-
EP1376666
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP1376666
| EP1376666 - Method of machining silicon wafer [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 20.01.2006 Database last updated on 13.07.2024 | Most recent event Tooltip | 20.01.2006 | Application deemed to be withdrawn | published on 08.03.2006 [2006/10] | Applicant(s) | For all designated states SHINKO ELECTRIC INDUSTRIES CO., LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 / JP | [N/P] |
| Former [2004/13] | For all designated states SHINKO ELECTRIC INDUSTRIES CO., LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi, NAGANO 380-0921 / JP | ||
| Former [2004/01] | For all designated states SHINKO ELECTRIC INDUSTRIES CO. LTD. 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 / JP | Inventor(s) | 01 /
Mashino, Naohiro, c/o Shinko Electric Industries Co., Ltd., 711, Aza Shariden, Oaza Kurita Nagano-shi, Nagano 380-0921 / JP | [2004/01] | Representative(s) | Quantin, Bruno Marie Henri Santarelli 14, avenue de la Grande Armée 75017 Paris / FR | [N/P] |
| Former [2004/01] | Quantin, Bruno Santarelli, 14 Avenue de la Grande Armée 75017 Paris / FR | Application number, filing date | 03291383.2 | 11.06.2003 | [2004/01] | Priority number, date | JP20020177430 | 18.06.2002 Original published format: JP 2002177430 | [2004/01] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1376666 | Date: | 02.01.2004 | Language: | EN | [2004/01] | Type: | A3 Search report | No.: | EP1376666 | Date: | 13.10.2004 | [2004/42] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.08.2004 | Classification | IPC: | H01L21/304, B24B7/22, B24B41/06 | [2004/42] | CPC: |
H01L21/6835 (EP,US);
H01L21/302 (KR);
H01L21/6836 (EP,US);
H01L21/6838 (EP,US);
H01L2221/68327 (EP,US);
H01L2221/6834 (EP,US)
|
| Former IPC [2004/01] | H01L21/304 | Designated contracting states | (deleted) [2005/27] |
| Former [2004/01] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | Verfahren zur Bearbeitung von einem Siliziumwafer | [2004/01] | English: | Method of machining silicon wafer | [2004/01] | French: | Procédé d'usinage d'une tranche de silicium | [2004/01] | Examination procedure | 14.04.2005 | Application deemed to be withdrawn, date of legal effect [2006/10] | 29.08.2005 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2006/10] | Fees paid | Penalty fee | Penalty fee Rule 85a EPC 1973 | 23.05.2005 | AT M01 Not yet paid | 23.05.2005 | BE M01 Not yet paid | 23.05.2005 | BG M01 Not yet paid | 23.05.2005 | CH M01 Not yet paid | 23.05.2005 | CY M01 Not yet paid | 23.05.2005 | CZ M01 Not yet paid | 23.05.2005 | DE M01 Not yet paid | 23.05.2005 | DK M01 Not yet paid | 23.05.2005 | EE M01 Not yet paid | 23.05.2005 | ES M01 Not yet paid | 23.05.2005 | FI M01 Not yet paid | 23.05.2005 | FR M01 Not yet paid | 23.05.2005 | GB M01 Not yet paid | 23.05.2005 | GR M01 Not yet paid | 23.05.2005 | HU M01 Not yet paid | 23.05.2005 | IE M01 Not yet paid | 23.05.2005 | IT M01 Not yet paid | 23.05.2005 | LU M01 Not yet paid | 23.05.2005 | MC M01 Not yet paid | 23.05.2005 | NL M01 Not yet paid | 23.05.2005 | PT M01 Not yet paid | 23.05.2005 | RO M01 Not yet paid | 23.05.2005 | SE M01 Not yet paid | 23.05.2005 | SI M01 Not yet paid | 23.05.2005 | SK M01 Not yet paid | 23.05.2005 | TR M01 Not yet paid | Penalty fee Rule 85b EPC 1973 | 23.05.2005 | M01 Not yet paid | Additional fee for renewal fee | 30.06.2005 | 03 M06 Not yet paid |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [D]JPS62154614 ; | [Y]US4597228 (KOYAMA ISAO [JP], et al) [Y] 2-4 * abstract *; | [XY]US5087307 (NOMURA TAKEHIKO [JP], et al) [X] 1 * column 3, line 23 - column 5, line 13; figure - * [Y] 2-4; | [A]EP0850723 (SHINETSU HANDOTAI KK [JP]) [A] 2-4 * abstract * | [D] - PATENT ABSTRACTS OF JAPAN, (19871219), vol. 0113, no. 90, Database accession no. (E - 567), & JP62154614 A 19870709 (TOSHIBA CORP) [D] * abstract * |