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EP1394856
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EP About this file: EP1394856
| EP1394856 - Surface-mounted electronic component module and method for manufacturing the same [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.12.2011 Database last updated on 28.05.2024 | Most recent event Tooltip | 09.12.2011 | Application deemed to be withdrawn | published on 11.01.2012 [2012/02] | Applicant(s) | For all designated states Taiyo Yuden Co., Ltd. 16-20, Ueno 6-chome Taito-ku Tokyo / JP | [2010/48] |
| Former [2004/10] | For all designated states Fujitsu Media Devices Limited 3-12, Shin-Yokohama 2-chome, Kohoku-ku Yokohama-shi, Kanagawa 222-0033 / JP | Inventor(s) | 01 /
Furukawa, Osamu Fujitsu Media Devices Ltd. 2-3-12 Shin-yokohama Kohoku-ku Yokohama-shi Kanagawa 222-0033 / JP | 02 /
Murata, Toshihiko Fujitsu Media Devices Ltd. 2-3-12 Shin-yokohama Kohoku-ku Yokohama-shi Kanagawa 222-0033 / JP | 03 /
Ikata, Osamu Fujitsu Media Devices Ltd. 2-3-12 Shin-yokohama Kohoku-ku Yokohama-shi Kanagawa 222-0033 / JP | [2004/10] | Representative(s) | Stebbing, Timothy Charles Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH / GB | [N/P] |
| Former [2004/10] | Stebbing, Timothy Charles Haseltine Lake & Co., Imperial House, 15-19 Kingsway London WC2B 6UD / GB | Application number, filing date | 03255207.7 | 22.08.2003 | [2004/10] | Priority number, date | JP20020251257 | 29.08.2002 Original published format: JP 2002251257 | [2004/10] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1394856 | Date: | 03.03.2004 | Language: | EN | [2004/10] | Type: | A3 Search report | No.: | EP1394856 | Date: | 31.08.2005 | [2005/35] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 14.07.2005 | Classification | IPC: | H01L25/065, H03H9/05 | [2005/35] | CPC: |
H01L25/50 (EP,US);
H01L24/97 (EP,US);
H01L25/0655 (EP,US);
H01L25/165 (EP,US);
H01L2224/05554 (EP,US);
H01L2224/16 (EP,US);
H01L2224/32225 (EP,US);
H01L2224/45015 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/48137 (EP,US);
H01L2224/48195 (EP,US);
H01L2224/49171 (EP);
H01L2224/73265 (EP,US);
H01L2224/92247 (EP,US);
H01L2224/97 (EP,US);
H01L24/45 (EP,US);
H01L2924/00014 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01014 (EP,US);
H01L2924/01028 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US);
H01L2924/01046 (EP,US);
H01L2924/01047 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/07802 (EP,US);
H01L2924/10329 (EP,US);
H01L2924/15787 (EP,US);
H01L2924/181 (EP,US);
H01L2924/19041 (EP,US);
H01L2924/19042 (EP,US);
| C-Set: |
H01L2224/45015, H01L2924/20753 (US,EP);
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/97, H01L2224/73265 (EP,US);
H01L2224/97, H01L2224/83 (EP,US);
H01L2224/97, H01L2224/85 (EP,US);
H01L2224/97, H01L2224/92247 (EP,US);
H01L2924/00014, H01L2224/0401 (US,EP);
H01L2924/07802, H01L2924/00 (EP,US); |
| Former IPC [2004/10] | H01L25/065 | Designated contracting states | DE, FR, GB [2006/20] |
| Former [2004/10] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Oberflächenmontiertes, elektronisches Komponenten-Modul und seine Herstellungsmethode | [2004/10] | English: | Surface-mounted electronic component module and method for manufacturing the same | [2004/10] | French: | Module de composants électroniques montés sur surface et méthode de fabrication associée | [2004/10] | Examination procedure | 09.01.2006 | Amendment by applicant (claims and/or description) | 22.02.2006 | Examination requested [2006/16] | 18.12.2007 | Despatch of a communication from the examining division (Time limit: M06) | 18.06.2008 | Reply to a communication from the examining division | 07.03.2011 | Despatch of a communication from the examining division (Time limit: M04) | 19.07.2011 | Application deemed to be withdrawn, date of legal effect [2012/02] | 22.08.2011 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2012/02] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 18.12.2007 | Fees paid | Renewal fee | 30.08.2005 | Renewal fee patent year 03 | 29.08.2006 | Renewal fee patent year 04 | 30.08.2007 | Renewal fee patent year 05 | 29.08.2008 | Renewal fee patent year 06 | 27.08.2009 | Renewal fee patent year 07 | 27.08.2010 | Renewal fee patent year 08 | Penalty fee | Additional fee for renewal fee | 31.08.2011 | 09 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JP2001352011 ; | [Y]JP2002217673 ; | [A]US5999065 (FURUTANI KOJI [JP], et al) [A] 9,10* the whole document *; | [A]US2002030573 (MORI NAOYA [JP], et al) [A] 9,10 * the whole document *; | [Y]US2002097094 (WANG NANLEI LARRY [US], et al) [Y] 5-10 * the whole document *; | [X] - HASSAN HASHEMI ET AL, "A MIXED SOLDER GRID ARRAY AND PERIPHERAL LEADED MCM PACKAGE", PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. ORLANDO, JUNE 1 - 4, 1993, NEW YORK, IEEE, US, (19930601), vol. CONF. 43, ISSN 0569-5503, pages 951 - 956, XP000380096 [X] 1-4 * figures 1-5 * | [X] - PATENT ABSTRACTS OF JAPAN, (20020804), vol. 2002, no. 04, & JP2001352011 A 20011221 (MATSUSHITA ELECTRIC IND CO LTD) [X] 1-5 * abstract * | [Y] - PATENT ABSTRACTS OF JAPAN, (20021212), vol. 2002, no. 12, & JP2002217673 A 20020802 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 5-10 * the whole document * | Examination | JPS61127220 | JPS61230512 | JPH06164309 | US5559481 | JPH0993077 | JPH09162676 |