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EP1363851
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EP About this file: EP1363851
| EP1363851 - MICROMACHINED COMPONENT AND METHOD OF MANUFACTURE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 19.09.2008 Database last updated on 15.06.2024 | Most recent event Tooltip | 19.09.2008 | Application deemed to be withdrawn | published on 22.10.2008 [2008/43] | Applicant(s) | For all designated states Freescale Semiconductor, Inc. 6501 William Cannon Drive West Austin, TX 78735 / US | [N/P] |
| Former [2004/50] | For all designated states Freescale Semiconductor, Inc. 6501 William Cannon Drive West Austin, Texas 78735 / US | ||
| Former [2003/48] | For all designated states MOTOROLA, INC. 1303 East Algonquin Road Schaumburg, IL 60196 / US | Inventor(s) | 01 /
GORRELL, Jonathan, F. 5314 East Sheridan Street Phoenix, AZ 85008 / US | 02 /
NIELSEN, Gordana, S. 6602 North 36th Street Phoenix, AZ 85018 / US | [2003/48] | Representative(s) | Wharmby, Martin Angus Freescale Semiconductor Inc. c/o Impetus IP Limited Grove House Lutyens Close Basingstoke, Hampshire RG24 8AG / GB | [N/P] |
| Former [2004/27] | Wharmby, Martin Angus Freescale Semiconductor Inc. c/o Impetus IP Limited Grove House Lutyens Close Basingstoke, Hampshire RG24 8AG / GB | ||
| Former [2003/48] | Gibson, Sarah Jane, et al Motorola European Intellectual Property Operations Midpoint Alencon Link Basingstoke, Hampshire RG21 7PL / GB | Application number, filing date | 01977465.2 | 04.10.2001 | [2003/48] | WO2001US31067 | Priority number, date | US20000680777 | 06.10.2000 Original published format: US 680777 | [2003/48] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | WO0230809 | Date: | 18.04.2002 | Language: | EN | [2002/16] | Type: | A2 Application without search report | No.: | EP1363851 | Date: | 26.11.2003 | Language: | EN | The application published by WIPO in one of the EPO official languages on 18.04.2002 takes the place of the publication of the European patent application. | [2003/48] | Search report(s) | International search report - published on: | EP | 25.09.2003 | Classification | IPC: | B81C1/00, B81B3/00 | [2003/48] | CPC: |
B81C1/00928 (EP,US)
| Designated contracting states | DE, FR, GB [2004/22] |
| Former [2003/48] | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR | Extension states | AL | Not yet paid | LT | Not yet paid | LV | Not yet paid | MK | Not yet paid | RO | Not yet paid | SI | Not yet paid | Title | German: | MIKROFABRIZIERTES BAUELEMENT UND DESSEN HERSTELLUNGSVERFAHREN | [2003/48] | English: | MICROMACHINED COMPONENT AND METHOD OF MANUFACTURE | [2003/48] | French: | COMPOSANT MICRO-USINE ET PROCEDE DE FABRICATION | [2003/48] | Entry into regional phase | 06.05.2003 | National basic fee paid | 25.03.2004 | Designation fee(s) paid | 25.03.2004 | Examination fee paid | Examination procedure | 04.04.2002 | Request for preliminary examination filed International Preliminary Examining Authority: US | 31.03.2003 | Amendment by applicant (claims and/or description) | 25.03.2004 | Examination requested [2004/22] | 30.10.2006 | Despatch of a communication from the examining division (Time limit: M06) | 26.04.2007 | Reply to a communication from the examining division | 01.05.2008 | Application deemed to be withdrawn, date of legal effect [2008/43] | 06.06.2008 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2008/43] | Fees paid | Renewal fee | 06.10.2003 | Renewal fee patent year 03 | 06.10.2004 | Renewal fee patent year 04 | 07.10.2005 | Renewal fee patent year 05 | 05.10.2006 | Renewal fee patent year 06 | Penalty fee | Additional fee for renewal fee | 31.10.2007 | 07 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [YA]WO9500258 (UNIV CALIFORNIA [US]) [Y] 8-14 * figure 2 * * page 6, line 17 - page 8, line 16 * [A] 1-7,15-25; | [A]DE19506404 (SIEMENS AG [DE]) [A] 1-25 * column 3, line 5 - column 4, line 32 *; | [XAY] - HOWE R T, "Applications of silicon micromachining to resonator fabrication", FREQUENCY CONTROL SYMPOSIUM, 1994. 48TH., PROCEEDINGS OF THE 1994 IEEE INTERNATIONAL BOSTON, MA, USA 1-3 JUNE 1994, NEW YORK, NY, USA,IEEE, (19940601), ISBN 0-7803-1945-1, pages 2 - 7, XP010137898 [X] 1,2,15 * figure 2 * * paragraph [SURFACE] * [A] 3-7,16-25 [Y] 8-14 DOI: http://dx.doi.org/10.1109/FREQ.1994.398361 | [A] - PAUL O ET AL, "Sacrificial aluminum etching for CMOS microstructures", MICRO ELECTRO MECHANICAL SYSTEMS, 1997. MEMS ' 97, PROCEEDINGS, IEEE., TENTH ANNUAL INTERNATIONAL WORKSHOP ON NAGOYA, JAPAN 26-30 JAN. 1997, NEW YORK, NY, USA,IEEE, US, (19970126), ISBN 0-7803-3744-1, pages 523 - 528, XP010216961 [A] 1-25 * paragraph [TECHNOLOGY] * * table I * DOI: http://dx.doi.org/10.1109/MEMSYS.1997.581918 |