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EP1393364
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EP About this file: EP1393364
| EP1393364 - PLASTIC HOUSING COMPRISING SEVERAL SEMICONDUCTOR CHIPS AND A WIRING MODIFICATION PLATE, AND METHOD FOR PRODUCING THE PLASTIC HOUSING IN AN INJECTION-MOULDING MOULD [Right-click to bookmark this link] | Status | The application has been withdrawn Status updated on 16.09.2005 Database last updated on 14.06.2024 | Most recent event Tooltip | 16.09.2005 | Withdrawal of application | published on 02.11.2005 [2005/44] | Applicant(s) | For all designated states Infineon Technologies AG St.-Martin-Strasse 53 81669 München / DE | [2004/10] | Inventor(s) | 01 /
WÖRZ, Andreas Amselstrasse 14 93309 Kehlheim / DE | 02 /
ZEILER, Thomas Oberfeldweg 17 93049 Regensburg / DE | [2004/10] | Representative(s) | Schäfer, Horst Schweiger & Partner Patent- und Rechtsanwälte Karlstrasse 35 80333 München / DE | [N/P] |
| Former [2004/10] | Schäfer, Horst, Dr. Schweiger & Partner Patent- und Rechtsanwälte Karl-Theodor-Strasse 69 80803 München / DE | Application number, filing date | 02740387.2 | 05.06.2002 | [2004/10] | WO2002DE02044 | Priority number, date | DE2001127009 | 05.06.2001 Original published format: DE 10127009 | [2004/10] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | WO02099871 | Date: | 12.12.2002 | Language: | DE | [2002/50] | Type: | A2 Application without search report | No.: | EP1393364 | Date: | 03.03.2004 | Language: | DE | The application published by WIPO in one of the EPO official languages on 12.12.2002 takes the place of the publication of the European patent application. | [2004/10] | Search report(s) | International search report - published on: | EP | 06.03.2003 | Classification | IPC: | H01L21/56, H01L23/498 | [2004/10] | CPC: |
H01L21/565 (EP,US);
H01L23/02 (KR);
H01L23/3121 (EP,US);
H01L24/97 (EP,US);
H01L2224/05599 (EP,US);
H01L2224/45099 (EP,US);
H01L2224/4824 (EP,US);
H01L2224/85399 (EP,US);
H01L2224/97 (EP,US);
H01L24/48 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01004 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01032 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01052 (EP,US);
H01L2924/01061 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US);
| C-Set: |
H01L2224/05599, H01L2924/00014 (US,EP);
H01L2224/85399, H01L2924/00014 (US,EP);
H01L2224/97, H01L2224/85 (EP,US);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US); | Designated contracting states | AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LI, LU, MC, NL, PT, SE, TR [2004/10] | Title | German: | KUNSTSTOFFGEHÄUSE MIT MEHREREN HALBLEITERCHIPS UND EINER UMVERDRAHTUNGSPLATTE SOWIE EIN VERFAHREN ZUR HERSTELLUNG DES KUNSTSTOFFGEHÄUSES IN EINER SPRITZGUSSFORM | [2004/10] | English: | PLASTIC HOUSING COMPRISING SEVERAL SEMICONDUCTOR CHIPS AND A WIRING MODIFICATION PLATE, AND METHOD FOR PRODUCING THE PLASTIC HOUSING IN AN INJECTION-MOULDING MOULD | [2004/10] | French: | BOITIER EN PLASTIQUE ASSOCIE A PLUSIEURS PUCES A SEMI-CONDUCTEUR ET A UNE PLAQUE DE MODIFICATION DE CABLAGE, ET PROCEDE DE FABRICATION DUDIT BOITIER DANS UN MOULE DE MOULAGE PAR INJECTION | [2004/10] | Entry into regional phase | 24.11.2003 | National basic fee paid | 24.11.2003 | Designation fee(s) paid | 24.11.2003 | Examination fee paid | Examination procedure | 18.12.2002 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 24.11.2003 | Examination requested [2004/10] | 19.05.2005 | Despatch of a communication from the examining division (Time limit: M04) | 13.09.2005 | Application withdrawn by applicant [2005/44] | Fees paid | Renewal fee | 07.05.2004 | Renewal fee patent year 03 | 12.05.2005 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [X]US6143581 (JOHNSON MARK S [US], et al) [X] 1-18 * figures 4,11 *; | [X]US6210992 (TANDY PATRICK W [US], et al) [X] 1-18 * figures 2-4 *; | [X]WO9701865 (HITACHI LTD [JP], et al) [X] 1-18 * figures 1-3 *; | [A]US6201299 (TAO SU [TW], et al) [A] 1-18 * the whole document *; | [PX]US6294825 (BOLKEN TODD O [US], et al) [PX] 1-18 * figures 4,5,5A,9 * |