blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP1545836

EP1545836 - RETAINING RING FOR HOLDING SEMICONDUCTOR WAFERS IN A CHEMICAL-MECHANICAL POLISHING DEVICE [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  06.08.2010
Database last updated on 03.06.2024
Most recent event   Tooltip06.08.2010Application deemed to be withdrawnpublished on 08.09.2010  [2010/36]
Applicant(s)For all designated states
Ensinger Kunststofftechnologie GbR
Rudolf-Diesel-Strasse 8
71154 Nufringen / DE
[2005/26]
Inventor(s)01 / ENSINGER, Wilfried
Rudolf-Diesel-Strasse 8
71154 Nufringen / DE
 [2005/26]
Representative(s)Wössner, Gottfried
HOEGER, STELLRECHT & PARTNER Patentanwälte
Uhlandstrasse 14 c
70182 Stuttgart / DE
[N/P]
Former [2005/26]Wössner, Gottfried, Dr. Dipl.-Chem.
HOEGER, STELLRECHT & PARTNER Patentanwälte Uhlandstrasse 14c
70182 Stuttgart / DE
Application number, filing date03757898.601.10.2003
[2005/26]
WO2003EP10869
Priority number, dateDE200214717902.10.2002         Original published format: DE 10247179
[2005/26]
Filing languageDE
Procedural languageDE
PublicationType: A1 Application with search report
No.:WO2004033151
Date:22.04.2004
Language:DE
[2004/17]
Type: A1 Application with search report 
No.:EP1545836
Date:29.06.2005
Language:DE
The application published by WIPO in one of the EPO official languages on 22.04.2004 takes the place of the publication of the European patent application.
[2005/26]
Search report(s)International search report - published on:EP22.04.2004
ClassificationIPC:B24B37/04
[2005/26]
CPC:
B24B37/32 (EP,US); H01L21/304 (KR)
Designated contracting statesAT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HU,   IE,   IT,   LI,   LU,   MC,   NL,   PT,   RO,   SE,   SI,   SK,   TR [2005/26]
Extension statesALNot yet paid
LTNot yet paid
LVNot yet paid
MKNot yet paid
TitleGerman:HALTERING ZUM HALTEN VON HALBLEITERWAFERN IN EINER CHEMISCH-MECHANISCHEN POLIERVORRICHTUNG[2005/26]
English:RETAINING RING FOR HOLDING SEMICONDUCTOR WAFERS IN A CHEMICAL-MECHANICAL POLISHING DEVICE[2005/26]
French:ANNEAU DE FIXATION DE PLAQUETTES EN SEMICONDUCTEURS DANS UN DISPOSITIF DE POLISSAGE PAR VOIE CHIMIQUE-MECANIQUE[2005/26]
Entry into regional phase17.02.2005National basic fee paid 
17.02.2005Designation fee(s) paid 
17.02.2005Examination fee paid 
Examination procedure17.02.2005Examination requested  [2005/26]
30.10.2006Despatch of a communication from the examining division (Time limit: M06)
27.04.2007Reply to a communication from the examining division
04.11.2009Communication of intention to grant the patent
16.03.2010Application deemed to be withdrawn, date of legal effect  [2010/36]
20.04.2010Despatch of communication that the application is deemed to be withdrawn, reason: fee for grant / fee for printing not paid in time  [2010/36]
Fees paidRenewal fee
26.10.2005Renewal fee patent year 03
28.10.2006Renewal fee patent year 04
27.10.2007Renewal fee patent year 05
24.10.2008Renewal fee patent year 06
Penalty fee
Additional fee for renewal fee
31.10.200907   M06   Not yet paid
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[XY]US6186880  (GONZALEZ JOSE [US], et al) [X] 1-9,11,13,14 * column 3, line 66 - column 4, line 11 * * column 4, line 48 - column 6, line 37 * * column 7, line 19 - line 30 * * figures 6-8,17,18 * [Y] 19,27;
 [X]EP0841123  (APPLIED MATERIALS INC [US]) [X] 1-3,10 * column 10, line 16 - line 26 * * column 13, line 18 - line 46 * * column 23, line 12 - line 30 * * figures 4B,8A,14B *;
 [X]US6354927  (NATALICIO JOHN [US]) [X] 1,11,12 * column 5, line 22 - line 57 * * figures 1,2 *;
 [DX]US6251215  (ZUNIGA STEVEN M [US], et al) [DX] 1,15,20,24-26 * abstract * * column 5, line 34 - column 6, line 49 * * figure 3 *;
 [Y]US5993302  (CHEN HUNG [US], et al) [Y] 19 * column 5, line 32 - column 6, line 14 * * figures 4,5 *;
 [X]EP0747167  (APPLIED MATERIALS INC [US]) [X] 1,21-23 * column 10, line 23 - column 11, line 21 * * figure 4 *;
 [YA]JP2001121411  ;
 US6585850  [ ] (KENJI SUZUKI [JP], et al)
 [YA]  - PATENT ABSTRACTS OF JAPAN, (20010309), vol. 2000, no. 22, & JP2001121411 A 20010508 (APPLIED MATERIALS INC) [Y] 27 * abstract * [A] 6-8
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.