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Extract from the Register of European Patents

EP About this file: EP1418617

EP1418617 - Semiconductor device and method of manufacturing the same [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  04.09.2009
Database last updated on 11.09.2024
Most recent event   Tooltip04.09.2009No opposition filed within time limitpublished on 07.10.2009  [2009/41]
Applicant(s)For all designated states
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80 Oshimada-machi
Nagano-shi, Nagano 381-2287 / JP
[2007/06]
Former [2004/20]For all designated states
Shinko Electric Co. Ltd.
80 Oshimada-machi
Nagano-shi, Nagano 381-2287 / JP
Inventor(s)01 / Sunohara, Masahiro
Shinko Electric Ind. Co.,Ltd. 80, Oshimada-machi
Nagano-shi Nagano 381-2287 / JP
 [2004/20]
Representative(s)Hitching, Peter Matthew
Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London
WC1V 7JH / GB
[N/P]
Former [2008/41]Hitching, Peter Matthew
Haseltine Lake Lincoln House 300 High Holborn London
WC1V 7JH / GB
Former [2004/20]Hitching, Peter Matthew
Haseltine Lake, Imperial House, 15-19 Kingsway
London WC2B 6UD / GB
Application number, filing date03256994.905.11.2003
[2004/20]
Priority number, dateJP2002032098005.11.2002         Original published format: JP 2002320980
[2004/20]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP1418617
Date:12.05.2004
Language:EN
[2004/20]
Type: A3 Search report 
No.:EP1418617
Date:26.05.2004
[2004/22]
Type: B1 Patent specification 
No.:EP1418617
Date:29.10.2008
Language:EN
[2008/44]
Search report(s)(Supplementary) European search report - dispatched on:EP15.04.2004
ClassificationIPC:H01L21/60, H01L23/538, H01L25/065, H01L21/768, H01L23/48
[2004/22]
CPC:
H01L25/50 (EP,US); H01L23/48 (KR); H01L21/304 (EP,US);
H01L21/31058 (EP,US); H01L21/6835 (EP,US); H01L21/76898 (EP,US);
H01L23/481 (EP,US); H01L23/5389 (EP,US); H01L24/19 (EP,US);
H01L24/24 (EP,US); H01L24/82 (EP,US); H01L24/92 (EP);
H01L24/97 (EP,US); H01L25/0657 (EP,US); H01L21/568 (EP,US);
H01L2221/68345 (EP,US); H01L2224/0231 (EP); H01L2224/02372 (EP);
H01L2224/04105 (EP,US); H01L2224/05548 (EP); H01L2224/05568 (EP,US);
H01L2224/05573 (EP,US); H01L2224/09181 (EP); H01L2224/11003 (EP,US);
H01L2224/12105 (EP,US); H01L2224/16 (US); H01L2224/16145 (EP);
H01L2224/16235 (EP); H01L2224/24011 (EP); H01L2224/24105 (EP);
H01L2224/24226 (EP); H01L2224/25171 (EP); H01L2224/26135 (EP);
H01L2224/73204 (EP); H01L2224/73259 (EP,US); H01L2224/81005 (EP,US);
H01L2224/81801 (EP,US); H01L2224/82005 (EP,US); H01L2224/9202 (EP);
H01L2224/92224 (EP,US); H01L2224/97 (EP,US); H01L2225/06524 (EP,US);
H01L2225/06541 (EP,US); H01L24/02 (EP); H01L24/03 (EP);
H01L24/05 (EP); H01L24/81 (EP); H01L2924/0001 (EP);
H01L2924/00014 (EP,US); H01L2924/01004 (EP,US); H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US);
H01L2924/01019 (EP,US); H01L2924/01023 (EP,US); H01L2924/01029 (EP,US);
H01L2924/01033 (EP,US); H01L2924/01058 (EP,US); H01L2924/01073 (EP,US);
H01L2924/01077 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US); H01L2924/014 (EP,US); H01L2924/04941 (EP,US);
H01L2924/04953 (EP,US); H01L2924/09701 (EP,US); H01L2924/10253 (EP,US);
H01L2924/12042 (EP,US); H01L2924/15311 (EP,US); H01L2924/15787 (EP,US);
H01L2924/19041 (EP,US); H01L2924/19043 (EP,US); H01L2924/30105 (EP,US) (-)
C-Set:
H01L2224/9202, H01L2224/81, H01L21/76898 (EP);
H01L2224/97, H01L2224/81 (EP);
H01L2224/97, H01L2224/82 (US,EP);
H01L2224/97, H01L2924/15311 (US,EP);
H01L2924/00014, H01L2224/05599 (EP,US);
H01L2924/0001, H01L2224/02 (EP);
H01L2924/10253, H01L2924/00 (US,EP);
H01L2924/12042, H01L2924/00 (EP,US);
H01L2924/15787, H01L2924/00 (US,EP)
(-)
Former IPC [2004/20]H01L21/60
Designated contracting statesDE [2005/07]
Former [2004/20]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:Halbleiterbauelement und Verfahren zu dessen Herstellung[2004/20]
English:Semiconductor device and method of manufacturing the same[2004/20]
French:Composant semiconducteur et méthode de fabrication correspondante[2004/20]
Examination procedure14.07.2004Examination requested  [2004/38]
21.01.2005Despatch of a communication from the examining division (Time limit: M04)
02.05.2005Reply to a communication from the examining division
03.08.2006Despatch of a communication from the examining division (Time limit: M04)
20.11.2006Reply to a communication from the examining division
07.03.2008Communication of intention to grant the patent
02.07.2008Fee for grant paid
02.07.2008Fee for publishing/printing paid
10.09.2008Despatch of a communication from the examining division (Time limit: M01)
17.09.2008Reply to a communication from the examining division
Divisional application(s)EP06124616.1  / EP1801866
Opposition(s)30.07.2009No opposition filed within time limit [2009/41]
Fees paidRenewal fee
14.11.2005Renewal fee patent year 03
13.11.2006Renewal fee patent year 04
16.11.2007Renewal fee patent year 05
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Documents cited:Search[DA]JP2000323645  ;
 [X]EP1094511  (LUCENT TECHNOLOGIES INC [US]) [X] 1,2,16 * the whole document *;
 [DA]US2001004130  (HIGASHI MITSUTOSHI [JP], et al) [DA] 8-23 * the whole document *;
 [DA]US2001008794  (AKAGAWA MASATOSHI [JP]) [DA] 8-23 * the whole document *;
 [XA]EP1137066  (SHINKO ELECTRIC IND CO [JP]) [X] 1-3 * the whole document * [A] 8-23;
 [XA]EP1154474  (ROHM CO LTD [JP]) [X] 1-3,16 * paragraphs [0102] - [0108]; figures 11A-11F * * paragraphs [0111] , [0112]; figures 13,15 * [A] 8-15,17-23;
 [XA]EP1189272  (MATSUSHITA ELECTRIC IND CO LTD [JP]) [X] 1-3,16 * paragraphs [0075] - [0087]; figures 2A-2F,3A,3B * [A] 13-15,21-23;
 [X]EP1189273  (SHINKO ELECTRIC IND CO [JP]) [X] 1-3 * paragraphs [0060] - [0063]; figure 8 *;
 [A]US2002127839  (UMETSU KAZUSHIGE [JP], et al) [A] 4-7,10-23 * paragraphs [0114] - [0121] - [0143] , [0144] , [0153] , [0178]; figures 1-4,10 *;
 [A]EP1248295  (SHINKO ELECTRIC IND CO [JP]) [A] 4-7,10-23 * paragraphs [0022] - [0033]; figures 2-7 *
 [DA]  - PATENT ABSTRACTS OF JAPAN, (20010305), vol. 2000, no. 14, & JP2000323645 A 20001124 (SHINKO ELECTRIC IND CO LTD) [DA] 8-23 * abstract *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.