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Extract from the Register of European Patents

EP About this file: EP1347513

EP1347513 - Low voltage drop and high thermal performance ball grid array package [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  24.02.2012
Database last updated on 31.08.2024
Most recent event   Tooltip24.02.2012Application deemed to be withdrawnpublished on 28.03.2012  [2012/13]
Applicant(s)For all designated states
Broadcom Corporation
5300 California Avenue
Irvine, CA 92617 / US
[2007/21]
Former [2003/39]For all designated states
Broadcom Corporation
16215 Alton Parkway
Irvine, California 92618-7013 / US
Inventor(s)01 / Zhong, Chonghua
124 Roosevelt Street
92620 Irvine, California / US
02 / Khan, Reza-ur Rahman
36 Via Anadeja
92688 Rancho Santa Margerita, California / US
 [2003/39]
Representative(s)Jehle, Volker Armin, et al
Bosch Jehle Patentanwaltsgesellschaft mbH
Flüggenstrasse 13
80639 München / DE
[N/P]
Former [2008/52]Jehle, Volker Armin, et al
Bosch Jehle Patentanwaltsgesellschaft mbH Flüggenstrasse 13
80639 München / DE
Former [2008/41]Jehle, Volker Armin
Patentanwälte Bosch, Graf von Stosch, Jehle Flüggenstrasse 13
80639 München / DE
Former [2003/39]Jehle, Volker Armin, Dipl.-Ing.
Bosch, Graf von Stosch, Jehle, Flüggenstrasse 13
80639 München / DE
Application number, filing date03006574.224.03.2003
[2003/39]
Priority number, dateUS20020366241P22.03.2002         Original published format: US 366241 P
US2002025360025.09.2002         Original published format: US 253600
[2003/39]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1347513
Date:24.09.2003
Language:EN
[2003/39]
Type: A3 Search report 
No.:EP1347513
Date:14.04.2004
[2004/16]
Search report(s)(Supplementary) European search report - dispatched on:EP02.03.2004
ClassificationIPC:H01L23/31, H01L23/433
[2004/16]
CPC:
H01L23/3128 (EP,US); H01L23/4334 (EP,US); H01L2224/05554 (EP,US);
H01L2224/05599 (EP,US); H01L2224/32225 (EP,US); H01L2224/45099 (EP,US);
H01L2224/48091 (EP,US); H01L2224/48227 (EP,US); H01L2224/48228 (EP,US);
H01L2224/49171 (EP,US); H01L2224/73265 (EP,US); H01L2224/85399 (EP,US);
H01L24/48 (EP,US); H01L24/49 (EP,US); H01L24/73 (EP,US);
H01L25/0657 (EP,US); H01L2924/00014 (EP,US); H01L2924/01077 (EP,US);
H01L2924/01079 (EP,US); H01L2924/10162 (EP,US); H01L2924/14 (EP,US);
H01L2924/1433 (EP,US); H01L2924/15311 (EP,US); H01L2924/16152 (EP,US);
H01L2924/181 (EP,US); H01L2924/30107 (EP,US); H01L2924/3011 (EP,US);
H01L2924/3025 (EP,US) (-)
C-Set:
H01L2224/05599, H01L2924/00014 (EP,US);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/49171, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2224/85399, H01L2924/00014 (EP,US);
H01L2924/00014, H01L2224/45015, H01L2924/207 (EP,US);
H01L2924/00014, H01L2224/45099 (EP,US);
H01L2924/15311, H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (US,EP);
H01L2924/181, H01L2924/00012 (EP,US)
(-)
Former IPC [2003/39]H01L23/433, H01L23/31
Designated contracting statesDE,   FR,   GB [2005/01]
Former [2003/39]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Ball grid array Gehäuse mit geringem Spannungsabfall und hoher thermischer Leistung[2003/39]
English:Low voltage drop and high thermal performance ball grid array package[2003/39]
French:Boîtier de grille matricielle à billes à faible chute de tension et à hautes perfomances thermiques[2003/39]
Examination procedure14.10.2004Examination requested  [2004/51]
03.04.2007Despatch of a communication from the examining division (Time limit: M04)
29.05.2007Reply to a communication from the examining division
01.10.2011Application deemed to be withdrawn, date of legal effect  [2012/13]
09.11.2011Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2012/13]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  03.04.2007
Fees paidRenewal fee
31.03.2005Renewal fee patent year 03
31.03.2006Renewal fee patent year 04
02.04.2007Renewal fee patent year 05
31.03.2008Renewal fee patent year 06
31.03.2009Renewal fee patent year 07
31.03.2010Renewal fee patent year 08
Penalty fee
Additional fee for renewal fee
31.03.201109   M06   Not yet paid
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Documents cited:Search[A]EP0573297  (SHINKO ELECTRIC IND CO [JP]) [A] 1-33* column 3, line 42 - column 6, line 1; figures 1,5 *;
 [A]US5397917  (OMMEN DENISE M [US], et al) [A] 1-33 * column 2, line 34 - column 6, line 15; figure 1 *;
 [XA]US5977626  (WANG HSING-SENG [TW], et al) [X] 1-7,18-20,25-32 * column 2, line 66 - column 5, line 3; figures 2-7 * [A] 8-17,21-24,33;
 [XA]US5982621  (LI JI-MING [TW]) [X] 1-8,18-33 * column 2, line 12 - column 3, line 24; figures 1-10 * [A] 9-17;
 [XA]FR2803098  (ORIENT SEMICONDUCTOR ELECT LTD [TW]) [X] 1-7,18-20,25-32 * page 2, line 22 - page 4, line 5; figure 2 * [A] 8-17,21-24,33
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.