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EP1122776
European procedure
Extract from the Register of European Patents
EP About this file: EP1122776
| EP1122776 - Process for producing semiconductor chips [Right-click to bookmark this link] | |||
| Former [2001/32] | Process for producing semiconductor chip | ||
| [2006/37] | Status | No opposition filed within time limit Status updated on 08.02.2008 Database last updated on 07.06.2024 | Most recent event Tooltip | 08.02.2008 | No opposition filed within time limit | published on 12.03.2008 [2008/11] | Applicant(s) | For all designated states Lintec Corporation 23-23, Honcho, Itabashi-ku Tokyo 173-0001 / JP | [2007/14] |
| Former [2001/32] | For all designated states Lintec Corporation 23-23, Honcho, Itabashi-ku Tokyo 173-0001 / JP | Inventor(s) | 01 /
Noguchi, Hayato 376, Kanai, Agatsuma-machi, Agatsuma-gun Gunma / JP | 02 /
Ebe, Kazuyoshi 1375-19, Shimonoda, Shiraoka-machi Minamisaitama-gun, Saitama / JP | [2006/40] |
| Former [2001/40] | 01 /
Noguchi, Hayato Agatsuma-machi, Agatsuma-gun Gunma / JP | ||
| 02 /
Ebe, Kazuyoshi 1375-19, Shimonoda, Shiraoka-machi Minamisaitama-gun, Saitama / JP | |||
| Former [2001/32] | 01 /
Noguchi, Hayato 1-22-17, Shimmei urawa-shi, Saitama / JP | ||
| 02 /
Ebe, Kazuyoshi 1375-19, Shimonoda, Shiraoka-machi Minamisaitama-gun, Saitama / JP | Representative(s) | Piésold, Alexander James Dehns St Bride's House 10 Salisbury Square London EC4Y 8JD / GB | [N/P] |
| Former [2001/32] | Piésold, Alexander J. Frank B. Dehn & Co., European Patent Attorneys, 179 Queen Victoria Street London EC4V 4EL / GB | Application number, filing date | 01301093.9 | 07.02.2001 | [2001/32] | Priority number, date | JP20000028702 | 07.02.2000 Original published format: JP 2000028702 | [2001/32] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1122776 | Date: | 08.08.2001 | Language: | EN | [2001/32] | Type: | A3 Search report | No.: | EP1122776 | Date: | 28.01.2004 | [2004/05] | Type: | B1 Patent specification | No.: | EP1122776 | Date: | 04.04.2007 | Language: | EN | [2007/14] | Type: | B8 Corrected title page of specification | No.: | EP1122776 | Date: | 06.06.2007 | [2007/23] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.12.2003 | Classification | IPC: | H01L21/82, H01L21/58, H01L21/68, H01L21/78, H01L21/00 | [2004/05] | CPC: |
H01L21/6836 (EP,US);
H01L21/78 (EP,KR,US);
H01L2221/68327 (EP,US)
|
| Former IPC [2001/32] | H01L21/82 | Designated contracting states | DE, FR, GB, IT, PT [2004/43] |
| Former [2001/32] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Verfahren zur Herstellung von Halbleiterchips | [2001/32] | English: | Process for producing semiconductor chips | [2006/37] | French: | Procédé de fabrication de puces semiconductrices | [2007/19] |
| Former [2001/32] | Process for producing semiconductor chip | ||
| Former [2001/32] | Procédé de fabrication de chips semiconducteurs | Examination procedure | 22.04.2004 | Examination requested [2004/25] | 06.07.2004 | Despatch of a communication from the examining division (Time limit: M04) | 16.11.2004 | Reply to a communication from the examining division | 07.09.2006 | Communication of intention to grant the patent | 15.01.2007 | Fee for grant paid | 15.01.2007 | Fee for publishing/printing paid | Opposition(s) | 07.01.2008 | No opposition filed within time limit [2008/11] | Fees paid | Renewal fee | 26.02.2003 | Renewal fee patent year 03 | 23.02.2004 | Renewal fee patent year 04 | 24.02.2005 | Renewal fee patent year 05 | 23.02.2006 | Renewal fee patent year 06 | 21.02.2007 | Renewal fee patent year 07 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0884766 (LINTEC CORP [JP]) [A] 1-3 * column 2, lines 15-40 * * column 6, lines 33-44 * * column 7, lines 27-47 * * figures 4-6 *; | [A]US5641714 (YAMANAKA HIDEO [JP]) [A] 1-3 * figure 4A *; | [A]US5824177 (YOSHIHARA SHINJI [JP], et al) [A] 1-3 * the whole document *; | [A]US5525422 (SPIES MANFRED [DE], et al) [A] 1-3 * the whole document * |