EP1218757 - METHOD FOR MAKING A PROBE CARD WITH MULTIPLE CONTACT TIPS FOR TESTING INTEGRATED CIRCUITS WITH MICROSPHERE CONTACTS [Right-click to bookmark this link] | |||
Former [2002/27] | METHOD FOR MAKING A CARD WITH MULTIPLE CONTACT TIPS FOR TESTING MICROSPHERE INTEGRATED CIRCUITS, AND TESTING DEVICE USING SAID CARD | ||
[2003/42] | Status | No opposition filed within time limit Status updated on 21.01.2005 Database last updated on 29.07.2024 | Most recent event Tooltip | 14.12.2007 | Lapse of the patent in a contracting state New state(s): PT | published on 16.01.2008 [2008/03] | Applicant(s) | For all designated states Mesatronic ZAC de Champfeuillet, 130, rue de Placyre 38500 Voiron / FR | [2002/27] | Inventor(s) | 01 /
BELMONT, André Hameau Le Temple F-38490 La Batie Divisin / FR | 02 /
ROBERT, Laurent c/o Mesatronic 130, Rue du Placyre ZAC Champfeuill et 38500 Voiron / FR | 03 /
AIT MANI, Abdel, Nacer 9, rue Gay F-38400 Saint Martin d'Hères / FR | [2003/23] |
Former [2002/27] | 01 /
BELMONT, André Hameau Le Temple F-38490 La Batie Divisin / FR | ||
02 /
ROBERT, Laurent Clos Bérard Bate, 4, rue Brunetière 38500 Voiron / FR | |||
03 /
AIT MANI, Abdel, Nacer 9, rue Gay F-38400 Saint Martin d'Hères / FR | Representative(s) | Hecké, Gérard Cabinet Hecké 10, rue d'Arménie - Europole BP 1537 38025 Grenoble Cedex 1 / FR | [N/P] |
Former [2002/27] | Hecké, Gérard Cabinet HECKE World Trade Center - Europole, 5, Place Robert Schuman, BP 1537 38025 Grenoble Cedex 1 / FR | Application number, filing date | 01956635.5 | 24.07.2001 | [2002/27] | WO2001FR02411 | Priority number, date | FR20000009930 | 28.07.2000 Original published format: FR 0009930 | [2002/27] | Filing language | FR | Procedural language | FR | Publication | Type: | A1 Application with search report | No.: | WO0210779 | Date: | 07.02.2002 | Language: | FR | [2002/06] | Type: | A1 Application with search report | No.: | EP1218757 | Date: | 03.07.2002 | Language: | FR | The application published by WIPO in one of the EPO official languages on 07.02.2002 takes the place of the publication of the European patent application. | [2002/27] | Type: | B1 Patent specification | No.: | EP1218757 | Date: | 17.03.2004 | Language: | FR | [2004/12] | Search report(s) | International search report - published on: | EP | 07.02.2002 | Classification | IPC: | G01R1/073, G01R3/00 | [2003/42] | CPC: |
G01R1/0735 (EP,US);
G01R1/06738 (EP,US);
G01R3/00 (EP,US);
H05K3/243 (EP,US);
H05K3/4007 (EP,US);
Y10T29/49117 (EP,US);
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Former IPC [2002/27] | G01R1/073 | Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR [2002/27] | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | RO | Not yet paid | SI | Not yet paid | Title | German: | HERSTELLUNGSVERFAHREN FÜR EINE SONDENKARTE MIT MEHREREN KONTAKTPUNKTEN ZUR PRÜFUNG VON INTEGRIERTEN SCHALTUNGEN MIT KUGELMATRIX-VERPACKUNG (BGA) | [2003/42] | English: | METHOD FOR MAKING A PROBE CARD WITH MULTIPLE CONTACT TIPS FOR TESTING INTEGRATED CIRCUITS WITH MICROSPHERE CONTACTS | [2003/42] | French: | PROCEDE DE FABRICATION D'UNE CARTE A POINTES DE CONTACT MULTIPLE POUR LE TEST DE CIRCUITS INTEGRES A PLOTS DE CONNEXION EN FORME DE MICROBILLES | [2003/42] |
Former [2002/27] | HERSTELLUNGSVERFAHREN FÜR EINE SONDENKARTE MIT MEHREREN KONTAKTPUNKTEN ZUR PRÜFUNG VON INTEGRIERTEN SCHALTUNGEN MIT KUGELMATRIX-VERPACKUNG (BGA) UND TESTVORRICHTUNG MIT SONDENKARTE | ||
Former [2002/27] | METHOD FOR MAKING A CARD WITH MULTIPLE CONTACT TIPS FOR TESTING MICROSPHERE INTEGRATED CIRCUITS, AND TESTING DEVICE USING SAID CARD | ||
Former [2002/27] | PROCEDE DE FABRICATION D'UNE CARTE A POINTES DE CONTACT MULTIPLE POUR LE TEST DE CIRCUITS INTEGRES A MICROBILLES, ET DISPOSITIF DE TEST UTILISANT LA CARTE | Entry into regional phase | 16.04.2002 | National basic fee paid | 16.04.2002 | Designation fee(s) paid | 16.04.2002 | Examination fee paid | Examination procedure | 16.04.2002 | Examination requested [2002/27] | 20.11.2002 | Despatch of a communication from the examining division (Time limit: M04) | 10.03.2003 | Reply to a communication from the examining division | 24.03.2003 | Despatch of a communication from the examining division (Time limit: M04) | 07.05.2003 | Reply to a communication from the examining division | 19.09.2003 | Communication of intention to grant the patent | 05.01.2004 | Fee for grant paid | 05.01.2004 | Fee for publishing/printing paid | Opposition(s) | 20.12.2004 | No opposition filed within time limit [2005/10] | Fees paid | Renewal fee | 21.07.2003 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | CY | 17.03.2004 | FI | 17.03.2004 | TR | 17.03.2004 | DK | 17.06.2004 | GR | 17.06.2004 | SE | 17.06.2004 | ES | 28.06.2004 | LU | 24.07.2004 | MC | 31.07.2004 | PT | 17.08.2004 | [2008/03] |
Former [2007/10] | CY | 17.03.2004 | |
FI | 17.03.2004 | ||
TR | 17.03.2004 | ||
DK | 17.06.2004 | ||
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
ES | 28.06.2004 | ||
LU | 24.07.2004 | ||
MC | 31.07.2004 | ||
Former [2006/51] | FI | 17.03.2004 | |
TR | 17.03.2004 | ||
DK | 17.06.2004 | ||
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
ES | 28.06.2004 | ||
LU | 24.07.2004 | ||
MC | 31.07.2004 | ||
Former [2005/23] | FI | 17.03.2004 | |
DK | 17.06.2004 | ||
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
ES | 28.06.2004 | ||
LU | 24.07.2004 | ||
MC | 31.07.2004 | ||
Former [2005/22] | FI | 17.03.2004 | |
DK | 17.06.2004 | ||
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
ES | 28.06.2004 | ||
MC | 31.07.2004 | ||
Former [2005/18] | FI | 17.03.2004 | |
DK | 17.06.2004 | ||
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
ES | 28.06.2004 | ||
Former [2005/02] | FI | 17.03.2004 | |
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
ES | 28.06.2004 | ||
Former [2004/41] | FI | 17.03.2004 | |
GR | 17.06.2004 | ||
SE | 17.06.2004 | ||
Former [2004/40] | FI | 17.03.2004 | |
SE | 17.06.2004 | Cited in | International search | [A]EP0772049 (NITTO DENKO CORP [JP]) [A] 1 * column 4, line 11 - column 5, line 14 * * column 8, line 47 - column 9, line 28; figures 1A-2C *; | [AD]WO9845716 (MESATRONIC [FR], et al) [AD] 1 * abstract *; | [A]WO9852218 (HITACHI LTD [JP], et al) [A] 7 * abstract *; | [A]EP0999451 (NITTO DENKO CORP [JP]) [A] 1,7 * abstract *; | [A] - KONDOH Y ET AL, "UNIVERSAL MEMBRANE PROBE FOR KNOWN GOOD DIE", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING,US,INTERNATIONAL MICROELECTRONICS & PACKAGING SOCIETY, (19941001), vol. 17, no. 4, ISSN 1063-1674, pages 323 - 329, XP000497394 |