blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP1396886

EP1396886 - Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  02.05.2014
Database last updated on 03.06.2024
Most recent event   Tooltip02.05.2014Application deemed to be withdrawnpublished on 04.06.2014  [2014/23]
Applicant(s)For all designated states
Oki Electric Industry Company, Limited
7-12, Toranomon 1-chome Minato-ku
Tokyo 105 / JP
[N/P]
Former [2004/11]For all designated states
Oki Electric Industry Company, Limited
7-12, Toranomon 1-chome Minato-ku
Tokyo 105 / JP
Inventor(s)01 / Yamada, Etsuo
Oki Electric Industry Co., Ltd. 7-12, Toranomon
1-Chome Minato-ku Tokyo 105 / JP
 [2004/11]
Representative(s)Read, Matthew Charles
Venner Shipley LLP
200 Aldersgate
London EC1A 4HD / GB
[N/P]
Former [2014/10]Read, Matthew Charles
Venner Shipley LLP
200 Aldersgate
London
EC1A 4HD / GB
Former [2004/11]Walaski, Jan Filip, et al
Venner, Shipley & Co, 20 Little Britain
London EC1A 7DH / GB
Application number, filing date03027952.518.06.1996
[2004/11]
Priority number, dateJP1995017829621.06.1995         Original published format: JP 17829695
[2004/11]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1396886
Date:10.03.2004
Language:EN
[2004/11]
Type: A3 Search report 
No.:EP1396886
Date:07.07.2004
[2004/28]
Search report(s)(Supplementary) European search report - dispatched on:EP21.05.2004
ClassificationIPC:H01L23/495
[2004/11]
CPC:
H01L24/48 (EP,US); H01L23/28 (KR); H01L23/3135 (EP,US);
H01L23/4951 (EP,US); H01L23/49551 (EP,US); H01L24/05 (EP,US);
H01L24/06 (EP,US); H01L2224/04042 (EP,US); H01L2224/05599 (EP,US);
H01L2224/06136 (EP,US); H01L2224/32245 (EP,US); H01L2224/45144 (EP,US);
H01L2224/48091 (EP,US); H01L2224/48247 (EP,US); H01L2224/4826 (EP,US);
H01L2224/48465 (EP,US); H01L2224/48599 (EP,US); H01L2224/48639 (EP,US);
H01L2224/73215 (EP,US); H01L2224/85439 (EP,US); H01L23/49582 (EP,US);
H01L2924/00014 (EP,US); H01L2924/01006 (EP,US); H01L2924/01023 (EP,US);
H01L2924/01047 (EP,US); H01L2924/01079 (EP,US); H01L2924/14 (EP,US);
H01L2924/181 (EP,US); H01L2924/18165 (EP,US) (-)
C-Set:
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/4826, H01L2224/48465, H01L2924/00 (US,EP);
H01L2224/48465, H01L2224/48091, H01L2924/00 (US,EP);
H01L2224/48465, H01L2224/48091, H01L2924/00, H01L2924/00012 (US,EP);
H01L2224/48465, H01L2224/48247, H01L2924/00 (EP,US);
H01L2224/48465, H01L2224/48247, H01L2924/00, H01L2924/00 (US,EP);
H01L2224/48465, H01L2224/4826, H01L2924/00 (US,EP);
H01L2224/48639, H01L2924/00 (EP,US);
H01L2224/73215, H01L2224/32245, H01L2224/4826, H01L2924/00012 (US,EP);
H01L2924/00014, H01L2224/05599, H01L2924/00 (US,EP);
H01L2924/00014, H01L2224/45099 (US,EP);
H01L2924/00014, H01L2224/85399 (US,EP);
H01L2924/181, H01L2924/00012 (EP,US)
(-)
Designated contracting statesDE,   FR,   GB,   NL [2004/11]
TitleGerman:Mit den inneren Enden der Verbindungsleiter auf der Oberfläche des Halbleiterchips aufliegende Halbleiteranordnung[2004/11]
English:Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip[2004/11]
French:Dispositif semi-conducteur ayant l'extrémité interne de conducteurs disposée sur la surface d'une puce semi-conducteur[2004/11]
Examination procedure26.08.2004Examination requested  [2004/44]
03.01.2014Application deemed to be withdrawn, date of legal effect  [2014/23]
28.01.2014Despatch of communication that the application is deemed to be withdrawn, reason: renewal fee not paid in time  [2014/23]
Parent application(s)   TooltipEP96304531.5  / EP0750342
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued (EP19960304531) is  31.08.2000
Fees paidRenewal fee
11.12.2003Renewal fee patent year 03
11.12.2003Renewal fee patent year 04
11.12.2003Renewal fee patent year 05
11.12.2003Renewal fee patent year 06
11.12.2003Renewal fee patent year 07
11.12.2003Renewal fee patent year 08
17.06.2004Renewal fee patent year 09
16.06.2005Renewal fee patent year 10
19.06.2006Renewal fee patent year 11
18.06.2007Renewal fee patent year 12
17.06.2008Renewal fee patent year 13
17.06.2009Renewal fee patent year 14
16.06.2010Renewal fee patent year 15
20.06.2011Renewal fee patent year 16
20.06.2012Renewal fee patent year 17
Penalty fee
Additional fee for renewal fee
30.06.201318   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[YA]JPH06132339  ;
 [A]JPS5854644  ;
 [PX]JPH07335818  ;
 [A]JPH05152495  ;
 [A]JPH04320390  ;
 [A]JPH0444347  ;
 [XY]US5068712  (MURAKAMI GEN [JP], et al) [X] 1-6,11,12,14,21,23,24 * column 45, line 57 - column 46, line 14; figures 23,76 * [Y] 8-10;
 [X]US5252853  (MICHII KAZUNARI [JP]) [X] 1,21,23,24 * column 3, line 50 - column 4, line 2; figures 2,3 *;
 [A]US5406028  (BENG LIM T [SG], et al) [A] 1-6 * column 5, line 1 - line 14; figures 11,12 *
 [YA]  - PATENT ABSTRACTS OF JAPAN, (19940805), vol. 018, no. 419, Database accession no. (E - 1589), & JP06132339 A 19940513 (MITSUBISHI ELECTRIC CORP) [Y] 8-10 * abstract * [A] 1
 [A]  - PATENT ABSTRACTS OF JAPAN, (19830618), vol. 0071, no. 40, Database accession no. (E - 182), & JP58054644 A 19830331 (NIPPON DENKI KK) [A] 9,10 * the whole document *
 [PX]  - PATENT ABSTRACTS OF JAPAN, (19960430), vol. 1996, no. 04, & JP07335818 A 19951222 (NITTETSU SEMICONDUCTOR KK) [PX] 1,21,23,24 * abstract *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19930928), vol. 017, no. 538, Database accession no. (E - 1440), & JP05152495 A 19930618 (HITACHI LTD) [A] 1,20,22-24 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19930326), vol. 017, no. 156, Database accession no. (E - 1341), & JP04320390 A 19921111 (HITACHI LTD) [A] 1-6,21,23,24 * the whole document *
 [A]  - PATENT ABSTRACTS OF JAPAN, (19920527), vol. 016, no. 230, Database accession no. (E - 1208), & JP04044347 A 19920214 (HITACHI LTD) [A] 1,19,20 * the whole document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.