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Extract from the Register of European Patents

EP About this file: EP1176440

EP1176440 - Compression bonding method using laser assisted heating [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  27.12.2002
Database last updated on 24.08.2024
Most recent event   Tooltip27.12.2002Application deemed to be withdrawnpublished on 05.02.2003  [2003/06]
Applicant(s)For all designated states
Agere Systems Optoelectronics Guardian Corporation
9333 South John Young Parkway Orlando
Florida 32819-8698 / US
[N/P]
Former [2002/05]For all designated states
Agere Systems Optoelectronics Guardian Corporation
9333 South John Young Parkway
Orlando, Florida 32819-8698 / US
Inventor(s)01 / Dautartas, Mindaugas Fernand
2006 Sycamore Trail
Blacksburg, Virginia 24060 / US
02 / Walters, Frank Stephen
333 Fairview Drive
Kutztown, Pennsylvania 19530 / US
 [2002/05]
Representative(s)Perkins, Sarah
Stevens Hewlett & Perkins
1 St Augustine's Place
Bristol BS1 4UD / GB
[N/P]
Former [2002/05]Perkins, Sarah
Stevens, Hewlett & Perkins Halton House 20/23 Holborn
London EC1N 2JD / GB
Application number, filing date01305346.720.06.2001
[2002/05]
Priority number, dateUS2000062806328.07.2000         Original published format: US 628063
[2002/05]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP1176440
Date:30.01.2002
Language:EN
[2002/05]
Search report(s)(Supplementary) European search report - dispatched on:EP06.09.2001
ClassificationIPC:G02B6/36, B23K26/32, C03C27/04, G02B6/42
[2002/05]
CPC:
G02B6/4238 (EP,US); B23K26/32 (EP,US); C03C27/02 (EP,US);
G02B6/3636 (EP,US); B23K2103/10 (EP,US); B23K2103/18 (EP,US);
B23K2103/50 (EP,US); B23K2103/54 (EP,US); G02B6/3652 (EP,US);
G02B6/3692 (EP,US); Y10S228/903 (EP,US) (-)
Designated contracting statesDE,   FR,   GB [2002/42]
Former [2002/05]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:Kompressionsverbindungsverfahren durch Laserschweissen[2002/05]
English:Compression bonding method using laser assisted heating[2002/05]
French:Méthode de soudage en compression assité par chauffage laser[2002/05]
Examination procedure20.06.2001Request for accelerated examination filed
30.06.2001Examination requested  [2002/05]
21.03.2002Despatch of a communication from the examining division (Time limit: M04)
21.03.2002Decision about request for accelerated examination - accepted: Yes
02.08.2002Application deemed to be withdrawn, date of legal effect  [2003/06]
05.09.2002Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2003/06]
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Documents cited:Search[XY]EP0262699  (PHILIPS NV [NL]) [X] 1,2 * abstract * * column 1, line 8 - line 10 * * column 4, line 33 - line 47 * [Y] 3-12;
 [Y]US5178319  (COUCOULAS ALEXANDER [US]) [Y] 3-12 * abstract * * claim 1 *;
 [A]US5337383  (DEANGELIS MARIO E [US], et al) [A] 1-12 * abstract * * column 3, line 46 - column 4, line 12 ** claim 1 *;
 [X]GB2326366  (HARTMANN & BRAUN GMBH & CO KG [DE]) [X] 1,2 * abstract * * page 3, line 20 - page 4, line 9 *
ExaminationJPS61189886
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.