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Extract from the Register of European Patents

EP About this file: EP1267597

EP1267597 - Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  21.11.2008
Database last updated on 09.09.2024
Most recent event   Tooltip21.11.2008No opposition filed within time limitpublished on 24.12.2008  [2008/52]
Applicant(s)For all designated states
DENSO CORPORATION
1-1, Showa-cho Kariya-city
Aichi-pref. 448-8661 / JP
[N/P]
Former [2008/03]For all designated states
Denso Corporation
1-1, Showa-cho Kariya-city
Aichi-pref. 448-8661 / JP
Former [2002/51]For all designated states
Denso Corporation
1-1, Showa-cho
Kariya-city, Aichi-pref., 448-8661 / JP
Inventor(s)01 / Kondo, Koji, c/o DENSO CORPORATION
Intellectual Property Department, 1-1 Showa-cho
Kariya-city, Aichi-pref., 448-8661 / JP
02 / Yokochi, Tomohiro, c/o DENSO CORPORATION
Intellectual Property Department, 1-1 Showa-cho
Kariya-city, Aichi-pref., 448-8661 / JP
03 / Miyake, Toshihiro, c/o DENSO CORPORATION
Intellectual Property Department, 1-1 Showa-cho
Kariya-city, Aichi-pref., 448-8661 / JP
04 / Takeuchi, Satoshi, c/o DENSO CORPORATION
Intellectual Property Department, 1-1 Showa-cho
Kariya-city, Aichi-pref., 448-8661 / JP
 [2002/51]
Representative(s)Winter, Brandl - Partnerschaft mbB
Alois-Steinecker-Straße 22
85354 Freising / DE
[N/P]
Former [2002/51]Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte Partnerschaft
Patent- und Rechtsanwaltskanzlei Alois-Steinecker-Strasse 22
85354 Freising / DE
Application number, filing date02013103.313.06.2002
[2002/51]
Priority number, dateJP2001017911813.06.2001         Original published format: JP 2001179118
JP2001019939229.06.2001         Original published format: JP 2001199392
JP2001020402304.07.2001         Original published format: JP 2001204023
JP2002006239407.03.2002         Original published format: JP 2002062394
[2002/51]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1267597
Date:18.12.2002
Language:EN
[2002/51]
Type: A3 Search report 
No.:EP1267597
Date:13.10.2004
[2004/42]
Type: B1 Patent specification 
No.:EP1267597
Date:16.01.2008
Language:EN
[2008/03]
Search report(s)(Supplementary) European search report - dispatched on:EP30.08.2004
ClassificationIPC:H05K3/46, H05K1/18
[2002/51]
CPC:
H05K1/186 (EP,US); H05K3/46 (KR); H05K3/4617 (EP,US);
H05K3/4632 (EP,US); H01L2224/05568 (EP,US); H01L2224/05573 (EP,US);
H01L2224/16 (EP,US); H01L2224/48091 (EP,US); H01L2224/48472 (EP,US);
H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/19041 (EP,US);
H05K1/056 (EP,US); H05K2201/0129 (EP,US); H05K2201/0394 (EP,US);
H05K2201/10636 (EP,US); H05K2203/063 (EP,US); H05K3/4069 (EP,US);
Y02P70/50 (EP,US); Y10T29/4913 (EP,US); Y10T29/49131 (EP,US);
Y10T29/49133 (EP,US); Y10T29/49147 (EP,US); Y10T29/49165 (EP,US);
Y10T428/24917 (EP,US) (-)
C-Set:
H01L2224/05624, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2224/48472, H01L2224/48091, H01L2924/00 (US,EP)
Designated contracting statesDE,   FR,   GB [2005/27]
Former [2002/51]AT,  BE,  CH,  CY,  DE,  DK,  ES,  FI,  FR,  GB,  GR,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  SE,  TR 
TitleGerman:Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischer Vorrichtung[2007/51]
English:Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device[2002/51]
French:Panneau à circuit imprimé avec dispositif électrique intégré et procédé de fabrication de panneau à circuit Imprimé avec dispositif électrique intégré[2002/51]
Former [2002/51]Leiterplatte mit eingebetteter elektrischer Vorrichtung und Verfahren zur Herstellung einer Leiterplatte mit eingebetteter elektrischen Vorrichtung
Examination procedure28.12.2004Examination requested  [2005/09]
11.04.2005Despatch of a communication from the examining division (Time limit: M06)
20.10.2005Reply to a communication from the examining division
27.01.2006Despatch of a communication from the examining division (Time limit: M06)
01.08.2006Reply to a communication from the examining division
10.11.2006Despatch of a communication from the examining division (Time limit: M04)
13.03.2007Reply to a communication from the examining division
25.05.2007Communication of intention to grant the patent
01.10.2007Fee for grant paid
01.10.2007Fee for publishing/printing paid
Opposition(s)17.10.2008No opposition filed within time limit [2008/52]
Fees paidRenewal fee
14.06.2004Renewal fee patent year 03
14.06.2005Renewal fee patent year 04
27.03.2006Renewal fee patent year 05
14.06.2007Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XAY]JP2001044641  ;
 [YA]JPH02150098  ;
 [AX]JP2000151112  ;
 [AX]JPH04163988  ;
 [DA]JPH11312868  ;
 [DA]JPH04356998  ;
 [AX]US4751126  (OODAIRA HIROSI [JP], et al) [A] 1,9,10 * column 4, line 29 - column 5, line 35; figure 3; claim - * [X] 23,30;
 [A]US5018051  (YAMADA HIROSHI [JP], et al) [A] 14-17 * column 2, line 32 - column 3, line 21; figures 1,2 *;
 [AX]US5401688  (YAMAJI YASUHIRO [JP], et al) [A] 1,4,9,10,24,28 * the whole document * [X] 23,30;
 [A]EP0920058  (MATSUSHITA ELECTRIC IND CO LTD [JP]) [A] 1,7,23,24,30 * figure -; claim - *;
 [AY]EP0957513  (HITACHI CHEMICAL CO LTD [JP]) [A] 9,19,20,27 * column 5, line 13 - line 38; figure 1 * [Y] 11,26;
 [XY]EP1069616  (SONY CHEMICALS CORP [JP]) [X] 1-4,9,10,23,24,28,30 * figure -; claim - * [Y] 11,26;
 [PX]US6359235  (HAYASHI KATSURA [JP]) [PX] 1-3,5,7* column 9, line 12 - column 10, line 48; figures 6,7 *
 [XAY]  - PATENT ABSTRACTS OF JAPAN, (20010605), vol. 2000, no. 19, & JP2001044641 A 20010216 (KYOCERA CORP) [X] 1-3,5,7 * abstract * [A] 23,24,30 [Y] 8
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19900830), vol. 014, no. 401, Database accession no. (E - 0971), & JP02150098 A 19900608 (JAPAN RADIO CO LTD) [Y] 8 * abstract * [A] 14,23,25
 [AX]  - PATENT ABSTRACTS OF JAPAN, (20001006), vol. 2000, no. 08, & JP2000151112 A 20000530 (TOSHIBA CORP) [A] 1,4,9 * abstract * [X] 23,28,30
 [AX]  - PATENT ABSTRACTS OF JAPAN, (19920925), vol. 016, no. 462, Database accession no. (E - 1269), & JP04163988 A 19920609 (TOSHIBA CORP) [A] 1,5,7,9,10 * abstract * [X] 23,30
 [DA]  - PATENT ABSTRACTS OF JAPAN, (20000229), vol. 2000, no. 02, & JP11312868 A 19991109 (KYOCERA CORP) [DA] 1,4,23,24,28,30 * abstract *
 [DA]  - PATENT ABSTRACTS OF JAPAN, (19930507), vol. 017, no. 223, Database accession no. (E - 1359), & JP04356998 A 19921210 (IBIDEN CO LTD) [DA] 14-16 * abstract *
ExaminationEP0736568
 US5866950
 DE10037183
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.