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Extract from the Register of European Patents

EP About this file: EP1267394

EP1267394 - Improvements in or relating to semiconductor processing [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  06.10.2006
Database last updated on 26.07.2024
Most recent event   Tooltip26.06.2009Change - representativepublished on 29.07.2009  [2009/31]
Applicant(s)For all designated states
Texas Instruments Incorporated
7839 Churchill Way
Mail Station 3999
Dallas, Texas 75251 / US
[N/P]
Former [2005/48]For all designated states
TEXAS INSTRUMENTS INCORPORATED
7839 Churchill Way, Mail Station 3999 Dallas
Texas 75251 / US
Former [2002/51]For all designated states
Texas Instruments Incorporated
7839 Churchill Way, Mail Station 3999
Dallas, Texas 75251 / US
Inventor(s)01 / Jain, Manoj Kumar
1515 Rio Grande, Apt. No.2010
Plano, Texas 75075 / US
 [2002/51]
Representative(s)Degwert, Hartmut
Prinz & Partner
Rundfunkplatz 2
80335 München / DE
[N/P]
Former [2009/31]Degwert, Hartmut
Prinz & Partner GbR Rundfunkplatz 2
80335 München / DE
Former [2002/51]Degwert, Hartmut, Dipl.-Phys.
Prinz & Partner GbR, Manzingerweg 7
81241 München / DE
Application number, filing date02012492.114.02.1996
[2002/51]
Priority number, dateUS1995038983315.02.1995         Original published format: US 389833
US1995038953415.02.1995         Original published format: US 389534
[2002/51]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1267394
Date:18.12.2002
Language:EN
[2002/51]
Type: A3 Search report 
No.:EP1267394
Date:05.11.2003
[2003/45]
Type: B1 Patent specification 
No.:EP1267394
Date:30.11.2005
Language:EN
[2005/48]
Search report(s)(Supplementary) European search report - dispatched on:EP18.09.2003
ClassificationIPC:H01L21/306, H01L21/00, H01L21/3105
[2002/51]
CPC:
H01L21/02052 (EP); B08B1/32 (EP); H01L21/67046 (EP)
Designated contracting statesDE,   FR,   GB,   IT,   NL [2002/51]
TitleGerman:Verbesserungen bei der oder in Bezug auf die Halbleiterverarbeitung[2002/51]
English:Improvements in or relating to semiconductor processing[2002/51]
French:Améliorations du ou par rapport au traitement des semiconducteurs[2002/51]
Examination procedure26.04.2004Examination requested  [2004/26]
14.06.2005Communication of intention to grant the patent
14.09.2005Fee for grant paid
14.09.2005Fee for publishing/printing paid
Parent application(s)   TooltipEP96102164.9  / EP0727816
Opposition(s)31.08.2006No opposition filed within time limit [2006/45]
Fees paidRenewal fee
12.06.2002Renewal fee patent year 03
12.06.2002Renewal fee patent year 04
12.06.2002Renewal fee patent year 05
12.06.2002Renewal fee patent year 06
12.06.2002Renewal fee patent year 07
24.02.2003Renewal fee patent year 08
23.02.2004Renewal fee patent year 09
22.02.2005Renewal fee patent year 10
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipIT30.11.2005
NL30.11.2005
[2007/37]
Former [2006/23]NL30.11.2005
Documents cited:Search[A]JPS59112625  ;
 [PA]JPH0773456  ;
 [A]EP0362516  (IBM [US]) [A] 1-8 * the whole document *;
 [DA]EP0537627  (TEXAS INSTRUMENTS INC [US]) [DA] 1-8 * column 1, line 5 - line 40 * * column 2, line 24 - line 36 * * column 3, line 8 - line 12; claims 1,3 *;
 [PA]EP0692318  (EBARA CORP [JP]) [PA] 1-8 * page 3, line 49 - page 4, line 47; figure 1 *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19841024), vol. 008, no. 231, Database accession no. (E - 274), & JP59112625 A 19840629 (MITSUBISHI DENKI KK) [A] 1-8 * abstract *
 [PA]  - PATENT ABSTRACTS OF JAPAN, (19950731), vol. 1995, no. 06, & JP07073456 A 19950317 (HITACHI METALS LTD) [PA] 1-8 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.