
Plainview, NY 11803 / US
[N/P]
Former [2002/10]For all designated states
VEECO INSTRUMENTS INC.
Terminal Drive
Plainview, NY 11803 / US
Inventor(s)01 / WILLIAMS, Kurt, E.
146-31 60th Avenue
Flushing, NY 11355-5427 / US
02 / DRUZ, Boris, L.
1721 E. 14th Street
Brooklyn, NY 11229-2024 / US
03 / HINES, Danielle, S.
160 Old Roaring Brook Road
Mount Kisco, NY 10549-3716 / US
04 / LONDONO, John, F.
11 Russel Drive, Apt. E30
Mineola, NY 11501-4776 / US
 [2002/10]
Representative(s)Walaski, Jan Filip, et al
Venner Shipley LLP
200 Aldersgate
London EC1A 4HD / GB
[N/P]
Former [2002/10]Walaski, Jan Filip, et al
Venner, Shipley & Co, 20 Little Britain
London EC1A 7DH / GB
Application number, filing date00919854.030.03.2000
[2002/10]
WO2000US08400
Priority number, dateUS1999028166330.03.1999         Original published format: US 281663
[2002/10]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO0058953
Date:05.10.2000
Language:EN
[2000/40]
Type: A2 Application without search report 
No.:EP1183684
Date:06.03.2002
Language:EN
The application published by WIPO in one of the EPO official languages on 05.10.2000 takes the place of the publication of the European patent application.
[2002/10]
Type: B1 Patent specification 
No.:EP1183684
Date:25.06.2008
Language:EN
[2008/26]
Search report(s)International search report - published on:EP26.04.2001
ClassificationIPC:G11B5/31, C23F4/00
[2002/10]
CPC:
C23F4/00 (EP,US); G11B5/3163 (EP,US)
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE [2002/10]
Extension statesAL04.10.2001
LT04.10.2001
LV04.10.2001
MK04.10.2001
RO04.10.2001
SI04.10.2001
TitleGerman:REAKTIVIONENSTRAHLÄTZENVERFAHREN UND NACH DIESEM VERFAHREN HERGESTELLTER DÜNNFILMKOPF[2002/10]
English:REACTIVE ION BEAM ETCHING METHOD AND A THIN FILM HEAD FABRICATED USING THE METHOD[2002/10]
French:PROCEDE DE GRAVURE IONIQUE REACTIVE ET TETE A COUCHE MINCE FABRIQUEE A L'AIDE DE CE PROCEDE[2002/10]
Entry into regional phase04.10.2001National basic fee paid 
04.10.2001Designation fee(s) paid 
04.10.2001Examination fee paid 
Examination procedure27.10.2000Request for preliminary examination filed
International Preliminary Examining Authority: EP
08.10.2001Examination requested  [2002/10]
16.05.2003Despatch of a communication from the examining division (Time limit: M08)
03.03.2004Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time
13.05.2004Reply to a communication from the examining division
30.11.2007Communication of intention to grant the patent
09.04.2008Fee for grant paid
09.04.2008Fee for publishing/printing paid
Opposition(s)26.03.2009No opposition filed within time limit [2009/23]
Request for further processing for:13.05.2004Request for further processing filed
13.05.2004Full payment received (date of receipt of payment)
Request granted
02.06.2004Decision despatched
Fees paidRenewal fee
22.03.2002Renewal fee patent year 03
24.03.2003Renewal fee patent year 04
22.03.2004Renewal fee patent year 05
22.03.2005Renewal fee patent year 06
29.03.2006Renewal fee patent year 07
08.06.2007Renewal fee patent year 08
10.03.2008Renewal fee patent year 09
Penalty fee
Additional fee for renewal fee
31.03.200708   M06   Fee paid on   08.06.2007
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT25.06.2008
BE25.06.2008
CY25.06.2008
DK25.06.2008
FI25.06.2008
IT25.06.2008
NL25.06.2008
SE25.09.2008
GR26.09.2008
ES06.10.2008
PT25.11.2008
[2011/44]
Former [2010/47]AT25.06.2008
BE25.06.2008
DK25.06.2008
FI25.06.2008
IT25.06.2008
NL25.06.2008
SE25.09.2008
GR26.09.2008
ES06.10.2008
PT25.11.2008
Former [2009/39]AT25.06.2008
BE25.06.2008
DK25.06.2008
FI25.06.2008
IT25.06.2008
NL25.06.2008
SE25.09.2008
ES06.10.2008
PT25.11.2008
Former [2009/20]AT25.06.2008
BE25.06.2008
DK25.06.2008
FI25.06.2008
NL25.06.2008
SE25.09.2008
ES06.10.2008
PT25.11.2008
Former [2009/12]AT25.06.2008
BE25.06.2008
FI25.06.2008
NL25.06.2008
SE25.09.2008
ES06.10.2008
PT25.11.2008
Former [2009/09]AT25.06.2008
FI25.06.2008
NL25.06.2008
SE25.09.2008
ES06.10.2008
PT25.11.2008
Former [2009/07]AT25.06.2008
FI25.06.2008
NL25.06.2008
SE25.09.2008
Former [2009/01]AT25.06.2008
FI25.06.2008
NL25.06.2008
Former [2008/49]AT25.06.2008
FI25.06.2008
Cited inInternational search[A]JPH10112007  ;
 [A]JPH10143817  ;
 [A]US5198634  (MATTSON BRAD S [US], et al) [A] 1,36,53 * column 1, line 6 - column 2, line 62 * * column 3, line 50 - column 4, line 68; claim - *;
 [XAY]US5281302  (GABRIC ZVONIMIR [DE], et al) [X] 36-39 * column 1, line 6 - column 2, line 44 * * column 3, line 4 - line 32 * [A] 1,12,13,15-17,32,34,35 [Y] 1;
 [A]US5438747  (KROUNBI MOHAMAD T [US], et al) [A] 1,7-11 * column 11, line 9 - column 12, line 60 *;
 [A]US5607599  (ICHIHARA KATSUTARO [JP], et al) [A] 1 * the whole document *;
 [A]US5770100  (FUKUYAMA RYOOJI [JP], et al) [A] 1,36 * column 2, line 7 - line 46 * * column 3, line 40 - line 42 * * column 5, line 21 - column 6, line 25; figures 1,2 *;
 [A]EP0871200  (APPLIED MATERIALS INC [US]) [A] 36-41,53,54,57,58,61,62 * page 2, line 26 - line 46 * * page 6, line 23 - line 28 ** page 5, line 36 - line 43; claims 1,5,6 *;
 [A]US5867890  (HSIAO RICHARD [US], et al) [A] 1,2,53,57-60 * column 4, line 34 - column 5, line 31; claim - *;
 [YA]US5878481  (FENG YONG-CHANG [US], et al) [Y] 1 * column 2, line 9 - line 50 * * column 6, line 43 - line 63 * * column 12, line 7 - column 13, line 22; figure 11 * [A] 2;
 [PA]US5938941  (ISHIWATA NOBUYUKI [JP], et al);
 [PA]US5949625  (SATO KIYOSHI [JP], et al) [PA] 1 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19980731), vol. 1998, no. 09, & JP10112007 A 19980428 (NEC CORP) [A] 1,25-27,35,53,54,57-59 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19980831), vol. 1998, no. 10, & JP10143817 A 19980529 (ALPS ELECTRIC CO LTD) [A] 1,7,8,21,22,25-27,35 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.