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EP1324391
European procedure
Extract from the Register of European Patents
EP About this file: EP1324391
| EP1324391 - Module housing and power semiconductor module [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 02.05.2008 Database last updated on 27.07.2024 | Most recent event Tooltip | 22.05.2009 | Change - representative | published on 24.06.2009 [2009/26] | Applicant(s) | For all designated states ABB Research Ltd. Affolternstrasse 52 8050 Zürich / CH | [N/P] |
| Former [2003/27] | For all designated states ABB RESEARCH LTD. Affolternstrasse 52 8050 Zürich / CH | Inventor(s) | 01 /
Meysenc, Luc Zelgweg 20 5405 Baden-Dättwil / CH | 02 /
Hamidi, Amina Zürcherstrasse 20 5400 Baden / CH | 03 /
Joerg, Pieder Via Nova 75 7013 Domat/Ems / CH | 04 /
Akdag, Alper Moosstrasse 11 5406 Baden-Rütihof / CH | [2003/27] | Representative(s) | ABB Patent Attorneys C/o ABB Schweiz AG Intellectual Property CH-IP Brown Boveri Strasse 6 5400 Baden / CH | [N/P] |
| Former [2009/26] | ABB Patent Attorneys C/o ABB Schweiz AG Intellectual Property (CH-LC/IP), Brown Boveri Strasse 6 5400 Baden / CH | ||
| Former [2003/27] | ABB Patent Attorneys c/o ABB Schweiz AG Brown Boveri Strasse 6 5400 Baden / CH | Application number, filing date | 01811273.0 | 24.12.2001 | [2003/27] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP1324391 | Date: | 02.07.2003 | Language: | EN | [2003/27] | Type: | B1 Patent specification | No.: | EP1324391 | Date: | 27.06.2007 | Language: | EN | [2007/26] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.06.2002 | Classification | IPC: | H01L25/16, H01L25/07 | [2003/27] | CPC: |
H01L25/07 (EP,US);
H01L25/165 (EP,US);
H01L2924/0002 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE [2004/13] |
| Former [2003/27] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Title | German: | Modulgehäuse und Leistungshalbleitermodul | [2003/27] | English: | Module housing and power semiconductor module | [2003/27] | French: | Boîtier pour module et module semi-conducteur à haute puissance | [2007/12] |
| Former [2003/27] | Boîtier pour modul et modul semi-conducteur à haut prestation | Examination procedure | 05.12.2003 | Examination requested [2004/06] | 01.03.2007 | Communication of intention to grant the patent | 09.05.2007 | Fee for grant paid | 09.05.2007 | Fee for publishing/printing paid | Opposition(s) | 28.03.2008 | No opposition filed within time limit [2008/23] | Fees paid | Renewal fee | 27.11.2003 | Renewal fee patent year 03 | 07.12.2004 | Renewal fee patent year 04 | 13.12.2005 | Renewal fee patent year 05 | 12.12.2006 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]EP0828341 (HITACHI LTD [JP], et al) [A] 1-5 * figures 20,21,34-36,38 *; | [A]US6285076 (ANDO MASARU [JP]) [A] 1-5 * figure 3 *; | [A]US5808868 (DREKMEIER KARL-GERD [DE]) [A] 1-5 * figure - *; | [A]EP0609528 (MOTOROLA INC [US]); | [A]EP0116289 (ALLEN BRADLEY CO [US]) |