-
EP1355352
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP1355352
| EP1355352 - Stacked semiconductor device and method of manufacturing thereof [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 07.03.2008 Database last updated on 24.03.2026 | Most recent event Tooltip | 07.03.2008 | Application deemed to be withdrawn | published on 09.04.2008 [2008/15] | Applicant(s) | For all designated states FUJITSU LIMITED 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi Kanagawa 211-8588 / JP | [N/P] |
| Former [2003/43] | For all designated states FUJITSU LIMITED 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | Inventor(s) | 01 /
Nishimura, Takao, c/o Fujitsu Limited 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | 02 /
Uno, Tadashi, c/o Fujitsu Limited 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | 03 /
Onodera, Hiroshi, Fujitsu Miyagi Electronics ltd. 1-1, Aza Nishigaoka, Oaza Murata, Murata-machi Shibata-gun, Miyagi 989-1304 / JP | 04 /
Takashima, Akira, c/o Fujitsu Limited 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 / JP | [2003/43] | Representative(s) | Seeger, Wolfgang Seeger & Seeger Patentanwälte & European Patent Attorneys Georg-Hager-Strasse 40 81369 München / DE | [N/P] |
| Former [2003/43] | Seeger, Wolfgang, Dipl.-Phys. Georg-Hager-Strasse 40 81369 München / DE | Application number, filing date | 03006051.1 | 19.03.2003 | [2003/43] | Priority number, date | JP20020117534 | 19.04.2002 Original published format: JP 2002117534 | [2003/43] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1355352 | Date: | 22.10.2003 | Language: | EN | [2003/43] | Type: | A3 Search report | No.: | EP1355352 | Date: | 05.10.2005 | [2005/40] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 19.08.2005 | Classification | IPC: | H01L25/065, H01L25/10, H01L23/498 | [2003/43] | CPC: |
H10W90/00 (EP,US);
H10W72/00 (KR);
H10W70/60 (EP,US);
H10W72/07251 (EP,US);
H10W72/20 (EP,US);
H10W72/5522 (EP,US);
H10W72/877 (EP,US);
H10W72/884 (EP,US);
H10W74/15 (EP,US);
H10W90/22 (EP,US);
H10W90/271 (EP,US);
H10W90/288 (EP,US);
H10W90/297 (EP,US);
H10W90/721 (EP,US);
H10W90/722 (EP,US);
H10W90/724 (EP,US);
H10W90/732 (EP,US);
H10W90/734 (EP,US);
H10W90/754 (EP,US)
(-)
| Designated contracting states | DE, FR, IT [2006/24] |
| Former [2003/43] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Stapelhalbleiterbauteil und seine Herstellung | [2003/43] | English: | Stacked semiconductor device and method of manufacturing thereof | [2003/43] | French: | Dispositif semi-conducteur empilé et méthode de fabrication associée | [2003/43] | Examination procedure | 29.12.2005 | Amendment by applicant (claims and/or description) | 22.03.2006 | Examination requested [2006/22] | 19.04.2006 | Loss of particular rights, legal effect: designated state(s) | 25.07.2006 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, BG, CH, CY, CZ, DK, EE, ES, FI, GB, GR, HU, IE, LU, MC, NL, PT, RO, SE, SI, SK, TR | 02.10.2007 | Application deemed to be withdrawn, date of legal effect [2008/15] | 20.11.2007 | Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time [2008/15] | Fees paid | Renewal fee | 15.03.2005 | Renewal fee patent year 03 | 09.03.2006 | Renewal fee patent year 04 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 10.05.2006 | AT M01 Not yet paid | 10.05.2006 | BE M01 Not yet paid | 10.05.2006 | BG M01 Not yet paid | 10.05.2006 | CH M01 Not yet paid | 10.05.2006 | CY M01 Not yet paid | 10.05.2006 | CZ M01 Not yet paid | 10.05.2006 | DK M01 Not yet paid | 10.05.2006 | EE M01 Not yet paid | 10.05.2006 | ES M01 Not yet paid | 10.05.2006 | FI M01 Not yet paid | 10.05.2006 | GB M01 Not yet paid | 10.05.2006 | GR M01 Not yet paid | 10.05.2006 | HU M01 Not yet paid | 10.05.2006 | IE M01 Not yet paid | 10.05.2006 | LU M01 Not yet paid | 10.05.2006 | MC M01 Not yet paid | 10.05.2006 | NL M01 Not yet paid | 10.05.2006 | PT M01 Not yet paid | 10.05.2006 | RO M01 Not yet paid | 10.05.2006 | SE M01 Not yet paid | 10.05.2006 | SI M01 Not yet paid | 10.05.2006 | SK M01 Not yet paid | 10.05.2006 | TR M01 Not yet paid | Additional fee for renewal fee | 31.03.2007 | 05 M06 Not yet paid |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y] DE10029259 (ORIENT SEMICONDUCTOR ELECT LTD et al.) [Y] 1-14,17-19,28 * the whole document * | [Y] US2002031864 (BALL MICHAEL B et al.) [Y] 1-14,23,28 * paragraphs [0056] , [0061]; figure 8 * | [Y] US2001006252 (KIM YOUNG et al.) [Y] 4,11,24 * paragraphs [0013] , [0054]; figure 6 * | [Y] EP0571749 (MOTOROLA INC et al.) [Y] 9,22 * the whole document * | [XY] US6025648 (TAKAHASHI NOBUAKI et al.) [X] 15,16,20,21,25-28 * the whole document *[Y] 17-19,22-24 | [DA] JP2001223297 | [DA] PATENT ABSTRACTS OF JAPAN vol. 2000, no. 25 12 April 2001 (2001-04-12) [DA] 15 * abstract * |