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EP1290725
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EP About this file: EP1290725
| EP1290725 - SOLDER BUMP AND WIRE BONDING BY INFRARED HEATING [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 21.12.2007 Database last updated on 06.07.2024 | Most recent event Tooltip | 01.08.2008 | Change - applicant | published on 03.09.2008 [2008/36] | Applicant(s) | For all designated states ADVANCED MICRO DEVICES, INC. One AMD Place Mail Stop 68 P.O. Box 3453 Sunnyvale CA 94088-3453 / US | [2008/36] |
| Former [2003/11] | For all designated states ADVANCED MICRO DEVICES INC. One AMD Place, P.O. Box 3453 Sunnyvale, California 94088-3453 / US | Inventor(s) | 01 /
WONG, Pak, C. 1884 Yosemite Drive Milpitas, CA 95035 / US | [2003/11] | Representative(s) | Sanders, Peter Colin Christopher Brookes Batchellor, 102-108 Clerkenwell Road London EC1M 5SA / GB | [N/P] |
| Former [2003/11] | Sanders, Peter Colin Christopher Brookes Batchellor, 102-108 Clerkenwell Road London EC1M 5SA / GB | Application number, filing date | 00988009.7 | 01.12.2000 | [2003/11] | WO2000US32700 | Priority number, date | US20000592275 | 12.06.2000 Original published format: US 592275 | [2003/11] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO0197278 | Date: | 20.12.2001 | Language: | EN | [2001/51] | Type: | A1 Application with search report | No.: | EP1290725 | Date: | 12.03.2003 | Language: | EN | The application published by WIPO in one of the EPO official languages on 20.12.2001 takes the place of the publication of the European patent application. | [2003/11] | Search report(s) | International search report - published on: | EP | 20.12.2001 | Classification | IPC: | H01L21/60 | [2003/11] | CPC: |
H01L24/75 (EP,US);
H01L21/60 (KR);
H01L24/78 (EP,US);
H01L24/81 (EP,US);
H01L24/85 (EP,US);
H01L2224/16 (EP,US);
H01L2224/16225 (EP,US);
H01L2224/32145 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/45147 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/48465 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/75 (EP,US);
H01L2224/75283 (EP,US);
H01L2224/78283 (EP,US);
H01L2224/78301 (EP,US);
H01L2224/81048 (EP,US);
H01L2224/8123 (EP,US);
H01L2224/81801 (EP,US);
H01L2224/85048 (EP,US);
H01L2224/85181 (EP,US);
H01L2224/85205 (EP,US);
H01L24/45 (EP,US);
H01L24/48 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
H01L2924/014 (EP,US);
| C-Set: |
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/45147, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (EP,US);
H01L2224/48465, H01L2224/48227 (EP,US);
H01L2224/48465, H01L2224/48227, H01L2924/00 (EP,US);
H01L2224/73265, H01L2224/32145, H01L2224/48227, H01L2924/00 (EP,US);
H01L2224/78301, H01L2924/00014 (EP,US);
H01L2224/85181, H01L2224/48465 (US,EP);
H01L2224/85205, H01L2924/00 (US,EP); | Designated contracting states | DE, FR, GB, NL [2004/21] |
| Former [2003/11] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | LOTKUGEL UND DRAHTBONDEN MITTELS INFRAROTHEIZUNG | [2003/11] | English: | SOLDER BUMP AND WIRE BONDING BY INFRARED HEATING | [2003/11] | French: | BOSSES DE SOUDURE ET MICROSOUDURE DE FILS PAR CHAUFFAGE INFRAROUGE | [2003/11] | Entry into regional phase | 19.12.2002 | National basic fee paid | 19.12.2002 | Designation fee(s) paid | 19.12.2002 | Examination fee paid | Examination procedure | 21.12.2001 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 19.12.2002 | Examination requested [2003/11] | 08.05.2007 | Application withdrawn by applicant [2007/25] | 23.05.2007 | Date of oral proceedings | deleted | Deletion: Application withdrawn by applicant [2008/04] | 01.07.2004 | Application deemed to be withdrawn, date of legal effect [2008/04] | 04.08.2004 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2008/04] | Fees paid | Renewal fee | 19.12.2002 | Renewal fee patent year 03 | 03.12.2004 | Renewal fee patent year 05 | 05.12.2005 | Renewal fee patent year 06 | 05.12.2006 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 31.12.2003 | 04 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]US5305944 (YOSHIDA MASAHARU [JP], et al) [X] 1,2,4-6,8-10 * the whole document *; | [X]JPH02310939 ; | [X]JPH05335377 ; | [X]US5346857 (SCHARR THOMAS A [US], et al) [X] 1,2,4-6,8-10 * figure 1 *; | [A]GB2244374 (STC PLC [GB]) [A] 1-10 * the whole document *; | [A]JPH04151844 ; | [A]JPS61168233 | [X] - PATENT ABSTRACTS OF JAPAN, (19910313), vol. 015, no. 106, Database accession no. (E - 1044), & JP02310939 A 19901226 (TOSHIBA CORP) [X] 1-3,6,8-10 * abstract * | [X] - PATENT ABSTRACTS OF JAPAN, (19940316), vol. 018, no. 158, Database accession no. (E - 1525), & JP05335377 A 19931217 (SHIBUYA KOGYO CO LTD) [X] 1,2,4-6,8-10 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19920910), vol. 016, no. 435, Database accession no. (E - 1263), & JP04151844 A 19920525 (NEC CORP) [A] 1-10 * abstract * | [A] - PATENT ABSTRACTS OF JAPAN, (19861213), vol. 010, no. 376, Database accession no. (E - 464), & JP61168233 A 19860729 (HITACHI LTD) [A] 1-10 * abstract * |