EP1557883 - SOI WAFER AND METHOD FOR MANUFACTURING SOI WAFER [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 08.06.2012 Database last updated on 30.10.2024 | Most recent event Tooltip | 08.06.2012 | Application deemed to be withdrawn | published on 11.07.2012 [2012/28] | Applicant(s) | For all designated states Shin-Etsu Handotai Co., Ltd. 6-2, Ohtemachi 2-chome Chiyoda-ku Tokyo / JP | [2009/17] |
Former [2005/30] | For all designated states Shin-Etsu Handotai Co., Ltd 4-2 Marunouchi 1-chome, Chiyoda-ku Tokyo 100-0005 / JP | Inventor(s) | 01 /
SAKURADA, M., Shirakawa, Shin-Etsu Handotai Co Ltd 150, Aza Ohira, Oaza Odakura, Nishigo-mura Nishishirakawa-gun, Fukushima 961-8061 / JP | 02 /
MITAMURA, N., Shirakawa, Shin-Etsu Handotai Co Ltd 150, Aza Ohira, Oaza Odakura, Nishigo-mura Nishishirakawa-gun, Fukushima 961-8061 / JP | 03 /
FUSEGAWA, I., Shirakawa, Shin-Etsu Handotai Co Ltd 150, Aza Ohira, Oaza Odakura, Nishigo-mura Nishishirakawa-gun, Fukushima 961-8061 / JP | 04 /
OHTA, T., Shirakawa, Shin-Etsu Handotai Co Ltd 150, Aza Ohira, Oaza Odakura, Nishigo-mura Nishishirakawa-gun, Fukushima 961-8061 / JP | [2005/30] | Representative(s) | Wibbelmann, Jobst, et al Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstrasse 2 81541 München / DE | [N/P] |
Former [2010/21] | Wibbelmann, Jobst, et al Wuesthoff & Wuesthoff Patent- und Rechtsanwälte Schweigerstrasse 2 81541 München / DE | ||
Former [2005/30] | Cooper, John, et al Murgitroyd & Company 165-169 Scotland Street Glasgow G5 8PL / GB | Application number, filing date | 03758888.6 | 24.10.2003 | [2005/30] | WO2003JP13645 | Priority number, date | JP20020317634 | 31.10.2002 Original published format: JP 2002317634 | [2005/30] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2004040650 | Date: | 13.05.2004 | Language: | EN | [2004/20] | Type: | A1 Application with search report | No.: | EP1557883 | Date: | 27.07.2005 | Language: | EN | The application published by WIPO in one of the EPO official languages on 13.05.2004 takes the place of the publication of the European patent application. | [2005/30] | Search report(s) | International search report - published on: | JP | 13.05.2004 | (Supplementary) European search report - dispatched on: | EP | 26.11.2009 | Classification | IPC: | H01L27/12, C30B29/06 | [2005/30] | CPC: |
C30B15/203 (EP);
H01L27/12 (KR);
C30B29/06 (EP);
C30B31/00 (EP);
C30B31/22 (EP);
C30B33/00 (EP);
H01L21/76254 (EP)
(-)
| Designated contracting states | DE, FR [2006/08] |
Former [2005/30] | AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IT, LI, LU, MC, NL, PT, RO, SE, SI, SK, TR | Title | German: | SOI-WAFER UND VERFAHREN ZUM HERSTELLEN EINES SOI-WAFERS | [2005/30] | English: | SOI WAFER AND METHOD FOR MANUFACTURING SOI WAFER | [2005/30] | French: | PLAQUETTE SOI ET SON PROCEDE DE FABRICATION | [2005/30] | Entry into regional phase | 05.07.2004 | Translation filed | 15.07.2004 | National basic fee paid | 15.07.2004 | Search fee paid | 15.07.2004 | Designation fee(s) paid | 15.07.2004 | Examination fee paid | Examination procedure | 15.07.2004 | Examination requested [2005/30] | 26.08.2011 | Despatch of a communication from the examining division (Time limit: M04) | 06.01.2012 | Application deemed to be withdrawn, date of legal effect [2012/28] | 14.02.2012 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2012/28] | Divisional application(s) | The date of the Examining Division's first communication in respect of the earliest application for which a communication has been issued is 26.08.2011 | Fees paid | Renewal fee | 07.10.2005 | Renewal fee patent year 03 | 05.10.2006 | Renewal fee patent year 04 | 15.10.2007 | Renewal fee patent year 05 | 07.10.2008 | Renewal fee patent year 06 | 11.09.2009 | Renewal fee patent year 07 | 19.10.2010 | Renewal fee patent year 08 | 19.10.2011 | Renewal fee patent year 09 |
Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]EP0955671 (SHINETSU HANDOTAI KK [JP]) [Y] 2-6 * column 12, paragraph 81 - column 14, paragraph 90; figures 1,2 *; | [A]EP0961312 (CANON KK [JP]) [A] 2-6 * abstract *; | [XA]US2001000093 (SAKURADA MASAHIRO [JP], et al) [X] 1 * page 2, paragraph 17 - page 3, paragraph 31; figures 1-6c * * page 6; example 1 * [A] 2-6; | [XY]WO02053812 (SHINETSU HANDOTAI KK [JP], et al) [X] 1 * page 4, line 11 - page 6, line 28; figures 1,4,7; claims 1,2 * [Y] 2-6; | [PXY]US2003116082 (SAKURADA MASAHIRO [JP], et al) [PX] 1 * page 2, paragraph 14 - page 3, paragraph 27; figures 1,4,7; claims 1,2 *[PY] 2-6 | International search | [Y]JP2001044398 (MITSUBISHI MATERIAL SILICON); | [Y]WO0136719 (SHINETSU HANDOTAI KK [JP], et al); | [Y]WO02053812 (SHINETSU HANDOTAI KK [JP], et al); | [Y]JP2002226296 (SHINETSU HANDOTAI KK) |