EP1353365 - Pre-cleaning of copper surfaces during Cu/Cu or Cu/Metal bonding using hydrogen plasma [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 21.09.2007 Database last updated on 03.09.2024 | Most recent event Tooltip | 21.09.2007 | Application deemed to be withdrawn | published on 24.10.2007 [2007/43] | Applicant(s) | For all designated states Chartered Semiconductor Manufacturing Pte Ltd. 60 Woodlands Industrial Estate Park D, Street 2 Singapore 738406 / SG | [N/P] |
Former [2003/42] | For all designated states Chartered Semiconductor Manufacturing Pte Ltd. 60 Woodlands Industrial Estate Park D, Street 2 Singapore 738406 / SG | Inventor(s) | 01 /
Sudijono, John Leonard 90 Hillview Drive, No. 05-06 Singapore / SG | 02 /
Aliyu, Yakub 100 Cashew Crescent Singapore 679831 / SG | 03 /
Zhou, Mei Sheng 109 Clementi Road, No. 08-03 Singapore 129791 / SG | 04 /
Chooi, Simon 6 Lotus Avenue Singapore 277596 / SG | 05 /
Gupta, Subhash 5 Toh Heights Singapore 507806 / SG | 06 /
Roy, Sudipto Ranendra 53B Grange Road, No. 13-02, Spring Grove Singapore 249567 / SG | 07 /
Ho, Paul Kwok Keung Blk 217, Bishan St. 23, No. 16-315 Singapore 570217 / SG | 08 /
Xu, Yi Blk 251, No.09-374, Bangkit Road Singapore 670251 / SG | [2003/42] | Representative(s) | Schuffenecker, Thierry 120 Chemin de la Maure 06800 Cagnes-sur-Mer / FR | [N/P] |
Former [2003/42] | Schuffenecker, Thierry 97, chemin de Cassiopée, Domaine de l'étoile 06610 La Gaude / FR | Application number, filing date | 03392004.2 | 27.03.2003 | [2003/42] | Priority number, date | US20020120836 | 11.04.2002 Original published format: US 120836 | [2003/42] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP1353365 | Date: | 15.10.2003 | Language: | EN | [2003/42] | Type: | A3 Search report | No.: | EP1353365 | Date: | 02.08.2006 | [2006/31] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 05.07.2006 | Classification | IPC: | H01L21/60, H01L21/311, H01L23/485 | [2003/42] | CPC: |
H01L24/05 (EP,US);
C23G5/00 (EP,US);
H01L21/32136 (EP,US);
H01L23/4824 (EP,US);
H01L24/03 (EP,US);
H01L24/48 (EP,US);
H01L24/85 (EP,US);
H01L21/02046 (EP,US);
H01L2224/04042 (EP,US);
H01L2224/05001 (EP,US);
H01L2224/05073 (EP,US);
H01L2224/05118 (EP,US);
H01L2224/05124 (EP,US);
H01L2224/05155 (EP,US);
H01L2224/05166 (EP,US);
H01L2224/05556 (EP,US);
H01L2224/05624 (EP,US);
H01L2224/05644 (EP,US);
H01L2224/05647 (EP,US);
H01L2224/45124 (EP,US);
H01L2224/45144 (EP,US);
H01L2224/45147 (EP,US);
H01L2224/48091 (EP,US);
H01L2224/4813 (EP,US);
H01L2224/4846 (EP,US);
H01L2224/48463 (EP,US);
H01L2224/4847 (EP,US);
H01L2224/48624 (EP,US);
H01L2224/48644 (EP,US);
H01L2224/48647 (EP,US);
H01L2224/48724 (EP,US);
H01L2224/48747 (EP,US);
H01L2224/48824 (EP,US);
H01L2224/48844 (EP,US);
H01L2224/48847 (EP,US);
H01L2224/49111 (EP,US);
H01L2224/85013 (EP,US);
H01L2224/85201 (EP,US);
H01L2224/85203 (EP,US);
H01L2224/85205 (EP,US);
H01L24/45 (EP,US);
H01L24/49 (EP,US);
H01L2924/01005 (EP,US);
H01L2924/01006 (EP,US);
H01L2924/01007 (EP,US);
H01L2924/01013 (EP,US);
H01L2924/01015 (EP,US);
H01L2924/01018 (EP,US);
H01L2924/01022 (EP,US);
H01L2924/01028 (EP,US);
H01L2924/01029 (EP,US);
H01L2924/0103 (EP,US);
H01L2924/01074 (EP,US);
H01L2924/01075 (EP,US);
H01L2924/01078 (EP,US);
H01L2924/01079 (EP,US);
H01L2924/01327 (EP,US);
H01L2924/05042 (EP,US);
H01L2924/13055 (EP,US);
H01L2924/13091 (EP,US);
| C-Set: |
H01L2224/05001, H01L2924/00014 (US,EP);
H01L2224/05624, H01L2924/01029 (US,EP);
H01L2224/05647, H01L2924/01013 (US,EP);
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/45147, H01L2924/00014 (US,EP);
H01L2224/45147, H01L2924/00015 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/48624, H01L2924/00 (US,EP);
H01L2224/48644, H01L2924/00 (US,EP);
H01L2224/48647, H01L2924/00 (US,EP);
H01L2224/48724, H01L2924/00 (US,EP);
H01L2224/48744, H01L2924/00 (EP,US);
H01L2224/48747, H01L2924/00 (EP,US);
H01L2224/48824, H01L2924/00 (EP,US);
H01L2224/48844, H01L2924/00 (US,EP);
H01L2224/48847, H01L2924/00 (EP,US);
H01L2224/49111, H01L2224/48463, H01L2924/00 (US,EP);
H01L2224/49111, H01L2224/4847, H01L2924/00 (US,EP);
H01L2224/85203, H01L2924/00 (US,EP);
H01L2224/85205, H01L2224/45124, H01L2924/00 (EP,US);
H01L2224/85205, H01L2224/45144, H01L2924/00 (EP,US); | Designated contracting states | [2007/15] |
Former [2003/42] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, SE, SI, SK, TR | Title | German: | Verfahren zum Reinigen von Kupferoberflächen mittels Wasserstoffplasma während des Cu/Cu oder Cu/Metall Bondvorganges | [2003/42] | English: | Pre-cleaning of copper surfaces during Cu/Cu or Cu/Metal bonding using hydrogen plasma | [2003/42] | French: | Procédé de nettoyage de surfaces en cuivre pendant la soudure Cu/Cu ou Cu/Metal au moyen d'un plasma d'hydrogène | [2003/42] | Examination procedure | 03.02.2007 | Application deemed to be withdrawn, date of legal effect [2007/43] | 05.06.2007 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2007/43] | Fees paid | Renewal fee | 31.03.2005 | Renewal fee patent year 03 | 10.08.2006 | Renewal fee patent year 04 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 15.03.2007 | AT   M01   Not yet paid | 15.03.2007 | BE   M01   Not yet paid | 15.03.2007 | CH   M01   Not yet paid | 15.03.2007 | CY   M01   Not yet paid | 15.03.2007 | DE   M01   Not yet paid | 15.03.2007 | DK   M01   Not yet paid | 15.03.2007 | ES   M01   Not yet paid | 15.03.2007 | FI   M01   Not yet paid | 15.03.2007 | FR   M01   Not yet paid | 15.03.2007 | GB   M01   Not yet paid | 15.03.2007 | GR   M01   Not yet paid | 15.03.2007 | IE   M01   Not yet paid | 15.03.2007 | IT   M01   Not yet paid | 15.03.2007 | LU   M01   Not yet paid | 15.03.2007 | MC   M01   Not yet paid | 15.03.2007 | NL   M01   Not yet paid | 15.03.2007 | PT   M01   Not yet paid | 15.03.2007 | SE   M01   Not yet paid | 15.03.2007 | TR   M01   Not yet paid | Penalty fee Rule 85b EPC 1973 | 15.03.2007 | M01   Not yet paid | Additional fee for renewal fee | 31.03.2006 | 04   M06   Fee paid on   10.08.2006 | 31.03.2007 | 05   M06   Not yet paid |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XA]JPH1167702 ; | [XA]JPH04116837 ; | [XY]JPH11204828 ; | [A]US6309959 (WANG PIN-CHIN C [US], et al) [A] 1-9 * abstract * * column 7, line 33 - column 8, line 9 *; | [Y]US2001049181 (RATHI SUDHA [US], et al) [Y] 1,3-5 * abstract * * paragraph [0022] - paragraph [0042] *; | [A]US6333248 (KISHIMOTO KOJI [JP]) [A] 1-9 * abstract ** column 7, line 4 - line 44 * | [XA] - PATENT ABSTRACTS OF JAPAN, (19990630), vol. 1999, no. 08, & JP11067702 A 19990309 (MITSUBISHI ELECTRIC CORP) [X] 1,4,6 * abstract * * paragraph [0022] * [A] 2,3,5,7-9 | [XA] - PATENT ABSTRACTS OF JAPAN, (19920807), vol. 016, no. 367, Database accession no. (E - 1245), & JP04116837 A 19920417 (MATSUSHITA ELECTRIC IND CO LTD) [X] 1,6 * abstract * [A] 2-5,7-9 | [XY] - PATENT ABSTRACTS OF JAPAN, (19991029), vol. 1999, no. 12, & JP11204828 A 19990730 (MATSUSHITA ELECTRON CORP) [X] 1,2,4,6 * abstract * [Y] 1,3-5 |