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Extract from the Register of European Patents

EP About this file: EP1557883

EP1557883 - SOI WAFER AND METHOD FOR MANUFACTURING SOI WAFER [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  08.06.2012
Database last updated on 30.10.2024
Most recent event   Tooltip08.06.2012Application deemed to be withdrawnpublished on 11.07.2012  [2012/28]
Applicant(s)For all designated states
Shin-Etsu Handotai Co., Ltd.
6-2, Ohtemachi 2-chome Chiyoda-ku
Tokyo / JP
[2009/17]
Former [2005/30]For all designated states
Shin-Etsu Handotai Co., Ltd
4-2 Marunouchi 1-chome, Chiyoda-ku
Tokyo 100-0005 / JP
Inventor(s)01 / SAKURADA, M., Shirakawa, Shin-Etsu Handotai Co Ltd
150, Aza Ohira, Oaza Odakura, Nishigo-mura
Nishishirakawa-gun, Fukushima 961-8061 / JP
02 / MITAMURA, N., Shirakawa, Shin-Etsu Handotai Co Ltd
150, Aza Ohira, Oaza Odakura, Nishigo-mura
Nishishirakawa-gun, Fukushima 961-8061 / JP
03 / FUSEGAWA, I., Shirakawa, Shin-Etsu Handotai Co Ltd
150, Aza Ohira, Oaza Odakura, Nishigo-mura
Nishishirakawa-gun, Fukushima 961-8061 / JP
04 / OHTA, T., Shirakawa, Shin-Etsu Handotai Co Ltd
150, Aza Ohira, Oaza Odakura, Nishigo-mura
Nishishirakawa-gun, Fukushima 961-8061 / JP
 [2005/30]
Representative(s)Wibbelmann, Jobst, et al
Wuesthoff & Wuesthoff
Patentanwälte und Rechtsanwalt PartG mbB
Schweigerstrasse 2
81541 München / DE
[N/P]
Former [2010/21]Wibbelmann, Jobst, et al
Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2
81541 München / DE
Former [2005/30]Cooper, John, et al
Murgitroyd & Company 165-169 Scotland Street
Glasgow G5 8PL / GB
Application number, filing date03758888.624.10.2003
[2005/30]
WO2003JP13645
Priority number, dateJP2002031763431.10.2002         Original published format: JP 2002317634
[2005/30]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2004040650
Date:13.05.2004
Language:EN
[2004/20]
Type: A1 Application with search report 
No.:EP1557883
Date:27.07.2005
Language:EN
The application published by WIPO in one of the EPO official languages on 13.05.2004 takes the place of the publication of the European patent application.
[2005/30]
Search report(s)International search report - published on:JP13.05.2004
(Supplementary) European search report - dispatched on:EP26.11.2009
ClassificationIPC:H01L27/12, C30B29/06
[2005/30]
CPC:
C30B15/203 (EP); H01L27/12 (KR); C30B29/06 (EP);
C30B31/00 (EP); C30B31/22 (EP); C30B33/00 (EP);
H01L21/76254 (EP) (-)
Designated contracting statesDE,   FR [2006/08]
Former [2005/30]AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HU,  IE,  IT,  LI,  LU,  MC,  NL,  PT,  RO,  SE,  SI,  SK,  TR 
TitleGerman:SOI-WAFER UND VERFAHREN ZUM HERSTELLEN EINES SOI-WAFERS[2005/30]
English:SOI WAFER AND METHOD FOR MANUFACTURING SOI WAFER[2005/30]
French:PLAQUETTE SOI ET SON PROCEDE DE FABRICATION[2005/30]
Entry into regional phase05.07.2004Translation filed 
15.07.2004National basic fee paid 
15.07.2004Search fee paid 
15.07.2004Designation fee(s) paid 
15.07.2004Examination fee paid 
Examination procedure15.07.2004Examination requested  [2005/30]
26.08.2011Despatch of a communication from the examining division (Time limit: M04)
06.01.2012Application deemed to be withdrawn, date of legal effect  [2012/28]
14.02.2012Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2012/28]
Divisional application(s)The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is  26.08.2011
Fees paidRenewal fee
07.10.2005Renewal fee patent year 03
05.10.2006Renewal fee patent year 04
15.10.2007Renewal fee patent year 05
07.10.2008Renewal fee patent year 06
11.09.2009Renewal fee patent year 07
19.10.2010Renewal fee patent year 08
19.10.2011Renewal fee patent year 09
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Documents cited:Search[Y]EP0955671  (SHINETSU HANDOTAI KK [JP]) [Y] 2-6 * column 12, paragraph 81 - column 14, paragraph 90; figures 1,2 *;
 [A]EP0961312  (CANON KK [JP]) [A] 2-6 * abstract *;
 [XA]US2001000093  (SAKURADA MASAHIRO [JP], et al) [X] 1 * page 2, paragraph 17 - page 3, paragraph 31; figures 1-6c * * page 6; example 1 * [A] 2-6;
 [XY]WO02053812  (SHINETSU HANDOTAI KK [JP], et al) [X] 1 * page 4, line 11 - page 6, line 28; figures 1,4,7; claims 1,2 * [Y] 2-6;
 [PXY]US2003116082  (SAKURADA MASAHIRO [JP], et al) [PX] 1 * page 2, paragraph 14 - page 3, paragraph 27; figures 1,4,7; claims 1,2 *[PY] 2-6
International search[Y]JP2001044398  (MITSUBISHI MATERIAL SILICON);
 [Y]WO0136719  (SHINETSU HANDOTAI KK [JP], et al);
 [Y]WO02053812  (SHINETSU HANDOTAI KK [JP], et al);
 [Y]JP2002226296  (SHINETSU HANDOTAI KK)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.