EP1176440 - Compression bonding method using laser assisted heating [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 27.12.2002 Database last updated on 24.08.2024 | Most recent event Tooltip | 27.12.2002 | Application deemed to be withdrawn | published on 05.02.2003 [2003/06] | Applicant(s) | For all designated states Agere Systems Optoelectronics Guardian Corporation 9333 South John Young Parkway Orlando Florida 32819-8698 / US | [N/P] |
Former [2002/05] | For all designated states Agere Systems Optoelectronics Guardian Corporation 9333 South John Young Parkway Orlando, Florida 32819-8698 / US | Inventor(s) | 01 /
Dautartas, Mindaugas Fernand 2006 Sycamore Trail Blacksburg, Virginia 24060 / US | 02 /
Walters, Frank Stephen 333 Fairview Drive Kutztown, Pennsylvania 19530 / US | [2002/05] | Representative(s) | Perkins, Sarah Stevens Hewlett & Perkins 1 St Augustine's Place Bristol BS1 4UD / GB | [N/P] |
Former [2002/05] | Perkins, Sarah Stevens, Hewlett & Perkins Halton House 20/23 Holborn London EC1N 2JD / GB | Application number, filing date | 01305346.7 | 20.06.2001 | [2002/05] | Priority number, date | US20000628063 | 28.07.2000 Original published format: US 628063 | [2002/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1176440 | Date: | 30.01.2002 | Language: | EN | [2002/05] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.09.2001 | Classification | IPC: | G02B6/36, B23K26/32, C03C27/04, G02B6/42 | [2002/05] | CPC: |
G02B6/4238 (EP,US);
B23K26/32 (EP,US);
C03C27/02 (EP,US);
G02B6/3636 (EP,US);
B23K2103/10 (EP,US);
B23K2103/18 (EP,US);
B23K2103/50 (EP,US);
B23K2103/54 (EP,US);
G02B6/3652 (EP,US);
| Designated contracting states | DE, FR, GB [2002/42] |
Former [2002/05] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Kompressionsverbindungsverfahren durch Laserschweissen | [2002/05] | English: | Compression bonding method using laser assisted heating | [2002/05] | French: | Méthode de soudage en compression assité par chauffage laser | [2002/05] | Examination procedure | 20.06.2001 | Request for accelerated examination filed | 30.06.2001 | Examination requested [2002/05] | 21.03.2002 | Despatch of a communication from the examining division (Time limit: M04) | 21.03.2002 | Decision about request for accelerated examination - accepted: Yes | 02.08.2002 | Application deemed to be withdrawn, date of legal effect [2003/06] | 05.09.2002 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2003/06] |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]EP0262699 (PHILIPS NV [NL]) [X] 1,2 * abstract * * column 1, line 8 - line 10 * * column 4, line 33 - line 47 * [Y] 3-12; | [Y]US5178319 (COUCOULAS ALEXANDER [US]) [Y] 3-12 * abstract * * claim 1 *; | [A]US5337383 (DEANGELIS MARIO E [US], et al) [A] 1-12 * abstract * * column 3, line 46 - column 4, line 12 ** claim 1 *; | [X]GB2326366 (HARTMANN & BRAUN GMBH & CO KG [DE]) [X] 1,2 * abstract * * page 3, line 20 - page 4, line 9 * | Examination | JPS61189886 |