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Extract from the Register of European Patents

EP About this file: EP1377338

EP1377338 - METHOD OF MANUFACTURING MICRONEEDLE STRUCTURES USING SOFT LITHOGRAPHY AND PHOTOLITHOGRAPHY [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  12.06.2009
Database last updated on 24.04.2024
Most recent event   Tooltip30.09.2011Lapse of the patent in a contracting state
New state(s): CY, TR		published on 02.11.2011  [2011/44]
Applicant(s)For all designated states
Corium International, Inc.
2686 Middlefield Road, Suite G
Redwood City, CA 94063 / US
[2005/44]
Former [2004/02]For all designated states
THE PROCTER & GAMBLE COMPANY
One Procter & Gamble Plaza
Cincinnati, Ohio 45202 / US
Inventor(s)01 / ARIAS, Francisco
1440 W. Kemper Road 1506
Cincinnati, OH 45240 / US
02 / SHERMAN, Faiz, Feisal
8517 Breezewood Court
West Chester, OH 45069 / US
03 / OWENS, Grover, David
1612 Oak Valley
Fairfield, OH 45014 / US
 [2004/02]
Representative(s)Crump, Julian Richard John
Mintz Levin Cohn Ferris Glovsky & Popeo
Intellectual Property LLP
Alder Castle
10 Noble Street
London EC2V 7JX / GB
[N/P]
Former [2008/44]Crump, Julian Richard John
Mintz Levin Cohn Ferris Glovsky & Popeo Intellectual Property LLP The Rectory 9 Ironmonger Lane
London EC2V 8EY / GB
Former [2007/38]Crump, Julian Richard John
Mintz Levin Cohn Ferris Glovsky & Popeo Intellectual Property LLP The Rectory 9 Ironmonger Lane
London EC2V 8EY / GB
Former [2005/38]Mallalieu, Catherine Louise
D. Young & Co. 120 Holborn
London EC1N 2DY / GB
Former [2004/14]Veronese, Pancrazio, et al
Procter & Gamble Italia S.p.A. Italian Research Center Via Aterno 92/94
66020 Sambuceto di San Giovanni Teatino (Chieti) / IT
Former [2004/02]Canonici, Jean-Jacques, et al
NV Procter & Gamble Services Company SA, Temselaan 100
1853 Strombeek-Bever / BE
Application number, filing date02750607.013.03.2002
[2004/02]
WO2002US07543
Priority number, dateUS2001080853414.03.2001         Original published format: US 808534
[2004/02]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report
No.:WO02072189
Date:19.09.2002
Language:EN
[2002/38]
Type: A2 Application without search report 
No.:EP1377338
Date:07.01.2004
Language:EN
The application published by WIPO in one of the EPO official languages on 19.09.2002 takes the place of the publication of the European patent application.
[2004/02]
Type: B1 Patent specification 
No.:EP1377338
Date:06.08.2008
Language:EN
[2008/32]
Type: B9 Corrected patent specification 
No.:EP1377338
Date:05.11.2008
[2008/45]
Search report(s)International search report - published on:EP20.03.2003
ClassificationIPC:A61M37/00
[2004/02]
CPC:
A61M37/0015 (EP,US); A61B5/1411 (US); A61B5/14514 (EP,US);
A61B5/150022 (EP,US); A61B5/150282 (EP,US); A61B5/150419 (EP,US);
A61B5/150984 (EP,US); B81C1/00111 (EP,US); A61M2037/0038 (EP,US);
A61M2037/0053 (EP,US); B81B2201/055 (EP,US); B81C2201/034 (EP,US) (-)
Designated contracting statesAT,   BE,   CH,   CY,   DE,   DK,   ES,   FI,   FR,   GB,   GR,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   SE,   TR [2004/02]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
RONot yet paid
SINot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG VON MIKRONADELSTRUKTUREN MIT SANFTER LITHOGRAPHIE UND PHOTOLITHOGRAPHIE[2004/02]
English:METHOD OF MANUFACTURING MICRONEEDLE STRUCTURES USING SOFT LITHOGRAPHY AND PHOTOLITHOGRAPHY[2004/02]
French:PROCEDE DE FABRICATION DE STRUCTURES DE MICROAIGUILLES AU MOYEN DE LA LITHOGRAPHIE DOUCE ET DE LA PHOTOLITHOGRAPHIE[2004/02]
Entry into regional phase02.10.2003National basic fee paid 
02.10.2003Designation fee(s) paid 
02.10.2003Examination fee paid 
Examination procedure23.08.2002Request for preliminary examination filed
International Preliminary Examining Authority: EP
02.10.2003Examination requested  [2004/02]
14.01.2005Despatch of a communication from the examining division (Time limit: M06)
14.07.2005Reply to a communication from the examining division
18.11.2005Despatch of a communication from the examining division (Time limit: M06)
04.07.2006Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time
04.09.2006Reply to a communication from the examining division
11.01.2007Despatch of a communication from the examining division (Time limit: M06)
19.07.2007Reply to a communication from the examining division
25.02.2008Communication of intention to grant the patent
23.06.2008Fee for grant paid
23.06.2008Fee for publishing/printing paid
Opposition(s)07.05.2009No opposition filed within time limit [2009/29]
Request for further processing for:04.09.2006Request for further processing filed
04.09.2006Full payment received (date of receipt of payment)
Request granted
20.09.2006Decision despatched
Fees paidRenewal fee
02.10.2003Renewal fee patent year 03
04.03.2005Renewal fee patent year 04
09.03.2006Renewal fee patent year 05
14.03.2007Renewal fee patent year 06
14.03.2008Renewal fee patent year 07
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT06.08.2008
BE06.08.2008
CY06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
TR06.08.2008
SE06.11.2008
GR07.11.2008
PT06.01.2009
IE13.03.2009
LU13.03.2009
MC31.03.2009
[2011/43]
Former [2011/21]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
SE06.11.2008
GR07.11.2008
PT06.01.2009
IE13.03.2009
LU13.03.2009
MC31.03.2009
Former [2010/48]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
SE06.11.2008
GR07.11.2008
PT06.01.2009
IE13.03.2009
MC31.03.2009
Former [2010/09]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
SE06.11.2008
PT06.01.2009
IE13.03.2009
MC31.03.2009
Former [2010/07]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
PT06.01.2009
IE13.03.2009
MC31.03.2009
Former [2009/47]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
PT06.01.2009
MC31.03.2009
Former [2009/25]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
PT06.01.2009
Former [2009/19]AT06.08.2008
BE06.08.2008
DK06.08.2008
FI06.08.2008
NL06.08.2008
Former [2009/15]AT06.08.2008
FI06.08.2008
NL06.08.2008
Former [2009/12]FI06.08.2008
NL06.08.2008
Cited inInternational search[A]WO9637256  (SILICON MICRODEVICES INC [US], et al) [A] 1,9,18,23,28 * abstract ** page 5, line 15 - page 6, line 3; figure 6 *;
 [X]WO0005166  (SECR DEFENCE [GB], et al) [X] 1-34 * the whole document *;
 [X]US6106751  (TALBOT NEIL H [US], et al) [X] 1-34 * the whole document *;
 [X]WO0074763  (GEORGIA TECH RES INST [US]) [X] 1-34 * page 36, line 14 - page 45, line 28 *;
 [X]US6187210  (LEBOUITZ KYLE S [US], et al) [X] 35-38 * column 3, line 66 - column 4, line 26; figure 1 *
ExaminationWO0070406
    - PROF. G.M. WHITESIDES, DR. Y. XIA, Soft lithography, ANGEW. CHEM. INT. ED. ,37,550-575, WILEY-VCH VERLAG GMBH, D-69451 WEINHEIM, (1998), XP000985399

DOI:   http://dx.doi.org/10.1002/(SICI)1521-3773(19980316)37:5<550::AID-ANIE550>3.0.CO;2-G
by applicantUS3964482
 WO9637256
 WO9748440
 WO9748441
 WO9748442
 WO9800193
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.