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Extract from the Register of European Patents

EP About this file: EP1330326

EP1330326 - DEVICE FOR REMOVING SOLDER MATERIAL FROM A SOLDERED JOINT [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  04.07.2008
Database last updated on 07.10.2024
Most recent event   Tooltip04.07.2008No opposition filed within time limitpublished on 06.08.2008  [2008/32]
Applicant(s)For all designated states
Pac Tech - Packaging Technologies GmbH
Am Schlangenhorst 15-17
14641 Nauen / DE
[2003/31]
Inventor(s)01 / ZAKEL, Elke
Reinicke Strasse 8
14612 Falkensee / DE
02 / KASULKE, Paul
Tailheimer Strasse 4
74199 Untergruppenbach / DE
03 / UEBEL, Oliver
Dieffenbachstrasse 45
10967 Berlin / DE
04 / TITERLE, Lars
Wiener Strasse 38
10999 Berlin / DE
 [2003/38]
Former [2003/31]01 / ZAKEL, Elke
Reinicke Strasse 8
14612 Falkensee / DE
02 / KASULKE, Paul
Wilhelmshavener Strasse 26
10551 Berlin / DE
03 / UEBEL, Oliver
Dieffenbachstrasse 45
10967 Berlin / DE
04 / TITERLE, Lars
Wiener Strasse 38
10999 Berlin / DE
Representative(s)von Bülow, Tam
Am Klueshoff 22
24955 Harrislee / DE
[N/P]
Former [2003/31]von Bülow, Tam, Dr.
Patentanwalt, Mailänder Strasse 13
81545 München / DE
Application number, filing date01986281.202.10.2001
[2003/31]
WO2001EP11418
Priority number, dateDE2000104958606.10.2000         Original published format: DE 10049586
[2003/31]
Filing languageDE
Procedural languageDE
PublicationType: A2 Application without search report
No.:WO0228582
Date:11.04.2002
Language:DE
[2002/15]
Type: A2 Application without search report 
No.:EP1330326
Date:30.07.2003
Language:DE
The application published by WIPO in one of the EPO official languages on 11.04.2002 takes the place of the publication of the European patent application.
[2003/31]
Type: B1 Patent specification 
No.:EP1330326
Date:29.08.2007
Language:DE
[2007/35]
Search report(s)International search report - published on:EP18.07.2002
ClassificationIPC:B23K1/018, B23K26/14
[2003/31]
CPC:
B23K26/1476 (EP,US); B23K1/018 (EP,US); B23K26/142 (EP,US)
Designated contracting statesDE,   GB [2004/21]
Former [2003/31]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:VORRICHTUNG ZUM ENTFERNEN VON LOTMATERIAL VON EINER LÖTSTELLE[2003/31]
English:DEVICE FOR REMOVING SOLDER MATERIAL FROM A SOLDERED JOINT[2003/31]
French:DISPOSITIF POUR ENLEVER UNE MATIERE D'APPORT DE SOUDAGE D'UN POINT SOUDE[2003/31]
Entry into regional phase06.05.2003National basic fee paid 
06.05.2003Designation fee(s) paid 
06.05.2003Examination fee paid 
Examination procedure16.04.2002Request for preliminary examination filed
International Preliminary Examining Authority: EP
06.05.2003Examination requested  [2003/31]
22.09.2004Despatch of a communication from the examining division (Time limit: M06)
04.04.2005Reply to a communication from the examining division
22.11.2005Despatch of a communication from the examining division (Time limit: M06)
02.06.2006Reply to a communication from the examining division
07.03.2007Communication of intention to grant the patent
14.07.2007Fee for grant paid
14.07.2007Fee for publishing/printing paid
Opposition(s)30.05.2008No opposition filed within time limit [2008/32]
Fees paidRenewal fee
31.10.2003Renewal fee patent year 03
29.10.2004Renewal fee patent year 04
31.10.2005Renewal fee patent year 05
31.10.2006Renewal fee patent year 06
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Cited inInternational search[XDY]WO9857774  (PAC TECH GMBH [DE], et al) [XD] 1,12,22,29 * abstract * [Y] 2-4,6,8-10,13-16;
 [X]JPH01133672  ;
 [Y]DE3822097  (MESSER GRIESHEIM GMBH [DE]) [Y] 2-4,6 * abstract *;
 [Y]DE3208626  (SIEMENS AG [DE]) [Y] 8,9 * abstract *;
 [Y]DE4143414  (WEIDMUELLER INTERFACE [DE]) [Y] 10 * abstract *;
 [Y]EP0635329  (FORTUNE WILLIAM S [US]) [Y] 13-16 * figures 1,5 *
 [X]  - PATENT ABSTRACTS OF JAPAN, (19890823), vol. 013, no. 380, Database accession no. (M - 863), & JP01133672 A 19890525 (HITACHI LTD;OTHERS: 01) [X] 1,12,22 * abstract *
ExaminationDE3931401
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.