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EP About this file: EP1353365

EP1353365 - Pre-cleaning of copper surfaces during Cu/Cu or Cu/Metal bonding using hydrogen plasma [Right-click to bookmark this link]
Status	The application is deemed to be withdrawn Status updated on 21.09.2007 Database last updated on 03.09.2024
Most recent event Tooltip	21.09.2007	Application deemed to be withdrawn	published on 24.10.2007 [2007/43]
Applicant(s)	For all designated states Chartered Semiconductor Manufacturing Pte Ltd. 60 Woodlands Industrial Estate Park D, Street 2 Singapore 738406 / SG
	[N/P]
Former [2003/42]	For all designated states Chartered Semiconductor Manufacturing Pte Ltd. 60 Woodlands Industrial Estate Park D, Street 2 Singapore 738406 / SG
Inventor(s)	01 / Sudijono, John Leonard 90 Hillview Drive, No. 05-06 Singapore / SG
	02 / Aliyu, Yakub 100 Cashew Crescent Singapore 679831 / SG
	03 / Zhou, Mei Sheng 109 Clementi Road, No. 08-03 Singapore 129791 / SG
	04 / Chooi, Simon 6 Lotus Avenue Singapore 277596 / SG
	05 / Gupta, Subhash 5 Toh Heights Singapore 507806 / SG
	06 / Roy, Sudipto Ranendra 53B Grange Road, No. 13-02, Spring Grove Singapore 249567 / SG
	07 / Ho, Paul Kwok Keung Blk 217, Bishan St. 23, No. 16-315 Singapore 570217 / SG
	08 / Xu, Yi Blk 251, No.09-374, Bangkit Road Singapore 670251 / SG
	[2003/42]
Representative(s)	Schuffenecker, Thierry 120 Chemin de la Maure 06800 Cagnes-sur-Mer / FR
	[N/P]
Former [2003/42]	Schuffenecker, Thierry 97, chemin de Cassiopée, Domaine de l'étoile 06610 La Gaude / FR
Application number, filing date	03392004.2	27.03.2003
	[2003/42]
Priority number, date	US20020120836	11.04.2002 Original published format: US 120836
	[2003/42]
Filing language	EN
Procedural language	EN
Publication	Type:	A2 Application without search report
	No.:	EP1353365
	Date:	15.10.2003
	Language:	EN
	[2003/42]
	Type:	A3 Search report
	No.:	EP1353365
	Date:	02.08.2006
	[2006/31]
Search report(s)	(Supplementary) European search report - dispatched on:	EP	05.07.2006
Classification	IPC:	H01L21/60, H01L21/311, H01L23/485	[2003/42]
	CPC:	H01L24/05 (EP,US); C23G5/00 (EP,US); H01L21/32136 (EP,US); H01L23/4824 (EP,US); H01L24/03 (EP,US); H01L24/48 (EP,US); (+) H01L24/85 (EP,US); H01L21/02046 (EP,US); H01L2224/04042 (EP,US); H01L2224/05001 (EP,US); H01L2224/05073 (EP,US); H01L2224/05118 (EP,US); H01L2224/05124 (EP,US); H01L2224/05155 (EP,US); H01L2224/05166 (EP,US); H01L2224/05556 (EP,US); H01L2224/05624 (EP,US); H01L2224/05644 (EP,US); H01L2224/05647 (EP,US); H01L2224/45124 (EP,US); H01L2224/45144 (EP,US); H01L2224/45147 (EP,US); H01L2224/48091 (EP,US); H01L2224/4813 (EP,US); H01L2224/4846 (EP,US); H01L2224/48463 (EP,US); H01L2224/4847 (EP,US); H01L2224/48624 (EP,US); H01L2224/48644 (EP,US); H01L2224/48647 (EP,US); H01L2224/48724 (EP,US); H01L2224/48747 (EP,US); H01L2224/48824 (EP,US); H01L2224/48844 (EP,US); H01L2224/48847 (EP,US); H01L2224/49111 (EP,US); H01L2224/85013 (EP,US); H01L2224/85201 (EP,US); H01L2224/85203 (EP,US); H01L2224/85205 (EP,US); H01L24/45 (EP,US); H01L24/49 (EP,US); H01L2924/01005 (EP,US); H01L2924/01006 (EP,US); H01L2924/01007 (EP,US); H01L2924/01013 (EP,US); H01L2924/01015 (EP,US); H01L2924/01018 (EP,US); H01L2924/01022 (EP,US); H01L2924/01028 (EP,US); H01L2924/01029 (EP,US); H01L2924/0103 (EP,US); H01L2924/01074 (EP,US); H01L2924/01075 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US); H01L2924/01327 (EP,US); H01L2924/05042 (EP,US); H01L2924/13055 (EP,US); H01L2924/13091 (EP,US); H01L2924/14 (EP,US); H01L2924/19042 (EP,US); H01L2924/19043 (EP,US) (-)
	C-Set:	H01L2224/05001, H01L2924/00014 (US,EP); H01L2224/05624, H01L2924/01029 (US,EP); H01L2224/05647, H01L2924/01013 (US,EP); H01L2224/45124, H01L2924/00014 (US,EP); (+) H01L2224/45144, H01L2924/00014 (US,EP); H01L2224/45147, H01L2924/00014 (US,EP); H01L2224/45147, H01L2924/00015 (US,EP); H01L2224/48091, H01L2924/00014 (US,EP); H01L2224/48624, H01L2924/00 (US,EP); H01L2224/48644, H01L2924/00 (US,EP); H01L2224/48647, H01L2924/00 (US,EP); H01L2224/48724, H01L2924/00 (US,EP); H01L2224/48744, H01L2924/00 (EP,US); H01L2224/48747, H01L2924/00 (EP,US); H01L2224/48824, H01L2924/00 (EP,US); H01L2224/48844, H01L2924/00 (US,EP); H01L2224/48847, H01L2924/00 (EP,US); H01L2224/49111, H01L2224/48463, H01L2924/00 (US,EP); H01L2224/49111, H01L2224/4847, H01L2924/00 (US,EP); H01L2224/85203, H01L2924/00 (US,EP); H01L2224/85205, H01L2224/45124, H01L2924/00 (EP,US); H01L2224/85205, H01L2224/45144, H01L2924/00 (EP,US); H01L2224/85205, H01L2224/45147, H01L2924/00 (EP,US) (-)
Designated contracting states	[2007/15]
Former [2003/42]	AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, SE, SI, SK, TR
Title	German:	Verfahren zum Reinigen von Kupferoberflächen mittels Wasserstoffplasma während des Cu/Cu oder Cu/Metall Bondvorganges	[2003/42]
	English:	Pre-cleaning of copper surfaces during Cu/Cu or Cu/Metal bonding using hydrogen plasma	[2003/42]
	French:	Procédé de nettoyage de surfaces en cuivre pendant la soudure Cu/Cu ou Cu/Metal au moyen d'un plasma d'hydrogène	[2003/42]
Examination procedure	03.02.2007	Application deemed to be withdrawn, date of legal effect [2007/43]
	05.06.2007	Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2007/43]
Fees paid	Renewal fee
	31.03.2005	Renewal fee patent year 03
	10.08.2006	Renewal fee patent year 04
	Penalty fee
	Penalty fee Rule 85a EPC 1973
	15.03.2007	AT M01 Not yet paid
	15.03.2007	BE M01 Not yet paid
	15.03.2007	CH M01 Not yet paid
	15.03.2007	CY M01 Not yet paid
	15.03.2007	DE M01 Not yet paid
	15.03.2007	DK M01 Not yet paid
	15.03.2007	ES M01 Not yet paid
	15.03.2007	FI M01 Not yet paid
	15.03.2007	FR M01 Not yet paid
	15.03.2007	GB M01 Not yet paid
	15.03.2007	GR M01 Not yet paid
	15.03.2007	IE M01 Not yet paid
	15.03.2007	IT M01 Not yet paid
	15.03.2007	LU M01 Not yet paid
	15.03.2007	MC M01 Not yet paid
	15.03.2007	NL M01 Not yet paid
	15.03.2007	PT M01 Not yet paid
	15.03.2007	SE M01 Not yet paid
	15.03.2007	TR M01 Not yet paid
	Penalty fee Rule 85b EPC 1973
	15.03.2007	M01 Not yet paid
	Additional fee for renewal fee
	31.03.2006	04 M06 Fee paid on 10.08.2006
	31.03.2007	05 M06 Not yet paid
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:	Search	[XA]JPH1167702 ;
		[XA]JPH04116837 ;
		[XY]JPH11204828 ;
		[A]US6309959 (WANG PIN-CHIN C [US], et al) [A] 1-9 * abstract * * column 7, line 33 - column 8, line 9 *;
		[Y]US2001049181 (RATHI SUDHA [US], et al) [Y] 1,3-5 * abstract * * paragraph [0022] - paragraph [0042] *;
		[A]US6333248 (KISHIMOTO KOJI [JP]) [A] 1-9 * abstract ** column 7, line 4 - line 44 *
		[XA] - PATENT ABSTRACTS OF JAPAN, (19990630), vol. 1999, no. 08, & JP11067702 A 19990309 (MITSUBISHI ELECTRIC CORP) [X] 1,4,6 * abstract * * paragraph [0022] * [A] 2,3,5,7-9
		[XA] - PATENT ABSTRACTS OF JAPAN, (19920807), vol. 016, no. 367, Database accession no. (E - 1245), & JP04116837 A 19920417 (MATSUSHITA ELECTRIC IND CO LTD) [X] 1,6 * abstract * [A] 2-5,7-9
		[XY] - PATENT ABSTRACTS OF JAPAN, (19991029), vol. 1999, no. 12, & JP11204828 A 19990730 (MATSUSHITA ELECTRON CORP) [X] 1,2,4,6 * abstract * [Y] 1,3-5

The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.

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